This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry. Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world. The content of this report is based on primary data obtained through interviews, and publicly available information such as corporate financial statements. The report finds that shipment value of the Taiwanese IC packaging and testing industry grew over 14% to stand at US$3.4 billion in the second quarter of 2014. A further uplift is expected in the third quarter to approximately US$3.5 billion. Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications" web site. View the report: Taiwanese IC Packaging & Testing Industry, 3Q 2014.
Electronics.ca Publications is a world-class research network and publishing company whose focus is technology and market research for the electronics industry.
Thursday, September 11, 2014
Taiwanese IC Packaging & Testing Industry, 3Q 2014
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