Advanced 3D and 4D Visualization Systems Market is Expected to Reach US$2 Billion by 2018

Global market for Advanced (3D/4D) Visualization Systems is projected to cross the US$2 billion mark by 2018, driven by technological advancements, increasing adoption among clinical departments, and rising demand from emerging markets.

Advanced capabilities, such as 3D and 4D imaging, are now a reality given the technological innovations that have made computing of multiple probe signals possible across various imaging modalities. The market for Advanced (3D/4D) Visualization Systems has been benefiting from advances in the field of computer hardware and software, in addition to developments in the area of AV technology (3D) and PACS module integration. A noteworthy advancement in the area of advanced visualization has been the move from a thick client to a thin client server and to cloud technology. Driven by these developments, the market is making significant inroads in a wide range of imaging modalities and clinical applications. AV systems are increasingly finding demand in various clinical departments including radiology, cardiology, neurology, oncology, dentistry, and obstetrics/gynecology, owing to the significant advantages offered by the technology.

Radiology represents the largest market segment worldwide. Advanced visualization technologies such as 3D and 4D imaging has emerged as a vital tool for radiologists, as the visualization functionality greatly enhances radiologist efficiency through streamlining workflow processes. These tools in addition also support per-operative planning by enabling physicians to make accurate diagnosis. Cardiovascular imaging represents a high growth area for advanced visualization technologies driven by advancements in image acquisition techniques such as CT imaging. This is largely because these advanced visualization technologies aid in minimally-invasive procedures compared to the current standard procedures, thereby eliminating the need for invasive surgical procedures.

As stated by the new market research report on Advanced (3D/4D) Visualization Systems, the United States represents the largest market worldwide. Asia-Pacific is forecast to witness the fastest growth over the analysis period, with a CAGR of 7.1%. Growth in the region is driven by large patient pools, increased government spending on healthcare programs, strong economic growth, and increasing number of new diagnostic centers and hospitals with advanced imaging equipment.

Major players covered in the report include Fujifilm Holding America Corporation, GE Healthcare, Philips Healthcare, Qi Imaging, Siemens Healthcare, TeraRecon Inc., and Vital Images Inc., among others.

The research report titled “Advanced 3D and 4D Visualization Systems: A Global Strategic Business Report” available from Electronics.ca Publications, provides a comprehensive review of trends, issues, and strategic industry activities. The report provides market estimates and projections for geographic markets such as the US, Canada, Japan, Europe (France, Germany, Italy, UK, Spain, Russia and Rest of Europe), Asia-Pacific (China, India and Rest of Asia-Pacific), Latin America (Brazil and Rest of Latin America) and Rest of World. The report also analyzes the global market for Advanced (3D/4D) Visualization Systems by end-use segments such as Radiology, Cardiology, Oncology and Others.

Advanced 3D and 4D Visualization Systems Market is Expected to Reach US$2 Billion by 2018

Silicon Photonics Market Analysis by Products, Applications & Geography - Analysis & Forecast

Silicon Photonics is a relatively new technology which uses optical rays in order to transfer data between different computer chips and peripherals. This report covers particularly the markets for final products, devices and equipment that function on Silicon Photonics technology for six major application verticals namely: Telecommunications, Data communication, displays and consumer electronics, sensing, metrology, high performance computing and medicines. Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: Silicon Photonics Market Analysis by Products, Applications  & Geography – Analysis & Forecast.

In the last decade, the average cost of traditional microelectronics based optical has almost continuously increased. This has led to the gradual rise of Silicon Photonics as a solution to counter these operating cost and performance problems. Silicon Photonics technology will significantly reduce the costs associated with the components such as optical modulators, optical waveguides, attenuators and others. Silicon Photonics components substantially improve the data transfer speed in optical communication applications. Silicon Photonics based optical components consume lower power than the modulators, switches and others used in the existing optical communication networks.

A silicon Photonics wavelength division multiplexer filters t are expected to use extensively in coming future, as these devices are one of the major components used in ever growing telecom and Datacom application sectors. These products will be followed by silicon modulators and interconnects due their potential use in long haul optical networks

The Datacom application sector is expected to grow as big as the telecom sector because silicon Photonics has potential to satisfy needs of high performance computing and higher data transfer rates required for Datacom applications. Market penetration of silicon Photonics products in telecom and Datacom application sector will be high in the coming seven years.

This report describes the market trends, drivers, and challenges of the hardware encryption market and forecasts the market till 2018, based on applications, verticals, products, and geography. It covers geographies like the North America, Europe, APAC, and ROW (Rest of the World).

The figure below shows the life-cycle analysis of the various silicon Photonics application sectors based on factors like the time-to-market and the key features of the products in the different application sectors.

Silicon Photonics Application Life-Cycle Analysis

Silicon Photonics Market Analysis

The figure above shows in detail the short-term, medium-term and long-term applications for silicon photonics products, against the different features of the products for each applications. Datacom application revenue will dwarf all the other sectors in the coming future. The low-power consuming feature and the high data transfer rate capabilities achieved using silicon photonics are the main reason for the growth in the Datacom sector in the near future.

In applications like Telecom (Long-haul and Metro/LAN applications), Bio-medical sensors, Fiber-to-the-home (FTTH) and others, the major advantage of using silicon photonics will be the durability of the products as compared to the current conventional substitutes. Thus these applications will emerge in the medium-term (5-7 years).

In the long-term (beyond 10 years), silicon photonics is expected to become a default component of digital communication at the chip-level and board-level. These will open up doors to high volume of production and sales in the future.  To purchase this report please visit: http://www.electronics.ca/store/silicon-photonics-market-report.html


Silicon Photonics Market Analysis by Products, Applications & Geography - Analysis & Forecast

IPC A-610E PDF Download - Acceptability of Electronic Assemblies

Electronics.ca Publications offers IPC A-610E PDF,  the latest revision of the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610E illustrates industry-accepted workmanship criteria for electronics assemblies through full-color photographs and illustrations. Topics include flex attachment, board in board, part on part, lead free, component orientation and soldering criteria for through-hole, SMT (new termination styles) and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements.

IPC-A-610E is invaluable for all inspectors, operators and trainers. Revision E has 809 photos and illustrations of acceptability criteria-165 of them new or updated. This revision has been critically reviewed for clarity and accuracy. The document synchronizes to the requirements expressed in other industry consensus documents and is used with the material and process standard IPC J-STD-001.  For a more complete understanding of this document’s recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001, IPC-AJ-820, and IPC J-STD-001.

Details of the IPC-A-610E, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  Download  IPC A-610E Acceptability of Electronic Assemblies now.

IPC A-610E PDF Download - Acceptability of Electronic Assemblies

Thin Layer Deposition Equipment Market Report

Global Thin Layer Deposition Equipment Market is projected to reach US$18.5 billion by 2018, driven by emerging applications in medical imaging devices, specialty packaging and industrial coatings.

Defined as the building block of miniaturization and MEMS processing, thin layer deposition is a critical part of the fabrication process and is key to the production of all electronic devices. With surface treatment applications ranging from electronic components, electronic displays, optical coatings, optical data storage devices to antistatic coatings, thin layer deposition is expected to witness strong growth in the coming years. A significant portion of the growth is expected to stem from the robustly growing electronics industry. Developments in equipment design and performance, innovations in thin film materials and processes will also help spur growth. Typically, demand for Thin Film Deposition (TFD) equipment is largely tied to the demand for semiconductors, electronics, and medical devices, among others. Periods of economic slowdown tend to curtail consumer spending thus impacting business opportunities in this market. The capital intensiveness of the industry also makes investments a cyclical pattern with growth occurring largely during periods of intermittent revolutionary technology developments.

The Atomic Layer Deposition (ALD) Equipment is set to witness considerable demand in the short to medium term period, with ALD process finding large-scale adoption in several end-use application areas. For long, ALD process has been utilized to generate thin films with different compositions such as nitrides, oxides, pure metals, and carbides among others. The hallmark of this technology is its ability to produce monolayers on a molecular or atomic scale thus making it highly suitable for deposition of nanofilms with thickness less than 100 nanometers on various surfaces, including polymers, metals and ceramics. ALD equipment is expected to witness increased adoption as a manipulation and fabrication tool in nanotechnology. Furthermore, the ALD equipment market is projected to witness increasing demand from non-IC and IC applications. A marked trend towards miniaturization of components is also driving the market, given the technology’s proven efficiency in fabrication of smaller size components. Also, with semiconductor fabricators expected to invest in new manufacturing equipment, the market is forecast to witness tremendous opportunity in the coming years. ALD equipment will also find increased adoption in production of other advanced devices such as organic light-emitting diodes (OLEDs).

As stated by the new market research report on Thin Layer Deposition Equipment, Asia-Pacific represents the largest and the fastest growing market with a projected CAGR of 4.9% over the analysis period. PVD equipment represents the largest product market. Over the years, PVD equipment makers have diversified into a variety of high volume, low cost applications such as information storage, optics, medical instruments, industrial coatings, automotive and aerospace components and specialty/flexible packaging.

Major players covered in the report include AIXTRON SE, Applied Materials Inc, ASM International N.V., Canon ANELVA Corporation, CHA Industries Inc., CVD Equipment Corporation, Denton Vacuum LLC, Edwards Limited, Ionbond AG, Jusung Engineering Co., Ltd., KDF Electronic & Vacuum Services Inc., Kokusai Semiconductor Equipment Corporation, Lam Research Corporation, RIBER SA, Seki Diamond Systems, Silicon Genesis Corporation, SPTS Technologies, Ti-Coating Inc., Tokyo Electron Limited, Taiyo Nippon Sanso Corporation, ULVAC Technologies Inc., Vapor Technologies Inc., Veeco Instruments Inc.

The research report titled “Thin Layer Deposition Equipment Business Report”, provides a comprehensive review of market trends, issues, drivers, company profiles, mergers, acquisitions and other strategic industry activities. The report provides market estimates and projections in US$ for all major geographic markets including the United States, Canada, Japan, Europe (France, Germany, Italy, UK, Spain, Russia and Rest of Europe), Asia-Pacific (China, South Korea, Taiwan and Rest of Asia-Pacific), Latin America (Brazil & Rest of Latin-America) and Rest of World. Technology markets analyzed include Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD).

Thin Layer Deposition Equipment Market Report