Friday, September 19, 2014

New IPC A-610F Standard

DoD Adopted! IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and illustrations. This lates revision, IPC A-610F includes two new SMT termination styles, as well as changes in plated-through hole fill and BGA void criteria. Additionally, wherever possible statements were modified to make readability easier and to enhance understanding — all without eliminating any requirements.
Major topics include flex attachment, board-in-board, part-on-part, both lead-free and tin-lead criteria, component orientation and soldering criteria for through hole, SMT, cleaning, marking, coating and laminate requirements. TOC and ordering information can be found on Electronics.ca Publications" web site. Acceptability of Electronic Assemblies IPC A-610F.

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