Global Market for Situation Awareness Systems

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Situation Awareness System – Global Strategic Business Report”. This report provides a comprehensive review of market trends, drivers, opportunities, challenges and issues in addition to current coverage on company information and latest news and events including strategic corporate developments, and product innovations. The report helps identify the biggest opportunities in this space and offers accurate latent demand forecasting that empowers quantitative decision making among existing market players and new entrants.

The global market for Situation Awareness System is projected to reach US$135 billion by 2020, driven by the need for efficient management of security threats against a backdrop of continuous rise in security infringements the world over. Technology innovations and growing awareness over the benefits offered by Situation Awareness System are spurring adoption in plant automation, homeland security, aviation, maritime security, construction, cyber security, healthcare and automotive sectors. The United States represents the largest market worldwide, followed by Europe. Asia-Pacific is forecast to emerge as the fastest growing market with a CAGR of 10.9% over the analysis period.

Situation Awareness Systems Market Trends & Drivers:

• Need to Protect Critical Government Infrastructure Brings Situation Awareness System Into the Spotlight


• Demand for Next-Generation Data Security Solutions Drives Market Growth


• Technology Developments Spearhead Growth in the Market


• Wireless Situational Awareness Systems: A Promising Technology in the Making (LSA): The Next Level of Innovation


• Smart Cities to Fuel Large-Scale Adoption of Situation Awareness Solutions

The report profiles 77 companies including many key and niche players such as –

Advanced Micro Devices, Inc.

BAE Systems

Barco N.V

CNL Software

D3 Security Management Systems

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View Report Contents: “Situation Awareness System – Global Strategic Business Report“.

 

Global Market for Situation Awareness Systems

Next Generation Quantum Dot: Markets Change Rapidly

ELECTRONICS.CA PUBLICATIONS, the electronics industry market research  and knowledge network, announces the availability of a new report entitled “Quantum Dots: Market Shares, Strategy, and Forecasts, Worldwide, 2015 to 2021”. Worldwide quantum dot markets are poised to achieve significant growth as next generation systems provide a way to improve traditional displays with vibrant color and decrease the cost of making electronic devices by decreasing manufacturing costs while increasing quality.

Quantum Dots: — Markets Reach $4.6 Billion By 2021

Quantum dot markets are set for rapid growth. Quantum dot market driving forces relate to technology maturity. TV displays, fuel cell catalysts, solar quantum dots, a range of applications depend on the ability to manufacture quantum dots consistently and in sufficient quantity to be useful in a commercial environment. Large screen TV displays represent one of the first commercial application for quantum dots.

This TV display market is a good market. The overall flat panel display (FPD) market is anticipated to reach US$110 Billion by 2017. Growth is driven by widespread use of devices that embed electronic displays. Displays fit in electronic TVs, notebooks, and mobile smart phones. Ample opportunities exist in the automotive sector as display mediums for entertainment and driver assistance systems.

FPDs can tap into opportunities in the advertising sector, where they are used for both outdoor and indoor ad displays. Public display systems are becoming more common. Technology innovation, lower prices, and robust demand bodes well for market development.

Quantum dot films inside FPDs are indispensable to electronic devices that require human operation and as a result LCD and plasma technologies are now commonplace. In the television industry. Quantum dot penetration of flat panel display markets promise to be huge. Demand for thin TVs is strong, with wall mounted TVs accounting for a major portion of the market. FPDs are popular for buildings and transport applications. They are used in digital picture frames.

Challenges to existing display technology comes from viewer desire for pure colors and low energy consumption. These features are provided by quantum dots. End-use of big TV displays are expected to drive quantum dot markets throughout the forecast period. Industries analyzed include information systems, personal computers, telecom equipment, instrumentation, consumer appliances, transportation equipment, stationary fuels cells, and medical devices.

Quantum Dot (QD) and Quantum Dot LED (QLED) Market is evolving. The quantum dot market depends on techniques for the development of commercial quantity production. Kilogram quantity mass production of quantum dots is a game-changer. High quality, high quantity and low price quantum dots increase the rate of change in consumer electronics markets.

Quantum dot technology offers screen quality far beyond what has been available previously. The quality of light is better for displays with quantum dots. New products are emerging as manufacturers learn to integrate high efficiency / luminescence quantum dots into display products. The level of change represents a paradigm shift that creates new industries, products, and jobs in science and industry.

The list of possible quantum dot applications is ever expanding. New applications are waiting for the availability of quantum dots.

• Gold Nanoparticles Illustrate Properties Of Colloidal Nanocrystals Size Dependency


• Intrinsic physical sizes are comparable to the critical sizes of many important properties of a given class of functional materials


• Wavelength of the electron wave function


• Diameter of photo-generated excitons


• Domain size of magnetic single domains


• Large surface-to-volume atom ratio alters the chemical potential of the structural


• Large surface-to-volume atom ratio different in comparison to corresponding bulk crystals


• Strongly size-dependent solubility of nanocrystals


• Presence of size dependent structures in the nanometer regime


• Electron band configuration


• Surface structure


• Surface reconstruction


• Unique crystal structures


• Unique catalytic properties of gold nanocrystals can be considered an example

Quantum Dot and Quantum Dot LED (QLED) market segments include HDTV and displays, solar, LED lighting, cancer imaging, personalized medicine, telco lasers, and ID tags. All segments are anticipated to achieve spectacular growth, with TV display technology and solar markets reaching over $1 billion per year in revenue by 2021. Qdot cancer imaging / personalized medicine reaches $750 million and quantum dot ID Tags go to $700 million dollars by 2021.

Vendors, including Nanosys and QD Vision synthesize these materials in solution, and formulate them into inks and films. Quantum Dot LEDs (QLED) enable performance and cost benefits.

Quantum Dot LED (QLED) commercial focus has remained on key optical applications: Optical component lasers are emerging as a significant market. LED backlighting for LCD displays, LED general lighting, and solar power quantum dots are beginning to reach the market. Vendors continue to evaluate other applications.

Medical applications are potentially large and beginning to reach a level of maturity that represents real market presence. Early stage work with University College London in cancer imaging is progressing.

According to Susan Eustis, lead author of the team that prepared the study, “Quantum dots QDs are nano-particles in the range of 2 nm to 10 nm diameter. Quantum dots are tiny bits of semiconductor crystals with optical properties that are determined by their size and shape more than material composition. Their small size is of nanoparticles is only now making them able to be manufactured in commercial quantities. They are made through a synthesis process. Strong growth is anticipated as companies master manufacturing techniques that allow consistent production”

Quantum dot markets at $306 million in 2014 are anticipated to reach $4.6 billion by 2021 as next generation devices, systems, and displays are triggered by quantum dots. Quantum dots represent the next wave of semi conductor revolution, giving sophisticated functionality based on the size and shape of the nanoparticle not the base material. Because the materials science is so easy to manipulate, the devices can be made very inexpensively with a lot of variety.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: “Quantum Dots: Market Shares, Strategy, and Forecasts, Worldwide, 2015 to 2021“.

Next Generation Quantum Dot: Markets Change Rapidly

Military Communications Market: A $40 Billion Opportunity

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “The Military Communications Market: 2015 – 2030 – Opportunities, Challenges, Strategies & Forecasts”. According to this study, the military communications market will account for over $40 Billion in revenue by 2020. Armed forces throughout the globe rely on communication systems to enable information sharing and securely stay in constant contact. The role of these systems continues to grow in importance, with new mission areas such as the control of unmanned vehicles and time-critical targeting heavily reliant on network connectivity.

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Despite pressures on overall defense expenditure, a universal trend towards network centric warfare combined with an unstable geopolitical landscape, is continuing to drive significant investments in military communications. The market is expected to account for over $40 Billion in revenue by the end of 2020, with investments ranging from the adoption of multi-band and multi-mode tactical radio systems, to the integration of ad hoc networking platforms in unmanned vehicles.

The “Military Communications Market: 2015 – 2030 – Opportunities, Challenges, Strategies & Forecasts” report presents an in-depth assessment of the military communications ecosystem including key trends, market drivers, challenges, enabling technologies, regional investment landscape, submarkets, leading applications, opportunities, future roadmap, value chain, ecosystem player profiles and strategies. The report also presents market size forecasts for military communications from 2015 through to 2030. The forecasts are segmented for 6 submarkets, 3 service branch classifications, 5 regions and 50 leading countries.Military organizations worldwide are increasingly moving away from proprietary, one-off, unique communication systems that are expensive in favor of similar, and often more advanced, systems readily available in the commercial marketplace at reduced costs from a variety of vendors.

Military Communications Market

The report will be of value to current and future potential investors into the military communications market, as well as armed forces, system integrators and vendors who wish to broaden their knowledge of the ecosystem.  Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: “The Military Communications Market: 2015 – 2030 – Opportunities, Challenges, Strategies & Forecasts“.

Military Communications Market: A $40 Billion Opportunity

Key Nano-technologies and Markets in 2015 and Beyond

Nanotechnology and nanomaterials are key enablers for a whole new generation of products and processes, some of which have come onto the market in 2014 in sectors such as consumer electronics.

The Nanotechnology Industry Review and Prospects Report is a comprehensive guide to materials, markets and products in nanotech over the past 12 months and future developments. This publication details leading developments within the industry during this period.

2014 witnessed numerous major advances enabled by nanomaterials in consumer electronics (quantum dots), medicine and coatings technology. The number of nanocellulose and graphene producers and applications developers has grown significantly. Other 2D nanomaterials are now the focus of widespread research.

The Nanotechnology Industry Review and Prospects Report focuses on the leading nanomaterials under development, with coverage on carbon nanotubes, graphene, quantum dots, nanocellulose and other key markets such as titanium dioxide nanoparticles and nanosilica. There are contributions from leading nanotech companies in the materials and coatings sectors, alliowing readers a unique market insight into these exceptional materials.

All the key breakthroughs and business developments in 2014 in graphene, carbon nanotubes, nanomedicine, nanocellulose, nanocoatings, nanomaterials regulation, nanowires, quantum dots and energy are covered. This publication provides a comprehensive review of the state of the nanotech sector at present, it’s development, and future prospects. Strategic analysis of the key global markets nanotech will impact is the core theme.

Key Nanomaterials Markets in 2015

• Nanomaterials in the Li-ion battery market


• The graphene market


• Keys to success in graphene


• Graphene in healthcare


• Nanomaterials in 3D printing


• Nanomaterials in Displays


• Nanomaterials in Filtration


• Nanomaterials in Energy


• The Nanocoatings Market


• Anti-fingerprint nanocoatings


• Nanocoatings in the automotive industry


• Nanocoatings in aerospace and aviation


• Nanocoatings in construction and exterior protection


• Nanocoatings in consumer electronics


• Nanocoatings in sanitary and cleaning 54 Nanocoatings in the oil and gas sectors


• Nanocoatings in the marine industry


• Nanocoatings in the textile industry


• Medical nanocoatings


• Waterproof nanocoatings


• Quantum Dots in Displays

Key Nanomaterials in 2015

• Self-Healing nanocoatings


• Gold nanoparticles


• The Carbon nanotubes market


• Single-walled carbon nanotubes prospects


• Fullerenes


• Nanosilver


• Nanowires in electronics


• Nanozirconia producers


• Titanium dioxide nanoparticles


• Nanoparticle inks for printed electroncs


• Plasma nanocoatings


• Nanosilica


• Cellulose nanocrystals

Key Industry Developments in the last 12 months

• Graphene industry developments


• Nanomedicine industry developments


• Nanomaterials regulation


• Carbon nanotubes industry developments


• Nanowires industry developments


• Quantum dots industry developments


• Nanocoatings industry developments


• Nanoenergy industry developments


• Nanocellulose industry developments

Learn more about nanotechnology and nanomaterials market and publications that provide informed perspective and relevant analysis of emergent technologies.

 

Key Nano-technologies and Markets in 2015 and Beyond

Identifying Emerging and Disruptive Technologies - 2015 Roadmap

The iNEMI Roadmap has become recognized as an important tool for defining the “state of the art” in the electronics industry as well as identifying emerging and disruptive technologies.  It also includes keys to developing future iNEMI projects and setting industry R&D priorities over the next 10 years.

The 2015 Roadmap was developed by five Product Emulator Groups (PEGs) and 19 Technology Working Groups (TWGs). There is one additional chapter on Test, developed in 2013, also included.  The PEGs and TWGs are defined below. The TWGs responded to the inputs and requirements outlined by representatives of OEMs in the five Product Emulator Groups (PEGs). These groups included more than 500 direct participants from over 280 private corporations, consortia, government agencies, and universities in 20 countries.

Five Product Emulators for the 2015 Roadmap

Industry Sector	Product Characteristics
Automotive	Products that must operate in an automotive environment
Consumer/Office Systems	Driven by the need for maximum performance over a wide range of cost targets
High-End Systems	Products that serve the high-performance computing, server, data storage, networking, datacom and telecom markets
Medical	Products that must be highly reliable and, in some cases, support life-critical applications
Portable/Wireless	Produced in high volumes, cost is the primary driver; hand-held, battery powered products are also driven by size and weight reduction

 

The 2015 iNWEMI Roadmap  is now on sale. As the only industry roadmap that looks at the entire supply chain, the iNEMI Roadmap delivers in-depth information about the challenges and opportunities facing the electronics manufacturing industry over the next 10 years. It also provides direction regarding the technologies required to meet the ever-evolving needs of this rapidly diversifying and growing industry.

 

Identifying Emerging and Disruptive Technologies - 2015 Roadmap

Some Questions Answered About IPC J-STD-001F and IPC A-610F

Two leading standards for the electronics assembly industry have been revised. IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies is recognized worldwide as the sole industry-consensus standard for soldering processes and materials. IPC-A-610F, Acceptability of Electronic Assemblies, is a post-assembly acceptance standard used to ensure electronics assemblies meet the most current acceptance requirements.

Some significant changes to IPC-J-STD-001F and IPC-A-610F standards include:

• Requirements added for two new SMT terminations
  
  • P-Style terminations
  
  
  • Butt/I terminations — Solder charged terminations
  
  


• Revised Class 2 plated-through hole vertical solder fill requirements


• Revised void criteria for BGA/CSP components


• Revised class 2 flux activity criteria


• Improved language for ease of readability and understanding


• Revised soldering requirements for plastic SMT components


• Expanded conformal coating section


• New photos added for clarity


• Simplified Imperial English dimensions utilized in the documents


• Explicit to IPC J-STD-001, revised appendices including guidelines for soldering tools and equipment and objective evidence on material compatibility

The changes listed above are only some of the highlights of J-STD-001F and IPC-A-610F. In order to stay current with best practices in the electronics assemblies industry you need the most current standards, J-STD-001F and IPC-A-610F.

Some Questions Answered About IPC J-STD-001F and IPC A-610F

International Economic Outlook: Will High Risk Events Trigger a Recession?

Will High Risk Events Trigger a Recession?

In the worldwide business cycle, the group of the English-speaking countries has led historically global economic activity. Monthly predictive analytics signal an underlying weakness for several months in the English-speaking countries, which have posted negative or steadily declining growth rates in their leading indicators.

Globally, trade predictive analytics, which summarize worldwide merchandize exports, clearly point out an undergoing global slowdown contradicting the media created myth of transitory snowstorms in New England as the cause of an economic downswing in the United States in the first quarter of this year. In March of this year, global exports, on a year-to-year basis, declined by 12.4%, the sixth consecutive monthly decline in a row following an expansion since October 2014.  On a quarterly basis, in the first quarter of 2015 global exports dropped 10.2% from a year ago to $3.7 trillion, following a 2.6% decline in the last quarter of 2014. A major trigger for such dramatic changes in each county’s business cycle has been the “burst” of the oil-price bubble coupled with currency realignments from the strengthening of the US dollar as well as a slowdown in the growth in emerging economies.

In addition to geopolitical risks related to Middle East and Eastern Europe, there is high probability of bursting this year one or more  policy-created bubbles.  A hard landing in China from housing prices and/or stock market corrections; disintegration of the Euro Area; high debt to income ratios – both private and public – in several countries; and the timing of an exit from an ill-conceived and permanent-perceived monetary policy of zero interest rates in the United States. Any of these events may trigger a significant correction in stock markets leading to another major recession with no tools left for economic policy. …Assigning a 40% probability that any of these events will come suddenly into play this year .

By Evangelos Otto Simos, Ph.D.

• Related Research: Global Semiconductor Industry Leading Indicator and Forecast Report.

 

International Economic Outlook: Will High Risk Events Trigger a Recession?

Download IPC Standards - Everything You Need From Start To Finish

To achieve a high quality end product and maintain a competitive position in the marketplace, you need to infuse quality throughout the manufacturing process.

Did you know there is an IPC standard associated with nearly every step of printed circuit board production and assembly?  From design and purchasing to assembly and acceptance, Electronics.ca Publications offers IPC Standards to help you assure superior quality, reliability and consistency in the electronic assemblies that go into your product. Download IPC Standards Spec Tree – PDF file.

As with the manufacturing process — which uses a step-by-step approach – IPC standards also build upon one another. To achieve your desired results, it’s important to implement the appropriate IPC standards associated with each step of production.

Download IPC Standards Spec Tree – PDF File

Why Use IPC Standards in Your Manufacturing Process?

• Gain Control Over End Product Quality and Reliability — Quality and reliability are the cornerstones of competing in the marketplace and critical to your company’s reputation and profitability. By implementing IPC standards throughout the manufacturing process, you help ensure better performance, longer life and compliance with lead-free regulations.


• Improve Communication with Suppliers and Employees — IPC standards are the standards that your competitors, suppliers and EMS providers use. Working from an established IPC standard helps all of you to “speak the same language” — the language of the global electronic industry. In addition, using IPC standards eliminates confusion for employees, because they know they need to perform to an established industry standard.


• Help Contain Costs — Ensuring that your design and the bare boards you purchase comply with IPC standards allows you to produce electronic assemblies that meet stringent quality tests down the line, minimizing costly delays, rework and scrap.

The Most Popular IPC Documents are available from Electronics.ca Publications in PDF Format

Download IPC Standards

IPC A-610F – Acceptability of Electronic Assemblies
IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments.

IPC J-STD-001F – Requirements for Soldered Electrical and Electronic Assemblies
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies has emerged as the preeminent authority for electronics assembly manufacturing. The standard describes materials, methods and verification criteria for producing high quality soldered interconnections. The standard emphasizes process control and sets industry-consensus requirements for a broad range of electronic products. This revision now includes support for lead free manufacturing.

IPC A-620B – Requirements and Acceptance for Cable and Wire Harness Assemblies
Revision B is now available for the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies.

IPC-DRM-PTH-E
Now updated to Revision D of the latest IPC-A-610E and J-STD-001E – our Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections.

IPC-DRM-SMT-E
Useful as a training aid in the classroom or on the shop floor, DRM-SMT-E contains computer generated color illustrations of Chip component, Gull Wing and J-Lead solder joints.

IPC-J-STD-033C
J-STD-033 Provides Surface Mount Device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs.

IPC-J-STD-020D-1
IPC-J-STD-020D-1 standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress.

J-STD-075

J-STD-075 provides test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing.

IPC Collections:

IPC-C-103 – Electronics Assembly Standards Collection

IPC-C-1000 Essential Document Collection for Board Design, Assembly and Manufacture

IPC-C-108 Cleaning Guides and Handbooks Collection

Through Electronics.ca you can order IPC standards for printed circuit board design and manufacturing and electronics assembly, including handbooks, guidelines and IPC training videos.

Download IPC Standards - Everything You Need From Start To Finish

Rigid PCB Industry Report: Global Top 40 Rigid PCB Companies by Revenue

2014 was a good year for majority of PCB companies, as output value of PCB industry touched USD59.6 billion, rising 3.7% against 2013, the fastest growth rate since 2011. Looking forward to 2015, a collapse in prices of commodities, especially in that of copper, will significantly reduce raw materials costs of PCB companies, thus further driving their profit margins.

In 2014, in key regions of PCB manufacturing, euro, NTD, and yen all depreciated sharply, while the won appreciated, dealing a heavy blow to South Korean PCB industry and cutting profit margins of the country’s PCB companies, which all suffered declines in revenue and profit margins, no exception for Samsung’s SEMCO, whose revenue from PCB business glided 2.4%, revenue from IC Carrier business dropped by 19%, and operating margin fell to below 1% from about 9%.

Global Top 40 Rigid PCB Companies by Revenue, 2012-2014 (USD mln)

Taiwanese companies and European ones, benefiting from currency devaluation, saw a surge in profit margins, while Japanese peers didn’t gain from yen depreciation, as more than half of their production bases are located in foreign countries, but still performed better than South Korean counterparts.

HDI was still a main engine of growth in rigid PCB field in 2014, and is expected to maintain the momentum in 2015. As mobile phone screens become larger, PCB for mobile phone has to react accordingly. To ensure light weight and thinness of mobile phone, the demand for more advanced Anylayer HDI increases tremendously. As Anylayer HDI technology is time- and -capacity consuming, combined with Panasonic’s withdrawal from Anylayer HDI field, various PCB companies will expand Anylayer HDI capacity in 2015. In 2014, the company registered largest growth in revenue from HDI PCB business was Taiwanese Compeq, which boasts customers like Apple and Xiaomi with impressive performance, jumping by 28.3% to USD690 million, one step away from industry leader Unimicron.

Another spotlight in 2014 was PCB for server. With further penetration of internet economy, the coming of big data era, and influx of large amounts of capital into network economy, the demand for server ushers in explosive growth. PCB for server requires high Tg and low Loss, with layer growing more higher, up to 28, driving continuous increase in unit price of PCB for server since 2009. The companies that specialize in PCB for server, such as Taiwanese WUS Printed Circuit and ACCL, accomplished good results, with WUS Printed Circuit’s revenue ascending by 20% and ACCL’s 27%.

Regarding rigid PCB, LED lighting stimulated demand for metal PCB with good heat elimination performance. Taiwanese T.P.T, GIA TZOONG, and mainland Chinese Shenzhen Kinwong Electronic, which are skilled in metal PCB, all enjoyed a decent level of growth. In addition, PCB for automobile also did a good performance.

The most sensational event in PCB industry in 2014 was the merger of TTM and Viasystems. The combined company is absolutely No. 1 manufacturer with total revenue approximating USD2.5 billion. TTM enjoys a strong position in cellular phone and networking/telecom, and Viasystems in automotive and industrial fields, showing a perfect complementation.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: Global and China Rigid PCB Industry Report, 2015.

Rigid PCB Industry Report: Global Top 40 Rigid PCB Companies by Revenue

Semiconductor Manufacturing Industry Analysis

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts“, extending The Information Network’s semiconductor manufacturing industry analysis. This report profiles key semiconductor equipment suppliers such as Applied Materials, Axcelis Technologies, KLA-Tencor, Lam Research, Mattson Technology, Nanometrics, Rudolph Technologies, Ultratech, Veeco, Aixtron, ASM International, ASML. Carl Zeiss, Camtek, EV Group, LPE, Mycronic, Nova Measuring Instruments, Oerlikon/Evatec, Semilab, Advantest, Canon, Canon Anelva, Daifuku, Ebara, Hermes Microvision, Hitachi High-Technologies, Hitachi Kokusai Electric, JEOL, Jusung Engineering, KC Tech, Lasertec, Murata Machinery, Nikon, Nippon Sanso, Nissin Ion Equipment, NuFlare Technology, Screen Semiconductor Solutions, Tokyo Electron, Tokyo Seimitsu, Topcon Technohouse, Toray Engineering, Ulvac, Ushio, Wonik IPS.

Semiconductor Manufacturing Industry Analysis

According to this report, the front end equipment market, which grew 18.4% in 2014 based on revenues converted to dollars, the 2015 market will be essentially flat as shown in the table below.

Top 10 Semiconductor Front End Equipment Suppliers
	2013 (a)	2014 (a)	2015 (f)
	($B)	($B)	($B)
Applied Materials (AMAT)	5.46	6.33	6.61
ASML (ASML)	5.30	5.63	5.02
Tokyo Electron	3.06	4.66	4.74
Lam Research LRCX)	2.94	3.81	4.70
KLA-Tencor (KLAC)	2.14	2.18	1.95
Screen Semiconductor Solutions	1.22	1.13	0.94
Hitachi High-Technologies	0.80	0.94	0.80
Nikon	0.64	0.82	0.82
Hitachi Kokusai Electric	0.50	0.60	0.64
ASM International (ASMI)	0.46	0.56	0.58
Total	22.52	26.65	26.79
Change	18.4%	0.5%
Source: The Information Network

A number of technical and operational trends within the semiconductor manufacturing industry are strengthening the need for more effective advanced equipment solutions.

Semiconductor Manufacturing Industry Trends:

• Development of Smaller Semiconductor Features. The development of smaller features, now as small as 20nm in production and 10nm in R&D, enables semiconductor manufacturers to produce larger numbers of circuits per wafer and to achieve higher circuit performance.

• Transition to 3D device structures. Foundries are adopting 3D FinFET transistors starting at 14/16 nm technology nodes to get improved performance and use less power in 1x technology nodes. Memory makers will move to 3D NAND and vertical structures for next generation NAND technology

• Transition to 3D Integration Technology. Three-dimensional (3D) integration of active devices, directly connecting multiple IC chips, offers many benefits, including power efficiency, performance enhancements, significant product miniaturization, and cost reduction. It provides an additional way to extend Moore’s law beyond spending ever-increasing efforts to shrink feature sizes. A critical element in enabling 3D integration is the Through-Silicon Via (TSV); TSV provides the high-bandwidth interconnection between stacked chips. The TSV process is beginning to enter production. In the case of TSV, since multiple chips are connected, the process has to achieve and maintain very high yield levels in order to be economically viable.

• Shortening of Technology Life Cycles. The technology life cycle of integrated circuits continues to shorten as semiconductor manufacturers strive to adopt new processes that allow a faster transition to smaller, faster and more complex devices. In the past, the technology life cycle was approximately three years; it is now only two years.

• New materials. Copper metal layers continue to be the key material for the back end of line for advanced integrated circuits in order to increase performance and reduce the cost of integrated circuits. The Industry is continuously searching directions to reduce the effective K of the low K materials and to reduce the barrier thickness and material types. These changes require new processing and metrology equipment and thus represents challenging developments for the semiconductor manufacturing industry. In addition, in order to overcome limitations in the continued shrink of transistor dimensions, leading edge integrated circuit manufacturers are introducing new materials in the transistor gate stack. The adoption of high-k dielectrics is a key element for gate control in the most advanced technology nodes of 28nm, 20nm and 14nm currently in production, while R&D work to implement the next gate control material being done with III-IV materials. These new materials, combined with metal layers, require new processing and metrology equipment and thus represent a challenging development for the semiconductor manufacturing industry.

• Increasing use of multi patterning lithography. The continuous need for scaling to meet reduced transistor costs combined with delays in EUV lithography is pushing the industry to develop alternative lithography techniques such as multi patterning, DSA and E-Beam. These alternative technology are increasing the Etch and CMP process steps and thus increasing the process control and metrology steps in these areas accordingly.

• Increase in Foundry Manufacturing. Asa result of the rising investment needed for semiconductor process development and production as well as the proliferation of different types of semiconductors, semiconductor manufacturing is increasingly being outsourced to large semiconductor contract manufacturers, or foundries. A foundry typically runs several different processes and makes hundreds to thousands of different semiconductor product types in one facility, making the maintenance of a constant high production yield and overall equipment efficiency more difficult to achieve. This trend of shifting to foundries for manufacturing needs has progressed even further during recent years.

Semiconductor Manufacturing Industry AnalysisDetails of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View Report Contents: “Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts“.

Semiconductor Manufacturing Industry Analysis

Market Demand for Surge Protection Devices

Electronics.ca Publications announces the release of a comprehensive global report on surge protection devices market. The global market for Surge Protection Devices (SPDs) is forecast to reach US$2.4 billion by 2020, driven by the growing need to protect sensitive electronic equipment from power fluctuations.

Global Surge Protection Devices Market Report

Surge protection devices such as transient voltage surge suppressors and surge arrestors are growing in importance, given the billions of dollars of losses caused by voltage fluctuations and power line abnormalities. Widespread use of sophisticated electrical, electronic communication and data equipment is driving the importance of power management solutions including SPDs, in both developed and developing economies. Proliferation of home appliances, personal computers, heating and air conditioning equipment in residential homes, and installation of high-end industrial electronic equipment in manufacturing plants are driving growth in the market. Future growth in the market will continue to benefit from the increasing use of electronics in the rapidly growing world telecommunication industry.

The commercial end-use sector is expected to witness strong growth in the coming years. With nationwide alternate energy programs gaining popularity in Germany, China and other major economies, demand for surge protectors is expected to gain strength. Substitution of conventional coil and core street lamps with light emitting diodes for outdoor lighting is also opening up new growth avenues for SPD manufacturers. Miniaturization and clock speeds of microprocessors as dictated by Moore’s Law comes at a price, namely higher sensitivity of the chips to power transients, electromagnetic interference, radio frequency interference and electrical field transients. The increasing sensitivity of modern electronic devices to even split-second electricity fluctuations bodes well for sales of SPDs. The global market for SPDs is extremely competitive characterized by a high degree of fragmentation, and pricing pressures. The relatively commoditized SPD technology leaves very little scope for differentiation. Pure-play SPD manufacturers face stiff competition from large diversified electrical equipment makers.

As stated by the new market research report on Surge Protection Devices (SPDs), the United States represents the largest market worldwide. Developing countries are forecast to spearhead future growth in the market led by mounting issues related to stable power supply. Escalating demand for energy as a result of robust pace of economic development and industrialization, inefficient energy infrastructure and power shortages, are key reasons responsible for poor power quality in these countries. Asia-Pacific, led by China and India, is forecast to witness the strongest growth over the analysis period. Key factors driving growth in the region include the growing consumer appetite for expensive electronic devices, and migration of industries towards digitization and automation of production and business processes.

Major players covered in the report include Advanced Protection Technologies Inc., Belkin international Inc., DEHN + SONS GmbH + Co. KG, Eaton Corporation PLC, Emerson Electric Co., GE Industrial Solutions, Hubbell Incorporated, Koninklijke Philips N.V., Legrand SA, Leviton Manufacturing Co. Inc., Nexus Industries Ltd., Novaris Pty Ltd., OBO BETTER MANN GmbH & Co. KG, Panamax LLC, Phoenix Contact GmbH & Co. KG, REV Ritter GmbH, Schneider Electric SA, Smiths Interconnect, Shenzhen Dowin Lightning Technologies Co. Ltd., Thomas & Betts Power Solutions LLC, Tripp Lite, and Weidmüller GmbH & Co. KG, among others.

The research report titled “Surge Protection Devices (SPDs): A Global Strategic Business Report“, provides a comprehensive review of market trends, growth drivers, challenges, issues, and strategic industry activities of major companies worldwide . The report provides revenue estimates and projections for all major geographic markets, including the US, Canada, Japan, Europe (France, Germany, Italy, UK, Spain, Russia and Rest of Europe), Asia-Pacific (China, India, and Rest of Asia-Pacific), Latin America (Brazil, and Rest of Latin America) and Rest of World. The global and regional markets for SPDs are analyzed in US dollars by the following product types: Plug-In, Hard-Wired, Line Cord, and Power Control Center. The global SPDs market is further analyzed by end-use sectors comprising Communication, Consumer, and Others (includes Industrial, and Healthcare Applications, among others).

Market Demand for Surge Protection Devices

IPC-4101D-WAM1 Brings Significant Changes and Clarifications

If you need the most current specifications for PCB materials used in rigid or multilayered printed boards, then it is time to upgrade to IPC-4101D-WAM1. This newly revised standard brings critical updates to the already valuable IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards.

Why wait? Upgrade to the IPC-4101D-WAM1 today!

IPC-4101D-WAM1 delivers key updates for board designers, specifiers of board materials, and OEM’s who use and keep boards current with base materials used in PCBs.

This revision:

• covers requirements for laminate or prepreg base materials used primarily for rigid and multilayer printed boards for electrical and electronic circuits


• contains 64 individual, keyword searchable specification sheets, including a brand new sheet that expands offerings for commercially available laminates and prepregs


• clarifies what is stated in the original release of IPC-4101D for the FR-4.0 materials as “None” for inorganic filler content, now states “<5%” is allowed


• adds table 3-10, Permissible Laminate Substitutions for Specification Sheets /21, /24, /26 and /30

IPC4101D-WAM1

This revision brings significant changes and clarifications. Learn more about how these updates can benefit you. Order IPC4101D-WAM1 today!

 

 

IPC-4101D-WAM1 Brings Significant Changes and Clarifications

Trending Terms Covering the Newest Emerging Technologies

What’s relevant for today’s OEM, EMS or ODM Company?

Each year, a new slew of terms and definitions become common place in the manufacturing process. To meet these needs, T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.

PURCHASE IPC T-50M NOW

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

 

IPC T-50M brings over 150 new terms, while eliminating out-of-date terminology in order to provide a streamlined standard that focuses on the trending language of the electronics industry. This revision includes terms often cited in other standards, such as:

• Conformal coating


• Statistical Process Control


• Stencil Design

Stay up to date with the trending terms covering the newest emerging technologies. Prepare for tomorrow’s discussions by purchasing T-50M today.

 

 

Trending Terms Covering the Newest Emerging Technologies

Global Market for Optical Network Semiconductor Components to Reach $7.6 Billion in 2019

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Optical Network Components: Global Markets”.  This study reveals that the ongoing migration from lower speed to higher speed connections is providing optical network component suppliers with a recurring revenue stream. Optical network semiconductors will witness an increase from $6.4 billion in 2014 to $7.6 billion in 2019, registering a 3.2% rise in compound annual growth rate (CAGR). The result is that optic components will continue to be an area of prime interest to silicon suppliers.

Advances in wafer and silicon technology have enabled chip manufacturers to squeeze complex functions onto much smaller spaces. They have also been able to put increased functionality into these chips. As a result, optical components continue to be an area of prime interest for semiconductor suppliers. These new semiconductors offer users a number of benefits— more functionality, simpler deployment, and support for higher speed.

Businesses and individuals have developed new applications to take advantage of high-speed, multimedia-friendly transmissions. In the healthcare industry, high-speed optical connections are dramatically improving patient care. Medical imaging is becoming more granular and new applications are emerging. In the data center, optic connections are altering the design of IT systems. Consolidated systems are becoming more common and cloud computing will gain demand.

GLOBAL OPTICAL MARKET SEGMENT REVENUES, 2013-2019 ($ MILLIONS)

Optical Network Components: Global Markets analyzes and forecasts market trends in each segment of the optical semiconductor market, delineates technology trends, and identifies market leaders. Forecasts are presented for user requirements, current buying patterns, and expenditure trends from 2014 through the year 2019.

 

 

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: Optical Network Components: Global Markets.

Optical Network Semiconductor Components Market – Partial List of Tables

Table 1 : IP TRAFFIC PER MONTH, THROUGH 2018

Table 2 : IP TRAFFIC BY MARKET SEGMENT PER MONTH, THROUGH 2018

Table 3 : PER PORT WLAN PRICING TRENDS, THROUGH 2019

Table 4 : FORECAST FOR MARKET SHARE OF OPTICAL COMPONENTS BY CATEGORY, 2014 AND 2019

Table 5 : FORECAST FOR GLOBAL MARKET FOR OPTICAL COMPONENTS BY PRICE AND REVENUE, THROUGH 2019

Table 6 : TOP FIVE OPTICAL COMPONENT SUPPLIERS, 2019

Table 7 : NUMBER OF INTERNET USERS WORLDWIDE, 1993 TO 2014

Table 8 : GLOBAL INTERNET BACKBONE TRAFFIC PATTERNS, 1990-2014

Table 9 : INTERNET USAGE STATISTICS BY WORLD REGION, 2012

Table 10 : WIRELESS USAGE PATTERNS BY TYPE, 2014

Table 11 : CELLULAR NETWORK SUBSCRIBER GROWTH, 2010-2014

Table 12 : TOP TEN WIRELESS CARRIERS BY NUMBER OF SUBSCRIBERS, 2014

Table 13 : SONET/SDH DATA RATES AND LINE SPEEDS

Table 14 : STRUCTURE OF AN ATM CELL

Table 15 : GLOBAL MARKET FORECAST FOR TELECOMMUNICATIONS OPTICAL COMPONENTS, THROUGH 2019

Table 16 : TOP FIVE TELECOMMUNICATIONS OPTICAL COMPONENTS SUPPLIERS, 2014

Table 17 : GLOBAL MARKET FORECAST FOR 100G TELECOMMUNICATIONS OPTICAL COMPONENTS, THROUGH 2019

Global Market for Optical Network Semiconductor Components to Reach $7.6 Billion in 2019

200 Million Smart Home Safety and Security Devices by 2020

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Smart Home Safety & Security – A Market Dynamics Report”.  According to this report, competition is intensifying for smart home service providers. This market research report covers the global IP security/smart home market as well as smart home safety and security products and services in the managed services, retail and professional installer channels. 

“Cloud-based open platforms are disrupting and creating new opportunities for smart home services,” said Mareca Hatler ON World’s research director. “Consumers are demanding greater choices as well as lower costs and smart home service providers are responding through strategic alliances and open source initiatives.”

ON World’s recently completed survey with 1,000 U.S. adults found that 30% are likely to adopt a smart home system within three years. Over half would like to have at least two integrated smart home applications and 60% of these would like three or more integrated applications. For half the respondents, safety and security is the primary reason they would adopt a smart home system.

Consumers are most satisfied with smart garage door openers, motion sensors and door locks, according to ON World’s evaluation of 170 smart home safety and security products with 20,000 product reviews. Some of the fastest growing product segments include video doorbells, smart smoke detectors and multi-purpose motion sensors.

Open source initiatives such as the AllSeen Alliance, OIC and mozaiq operations aim to accelerate smart home IoT product development and ensure interoperability across applications and transport layers. The AllSeen Alliance has grown rapidly over the past two years with over 100 members including smart home software, hardware and platform market leaders and innovators such as AT&T, Cisco, D-Link, Icontrol Networks, Legrand, LG, Honeywell, Iris by Lowe’s, Microsoft, Muzzley and Technicolor.

By 2020, there will be 200 million Internet connected wireless smart home security and safety products installed worldwide. At this time, 53% will be sold through managed services providers down from three quarters this year as sales through the retail/DIY channel will increase faster.

“Smart Home Safety & Security – A Market Dynamics Report” covers the global IP security/smart home market including safety, security, HVAC/energy, lighting controls and others as well as 12 smart home safety and security product segments for the managed services, retail/DIY and professional installer channels. It includes the results from a survey with 1,000 U.S. consumers; an evaluation of 170 products and 20,000 reviews; a competitive analysis; and 6-year global forecasts for installed systems and devices, revenues for equipment, software and services, and annual unit shipments by market, product segment and technology.

Smart Home Safety & Security – A Market Dynamics Report

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View Report Contents: “Smart Home Safety & Security – A Market Dynamics Report”.

200 Million Smart Home Safety and Security Devices by 2020

Silicon Photonics Market Analysis by Products, Applications & Geography - Analysis & Forecast

Silicon Photonics is a relatively new technology which uses optical rays in order to transfer data between different computer chips and peripherals. New report covers particularly the markets for final products, devices and equipment that function on Silicon Photonics technology for six major application verticals namely: Telecommunications, Data communication, displays and consumer electronics, sensing, metrology, high performance computing and medicines. The silicon photonics market is expected to increase at a compound annual growth rate (CAGR) of 27.74% from 2014 to $497.53m by 2020.

Silicon photonics is being implemented by various companies in their product portfolios due to features such as high-speed data transfer and the integration of large data into a small device. With the help of silicon photonics, products such as optical waveguides, modulators, and photo-detectors can be integrated within a single device, providing a smaller form factor. In particular, wavelength division multiplexer filters (WDMF) and silicon optical modulators (SOM) have the highest share in the North American market currently. Thus, this shows that WDMF and SOM products in the silicon photonics market have great potential to grow over time.

The silicon photonics market is dominated by the North American region in terms of market size. Growing demand to transfer data as well as government funding in silicon photonics are motivating companies to launch silicon photonics products in the North American market, says the market research firm. However, the Asia-Pacific (APAC) region has been growing at the highest CAGR.

In terms of the competitive landscape, the market is witnessing new product launches and large-scale collaborations, as well as agreements and partnerships across the value chain, with a number of tier-one players around the globe, notes the report.

The report lists the major players in the silicon photonics market as Intel (USA), Hamamatsu Photonics, K.K (Japan), Finisar (USA), IBM (USA), Luxtera (USA), ST Microelectronics (Switzerland), 3S Photonics (France), Oclaro (USA), Mellanox Technologies (USA), and Infinera (USA).

The figure below shows the life-cycle analysis of the various silicon Photonics application sectors based on factors like the time-to-market and the key features of the products in the different application sectors.

Silicon Photonics Application Life-Cycle Analysis

Silicon Photonics Market Analysis

The figure above shows in detail the short-term, medium-term and long-term applications for silicon photonics products, against the different features of the products for each applications. Datacom application revenue will dwarf all the other sectors in the coming future. The low-power consuming feature and the high data transfer rate capabilities achieved using silicon photonics are the main reason for the growth in the Datacom sector in the near future.

In applications like Telecom (Long-haul and Metro/LAN applications), Bio-medical sensors, Fiber-to-the-home (FTTH) and others, the major advantage of using silicon photonics will be the durability of the products as compared to the current conventional substitutes. Thus these applications will emerge in the medium-term (5-7 years).

In the long-term (beyond 10 years), silicon photonics is expected to become a default component of digital communication at the chip-level and board-level. These will open up doors to high volume of production and sales in the future.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: Silicon Photonics Market Analysis by Products, Applications  & Geography – Analysis & Forecast.

Silicon Photonics Market Analysis by Products, Applications & Geography - Analysis & Forecast

Identifying Emerging and Disruptive Technologies - 2015 Roadmap

The iNEMI Roadmap has become recognized as an important tool for defining the “state of the art” in the electronics industry as well as identifying emerging and disruptive technologies.  It also includes keys to developing future iNEMI projects and setting industry R&D priorities over the next 10 years.

The 2015 Roadmap was developed by five Product Emulator Groups (PEGs) and 19 Technology Working Groups (TWGs). There is one additional chapter on Test, developed in 2013, also included.  The PEGs and TWGs are defined below. The TWGs responded to the inputs and requirements outlined by representatives of OEMs in the five Product Emulator Groups (PEGs). These groups included more than 500 direct participants from over 280 private corporations, consortia, government agencies, and universities in 20 countries.

Five Product Emulators for the 2015 Roadmap

Industry Sector	Product Characteristics
Automotive	Products that must operate in an automotive environment
Consumer/Office Systems	Driven by the need for maximum performance over a wide range of cost targets
High-End Systems	Products that serve the high-performance computing, server, data storage, networking, datacom and telecom markets
Medical	Products that must be highly reliable and, in some cases, support life-critical applications
Portable/Wireless	Produced in high volumes, cost is the primary driver; hand-held, battery powered products are also driven by size and weight reduction

 

The 2015 iNWEMI Roadmap  is now on sale. As the only industry roadmap that looks at the entire supply chain, the iNEMI Roadmap delivers in-depth information about the challenges and opportunities facing the electronics manufacturing industry over the next 10 years. It also provides direction regarding the technologies required to meet the ever-evolving needs of this rapidly diversifying and growing industry.

 

Identifying Emerging and Disruptive Technologies - 2015 Roadmap

European Manufacturing Spotlight: Trends, Innovations, and Growth

IPC President and CEO John Mitchell discusses the growth of the European manufacturing industry and how IPC supports IPC members through standards, education and advocacy efforts.

https://www.youtube.com/watch?v=N07iGd5zbsI

To achieve a high quality end product and maintain a competitive position in the marketplace, you need to infuse quality throughout the manufacturing process.

Did you know there is an IPC standard associated with nearly every step of printed circuit board production and assembly?  From design and purchasing to assembly and acceptance, Electronics.ca Publications offers IPC Standards to help you assure superior quality, reliability and consistency in the electronic assemblies that go into your product. Download IPC Standards Spec Tree – PDF file.

As with the manufacturing process — which uses a step-by-step approach – IPC standards also build upon one another. To achieve your desired results, it’s important to implement the appropriate IPC standards associated with each step of production.

IPC Standards are available from Electronics.ca Publications in English, German, French, Spanish, Chinese, Japanese, and other languages. IPC-Richtlinien in deutscher Übersetzung Les normes IPC en Français  Adquirir estándares de IPC  IPC 行业标准 (in Chinese) IPC から IPC ELECTRONICS.CA 標準を購入

Download IPC Standards Spec Tree – PDF File

Why Use IPC Standards in Your Manufacturing Process?

• Gain Control Over End Product Quality and Reliability — Quality and reliability are the cornerstones of competing in the marketplace and critical to your company’s reputation and profitability. By implementing IPC standards throughout the manufacturing process, you help ensure better performance, longer life and compliance with lead-free regulations.


• Improve Communication with Suppliers and Employees — IPC standards are the standards that your competitors, suppliers and EMS providers use. Working from an established IPC standard helps all of you to “speak the same language” — the language of the global electronic industry. In addition, using IPC standards eliminates confusion for employees, because they know they need to perform to an established industry standard.


• Help Contain Costs — Ensuring that your design and the bare boards you purchase comply with IPC standards allows you to produce electronic assemblies that meet stringent quality tests down the line, minimizing costly delays, rework and scrap.

The Most Popular IPC Documents are available from Electronics.ca Publications in PDF Format

Download IPC Standards

IPC A-610F – Acceptability of Electronic Assemblies
IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments.

IPC J-STD-001F – Requirements for Soldered Electrical and Electronic Assemblies
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies has emerged as the preeminent authority for electronics assembly manufacturing. The standard describes materials, methods and verification criteria for producing high quality soldered interconnections. The standard emphasizes process control and sets industry-consensus requirements for a broad range of electronic products. This revision now includes support for lead free manufacturing.

IPC A-620B – Requirements and Acceptance for Cable and Wire Harness Assemblies
Revision B is now available for the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies.

IPC-DRM-PTH-E
Now updated to Revision D of the latest IPC-A-610E and J-STD-001E – our Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections.

IPC-DRM-SMT-E
Useful as a training aid in the classroom or on the shop floor, DRM-SMT-E contains computer generated color illustrations of Chip component, Gull Wing and J-Lead solder joints.

IPC-J-STD-033C
J-STD-033 Provides Surface Mount Device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs.

IPC-J-STD-020D-1
IPC-J-STD-020D-1 standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress.

J-STD-075

J-STD-075 provides test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing.

IPC Collections:

IPC-C-103 – Electronics Assembly Standards Collection

IPC-C-1000 Essential Document Collection for Board Design, Assembly and Manufacture

IPC-C-108 Cleaning Guides and Handbooks Collection

Through Electronics.ca you can order IPC standards for printed circuit board design and manufacturing and electronics assembly, including handbooks, guidelines and IPC training videos.

Learn more about European manufacturing market and publications that provide informed perspective and relevant analysis of emergent technologies.

European Manufacturing Spotlight: Trends, Innovations, and Growth

Asian Semiconductor Equipment Suppliers to Lose Market Share in 2015

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Asian Semiconductor Equipment Suppliers: Markets, Market Shares, Market Forecasts”. According to this report, semiconductor equipment suppliers headquartered in Asia will drop from 36.6% of the global wafer front end (WFE) market in 2014.  Revenues generated in U.S. Dollar terms were $10.6 billion out of a global market of $29.2 Billion.

Listed below are the top 10 Asian semiconductor suppliers and their revenue.

Supplier	Country	2014 Revenues (US$Billions)
Tokyo Electron	Japan	4.7
Screen Semiconductor Solutions	Japan	1.1
Hitachi High-Technologies	Japan	0.9
Nikon	Japan	0.8
Hitachi Kokusai Electric	Japan	0.6
SEMES	Korea	0.5
Daifuku	Japan	0.3
NuFlare Technology	Japan	0.3
Tokyo Seimitsu	Japan	0.3
Murata Machinery	Japan	0.3
Source: The Information Network

“Share of revenues will drop to 33.4% in 2015, noted Dr. Robert Castellano, president of The Information Network, primarily due to the strong U.S. dollar, which has appreciated nearly 15% from 2014 levels.”

The report notes, for example, that Japan’s Tokyo Electron exhibited revenue growth of 16.3% in Yen for the first three quarters of CY 2015.  However, when converted to US Dollars, the universally accepted currency historically used for market share data in the semiconductor industry, revenues show a revenue growth of just 1.2%.

“The strong US Dollar not only impacts the Japanese suppliers, but other Asian suppliers and even European suppliers,” added Dr. Castellano.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View Report Contents: “Asian Semiconductor Equipment Suppliers: Markets, Market Shares, Market Forecasts“.

Asian Semiconductor Equipment Suppliers to Lose Market Share in 2015

Global LED Lighting Market Report

New research report entitled “LED Lighting – Global Strategic Business Report”  provides comprehensive review of market trends, drivers, issues, challenges, product launches and strategic industry activities of major companies worldwide. The report provides market estimates and projections in US dollars for major geographic regions including the US, Canada, Japan, Europe (France, Germany, Italy, UK, Spain, Russia, and Rest of Europe), Asia-Pacific (China, India, and Rest of Asia-Pacific), the Middle East and Latin America (Brazil and Rest of Latin America). Key general lighting applications analyzed in the report include Residential, Architectural, Commercial, Outdoor, and Others (include hospitality, and industrial applications, among others). Global market for LED Lighting in general lighting applications is forecast to reach US$19.8 billion by 2020, driven by favorable government policies, steadily declining average selling prices and enhanced efficiency levels.

LED, the technology that until recently provided backlight for flat panel television sets, mobile phones, tablet PCs, among others, is all set to dominate the global lighting market in the next few years. Key benefits of LED bulbs that are driving its mass adoption include lesser consumption of power, longer lifespan and lower environmental pollution throughout its life cycle. Supported by stabilizing macro-economic conditions, reduced prices and favorable industry standards, the market is fully set to enter the era of a golden period beginning from 2014. Despite their current dominance, fluorescent lamps are soon expected to give way to the rapidly growing popularity of LEDs. The pressing need around the world for conserving energy encourages the natural shift to LEDs. LED Bulbs enjoy greater adoption rates in countries where power costs are high. In countries where power is cheaper, penetration is expected to be relatively slower as there would be no urgency to shift to energy saving lamps.

Steady decline in average selling price, owing to shrinking manufacturing costs, will play an important role in future penetration and growth of LED lighting. LED chip prices are falling steadily resulting in close to 30% annual reductions in LED bulb pricing, transforming LEDs as an impressive general lighting choice. Demand for all LED lighting types, including LED spot lights, streetlights, luminaries, residential use light bulbs, and LED fluorescent tubes is set to increase manifold in the next few years.

Government policies banning inefficient lighting technologies represent a strong growth driver for LED adoption. The Korean government announced plans to increase the share of LEDs in the nation’s lighting source mix to about 30% by 2015. The Chinese government also plans to increase LED usage while the US government phased out sales and production of the most used fluorescent bulb in the nation, the T12 bulb. Penetration of LED lighting market is expected to be the fastest in outdoor and commercial lighting segments. Streetlights, spotlights and downlights are expected to witness high adoption of LED lighting in the next few years. Street lighting enjoys immense support from favorable government policies and by the end of 2015, LED penetration for streetlights is expected to reach more than 90%.

LED fluorescent tubes are all set to witness increased adoption riding on the feature of significant power savings of up to 50%. Particularly, the tubes will find increased usage in such applications where electricity is a major expenditure. Organic LEDs (OLEDs) represent one of the most important future growth areas for the LED industry. However, this much awaited technology is still in development stages for general lighting and its current use is limited to monitors, televisions and smartphone displays. Home automation represents another potential growth driver for LED lighting, where the technology is making the automation process easier and faster by incorporating personalized lighting in automated smart homes in an economical manner.

As stated by the new market research report on LED Lighting, Asia-Pacific represents the largest as well as the fastest growing market worldwide, driven primarily by China. Other major markets include the Europe, the United States and Japan. China represents one of the largest markets for all types of lighting including LED lighting mainly because of its huge population and a fast growing economy. The country is expected to witness accelerated LED adoption supported by government policies. China is also expected to subsidize LEDs to become the leading producer. Beijing has already set a goal of achieving 30% LED penetration in general lighting by 2015.

Major players covered in the report include Acuity Brands Inc., Bulbrite Industries Inc., Cree Inc., Crompton Greaves Ltd., Dialight plc, Feit Electric Company, General Electric Company, Havells India Limited, Koninklijke (Royal) Philips Electronics N.V., Larson Electronics LLC, LG Electronics, Lighting Science Group Corporation, Litetronics International Inc., Megaman, NVC Lighting Technology Corporation, OSRAM GmbH, Panasonic Corporation, Revolution Lighting Technologies Inc., Samsung Electronics Co., Ltd., Sharp Corporation, Standard Products Inc., Toshiba Corporation, Ultra LEDs Limited and Zumtobel Group.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: “LED Lighting – Global Strategic Business Report“.

Global LED Lighting Market Report

S. Korean and Taiwanese Companies Control 56% of Global 300mm Fab Capacity

Vast majority of that wafer capacity is local to those two countries.

Information in this Research Bulletin comes from the Global Wafer Capacity 2015-2019 Report, which was released this month.  The new report provides great detail regarding the current status and forecast of global wafer fab capacity.  More information found at the end of this bulletin.

South Korean and Taiwanese chip companies are well known for manufacturing prowess when it comes to efficiently fabricating huge amounts of IC wafers.  Most of the IC industry’s biggest fab facilities are located in these two countries.  Because of their fab operation and wafer fabricating expertise, IC companies headquartered in South Korea and Taiwan lead the way in capital-intensive segments of the IC industry such as high-unit-volume products like DRAM and flash memory or foundry services making ICs for companies without fabs and a growing number of companies with fabs.

Figure 1 shows that South Korea-based companies Samsung and SK Hynix currently account for 35% of global 300mm wafer capacity.  Samsung alone controls about 24% of all the world’s 300mm capacity.  When looking at 300mm wafer capacity according to fab location instead of headquarters location, 28% of worldwide capacity is in South Korea.  Samsung and SK Hynix both own big 300mm fabs outside of South Korea.  In fact, SK Hynix’s largest fab is in China.  Samsung also has a 300mm fab in China as well as two in the U.S.

Global 300mm Fab Capacity Report

Figure 1

Taiwanese companies currently manage 21% of the world’s 300mm capacity, with about 85% of that capacity being committed to foundry services.  The remaining 15% of Taiwan-controlled 300mm capacity is mostly used to produce memory devices.  The vast majority of the 300mm wafer capacity in Taiwan is owned by Taiwanese companies, with the only exception being the 300mm capacity that U.S.-based Micron gets from its Inotera joint-venture with Nanya and its wholly owned fab in Taichung acquired in 2013.  There is only one Taiwanese-controlled 300mm fab located outside of Taiwan and that is UMC’s fab in Singapore.

Figure 1 also shows that even though 15% of the world’s 300mm wafer capacity is located in the North America, 28% of global 300mm capacity is controlled by companies with North American headquarters.  Two other noticeable share differences in the comparison are in China and the ROW region, which in this case is essentially just Singapore and Israel.  The vast majority of 300mm wafer capacity in China and ROW is controlled by foreign companies.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: Global Wafer Capacity 2015-2019.

 

S. Korean and Taiwanese Companies Control 56% of Global 300mm Fab Capacity

Trending Terms Covering the Newest Emerging Technologies

What’s relevant for today’s OEM, EMS or ODM Company?

Each year, a new slew of terms and definitions become common place in the manufacturing process. To meet these needs, T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.

PURCHASE IPC T-50M NOW

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

 

IPC T-50M brings over 150 new terms, while eliminating out-of-date terminology in order to provide a streamlined standard that focuses on the trending language of the electronics industry. This revision includes terms often cited in other standards, such as:

• Conformal coating


• Statistical Process Control


• Stencil Design

Stay up to date with the trending terms covering the newest emerging technologies. Prepare for tomorrow’s discussions by purchasing T-50M today.

 

 

Trending Terms Covering the Newest Emerging Technologies

5G Wireless Ecosystem Research and Trial Investments to Reach $5 Billion by 2020

While LTE and LTE-Advanced deployments are still underway, wireless carriers and vendors have already embarked on R&D initiatives to develop so-called “5G” technology, with a vision of commercialization by 2020.

5G is essentially a revolutionary paradigm shift in wireless networking to support the throughput, latency, and scalability requirements of future use cases such as extreme bandwidth augmented reality applications and connectivity management for billions of M2M (Machine to Machine) devices.

Although 5G is yet to be standardized, some of the collectively accepted attributes of the technology include new air interface transmission schemes, new spectrum bands, spectrum aggregation, Massive MIMO, beamforming, D2D (Device to Device) communications and self-backhauling, among others.

Key findings:

• Driven by regional, national government, wireless carrier and vendor initiatives, we expect 5G Wireless Ecosystem R&D and trial investments will account for nearly $5 Billion by 2020, following a CAGR of nearly 40% over the next 5 years


• Nearly 70% of these investments will target large scale commercial trial networks in Japan, South Korea and other early pioneering countries


• Despite a lack of standardization, vendors are aggressively investing in 5G development efforts with a principal focus on new transmission schemes, antenna technologies, and higher frequency bands


• 5G networks are expected to utilize a variety of spectrum bands, ranging from established cellular bands to millimeter wave frequencies


• 5G standardization activities are expected to commence between 2015 and 2016

5G Wireless ecosystem research report covers the following topics:

• 5G requirements, use cases & vertical market applications


• 5G market drivers and barriers


• Air interface & antenna technologies: Massive MIMO, waveforms, phased array antennas & beamforming


• Spectrum technologies: Cognitive radio, spectrum sensing, aggregation & LSA (Licensed Shared Access)


• D2D communications & self-backhauling networks


• Complimentary technologies for 5G: NFV (Network Functions Virtualization), SDN (Software Defined Networking), HetNet (Heterogeneous Networking), C-RAN (Cloud RAN), drones & satellites


• Spectrum options for 5G


• Standardization & research initiatives


• Competitive assessment of vendor strategies & commitments to 5G


• 5G investment and subscription forecasts from 2015 till 2025

The “5G Wireless Ecosystem: 2015 – 2025 – Technologies, Applications, Verticals, Strategies & Forecasts” report presents an in-depth assessment of the emerging 5G ecosystem including key market drivers, challenges, enabling technologies, use cases, vertical market applications, spectrum bands, wireless carrier deployment commitments and vendor strategies. The report also presents forecasts for both 5G investments and subscriptions.

The report comes with an associated Excel datasheet suite covering quantitative data from all numeric forecasts presented in the report. Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: “5G Wireless Ecosystem: 2015 – 2025 – Technologies, Applications, Verticals, Strategies & Forecasts”.

 

 

5G Wireless Ecosystem Research and Trial Investments to Reach $5 Billion by 2020