Friday, November 21, 2014

New IPC Standards For Printed Circuit Boards

NEW IPC-A-610F Acceptability of Electronic Assemblies

IPC-A-610 is the most widely used standard for circuit board production in the world. IPC-A-610F illustrates acceptability requirements for electronic assemblies with over 814 colour images and illustrations. Topics include flex attachment, board in board, part on part, lead free, component orientation and soldering criteria for through-hole, SMT (new termination styles) and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements. This revision F includes two new SMT termination styles, and changes in plated-through hole fill and BGA void criteria. Major topics include flex attachment, board-in-board, part-on-part, both lead-free and tin-lead criteria, component orientation and soldering criteria for through hole, SMT, cleaning, marking, coating and laminate requirements. IPC Standards for printed circuit boards: order and download IPC A-610F

IPC-A-610 is invaluable for all inspectors, operators and trainers. Revision F has 814 photos and illustrations of acceptability criteria — 86 of them new or updated. The document is most often used with the material and process standard IPC J-STD-001.

NEW J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies

J-STD-001F is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for both traditional solder alloys and for lead-free manufacturing. Revision to plated-through hole, PTH, minimum fill requirements; criteria for two new SMT termination types; and expanded conformal coating criteria. Clarification of criteria descriptions for easier understanding. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity. This standard fully complements IPC-A-610F and is supported by IPC-HDBK-001. Order and  download IPC J-STD-001F

IPC-7527 Requirements for Solder Paste Printing

IPC-7527 covers the many aspects of solder paste application, from initial placement on the board through production and testing. To equipment operators, the new standard serves as a reference guide with more than 50 photos packed into the 15-page standard.  IPC-7527 provides the operators with a standard that will help them make the right decisions when they face issues in production, and no professionals or specialists are present.

While there are standards that detail what a completed assembly should look like, IPC-7527 is the first one to provide requirements for what the printed solder paste should look like and how far off centers can be before they’re considered defects. It covers everything from basic squeegees to jet dispensers and needle dispensers to closed print heads. In addition, IPC-7527 provides information on automated paste inspection using either cameras or lasers. Order and download IPC-7527.

IPC-7093 Design and Assembly Process Implementation for Bottom Termination components

This standard describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body. The BTCs in this document include all types and forms of bottom-only termination components intended for surface mounting. This includes such industry descriptive nomenclature as QFN, DFN, SON, LGA, MLP and MLF. The focus of the information is on critical design, assembly, inspection, repair, and reliability issues associated with BTCs.

The target audiences for this document are managers, design and process engineers, and operators and technicians who deal with the electronic design, assembly, inspection and repair processes. The intent is to provide useful and practical information to those companies who are using or considering tin/lead, lead free, adhesives or other forms of interconnection processes for assembly of BTC type components. Although not a complete recipe, the document identifies many of the characteristics that influence the successful implementation of robust and reliable assembly processes and provides guidance information to component suppliers regarding the issues being faced in the assembly process. Order and  download IPC-7093

IPC-7095C Design and Assembly Process Implementation for BGAs

Implementing ball grid array (BGA) and fine-pitch ball grid array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095C delivers useful and practical information to anyone currently using BGAs or FBGAs. Many issues have become especially important due to the change in the alloys of the ball, the ball shape, and the attachment procedures. The major emphasis of Revision C is to provide information on some of the new mechanical failure issues such as cratering or laminate defects caused after assembly.

In addition to providing guidelines for BGA inspection and repair, IPC-7095C addresses reliability issues and the use of lead-free joint criteria associated with BGAs. There are many photographs of X-ray and endoscope illustrations to identify some of the conditions that the industry is experiencing in the implementation of BGA assembly processes. Order and download IPC-7095C

IPC-7711/7721B Rework, Modification and Repair of Electronic Assemblies

This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. Order and download IPC-7711/7721B.

Purchase and Download IPC Standards For Printed Circuit Boards from Publications today!

Effective January 1, 2015, a price increase of 4 percent will be implemented on all standards.

IPC Standards For PCB Design and CADIPC Member


New IPC Standards For Printed Circuit Boards

CMP Consumables Market Resumes Sustainable Growth

The global CMP consumables market has resumed its growth trajectory prior to the 2008-2009 recession. At over $2.0B, 2013 CMP slurry and pad revenues are up 6.0% over 2012, and 2014 is projected to be up an additional 2.2%, according to a new report  “CMP Consumables 2014 – A Critical Materials Report“.  By 2019, the combined CMP pad and slurry market is expected to grow to $2.5B for a CAGR of 3.9% over this period.

The overall slurry market share of Cabot Microelectronics, the historical market leader, is estimated to be stable at just over 36% globally. Aside from Cabot, market ranking can be identified only in the context of a specific process application, as each segment functions as an independent market. This results in a highly fragmented slurry market with over a dozen suppliers, each with a significant market share in at least one process area. The pad market is still led by Dow Chemical with about two-thirds share globally. Cabot Microelectronics remains the only supplier clearly in the Tier 2 pad group with an estimated 9-10% share compared to 1-5% each for six others.

New product development continues to dominate the R&D budgets of slurry manufacturers as new device structures and material set combinations move into high volume chip manufacturing, including CMP processes related to FinFET and high-κ metal gate technologies. Defect reduction requirements and tighter specs on removal uniformity continue their relentless march to planarization perfection in order to satisfy the demands of device manufacturing below 20nm.

CMP Consumables Market ReportThe 2014 CMP Consumables Report includes supply chain segments on Slurries and Abrasives; Pads; Slurry Filters; Pad Conditioners; Post-CMP Cleaning Chemicals; PVA Brushes; Equipment; Retaining Rings; and Support Services. Reports on Process Flows, University Research and a CMP retrospective comprise the remaining three segments. Each section, including the popular Slurry and Pad reports, can be purchased separately, with a discount for purchase of the entire set:




CMP Consumables Market Resumes Sustainable Growth

Global Market for Transformers to Reach $48.3 Billion in 2019

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Global Markets for Transformers“.  The global transformers market is expected to grow to $48.3 billion by 2019, with a five-year compound annual growth rate (CAGR) of 7.3%.  The Asia-Pacific market, the fastest-growing region of the overall market, is moving at a significant 8.1% CAGR.

Tasked with the regulation of voltage output, transformers are critical to the electricity supply chain. Globally, the demand for this technology is driven by the increasing demand for electricity, replacement of older transformers, and environmental concerns, particularly in India and China.

Indeed, the Asia-Pacific region is the largest and fastest growing segment of the global market. Valued at just $13.2 billion in 2013, the Asia-Pacific market is expected to surge to $21.1 billion by 2019. Such rapid growth is attributed to improving economic conditions and the increasing use of the region as a hub for Western markets to outsource the manufacture of their transformers.

Meanwhile, the European and North American markets are projected to grow at a healthy CAGR of 7.2% and 5%, respectively.

The upgrading of existing networks and replacement of older transformers in Western regions offer a huge growth opportunity for the transformer market. This is especially the case for power and traction transformers, which have high performance properties to increase energy efficiency and reduce electricity losses. However, in the longer-term, the developing regions, including China, Brazil, India and others, will create huge opportunities for the transformer market with the increasing demand for electricity and increasing electricity production.

Increasing raw material prices and stricter environmental regulations on carbon emission levels have forced companies to focus on the development of advanced transmission technologies that will comply with current and future environmental regulations. The pressure to develop environmentally friendly transformers is increasing even in the Asia-Pacific and other developing regions.

GLOBAL MARKETS FOR TRANSFORMERS provides an overview of the global markets for transformers and related technologies. It includes analyses of global market trends, with data from 2013, estimates for 2014, and projections of CAGRs through 2019.






Global Markets for Transformers

Details of the new report, table of contents and ordering information can be found on Publications’ web site.  View the reportGlobal Markets for Transformers.


Global Market for Transformers to Reach $48.3 Billion in 2019

Endoscopy Equipment Market worth $37.9 Billion by 2018

The “Endoscopy Equipment Market by Endoscopes (Rigid, Flexible, Capsule), by Visualization Systems (HD, 3D Camera, Wireless Display & Monitor), Others Endoscopic Ultrasound, Carts), by Application (Colonoscopy, GI Endoscopy) – Global Forecasts to 2018” analyzes and studies the major market drivers and restraints in North America, Europe, Asia, and the Rest of the World.  This report studies the global endoscopy equipment market over the forecast period of 2013 to 2018. The market is estimated at $28.2 billion in 2013 and is expected to reach $37.9 billion by 2018, growing at a CAGR of 6.1% from 2013 to 2018.

The global endoscopy equipment market is categorized into two broad segments—products and applications. Based on products, the endoscopy market comprises endoscopes, visualization equipment, and other instruments and accessories. The endoscopes market is further segmented into rigid endoscopes, flexible endoscopes, surgical endoscopes, and capsule endoscopes.

The market for visualization equipment is further segmented into endoscopy cameras, video processors, video convertors, camera heads, light sources, wireless displays and monitors, transmitters and receivers, and others.

The market for other instruments is broadly segmented into electronic and mechanical instruments. The electronic instruments segment comprises insufflators, endoscopy fluid management systems, endoscopy ultrasound systems, and others. The mechanical instruments segment comprises biopsy forceps, graspers, snares, trocars and cannulae, endoscopic implants, and others. The report also includes the endoscopic accessories market, which comprises carts/trolleys, cleaning brushes, overtubes, fluid flushing devices, biopsy valves, and others.

Over the years, the demand for endoscopy has increased significantly because of the growing preference for minimally invasive surgeries. Apart from being minimally invasive, endoscopic procedures are also cost effective in terms of pre- and post-operation care costs and length of stay at hospitals. The technological advancements and breakthroughs in the field of endoscopy are expected to drive the global endoscopy equipment market in the coming years. The advancements in technology have resulted in several improvisations, including increased angles in the field of view in endoscopes, reduced outer diameters of scopes, endoscopy systems that are integrated with high-resolution technologies such as 3D systems, capsule endoscopes, and miniaturized endoscopy systems. The other factors that are driving the growth of the global endoscopy equipment market include the favorable reimbursement scenario in select geographies, the growing aging population, and the increasing prevalence/incidence of diseases that require endoscopy procedures.

North America holds the largest share of the global endoscopy equipment market, followed by Europe and Asia. However, the growth in the endoscopy market is likely to be focused on the fast-growing Asian region owing to increased healthcare spending by the government in China; the increasing number of endoscopic surgeries; the improving endoscopic infrastructure in India; the establishment of training centers for endoscopy in India, China, Japan, and others; wide support for endoscopy-related research activities in Japan; and increased patient awareness about minimally invasive surgeries (MIS) in Asia. The Rest of World (RoW) region—which includes South America, the Middle East and North Africa, and the Pacific countries—is likely to witness steady growth in the endoscopy market. This is due to the increasing focus of key players on the Middle Eastern countries and Brazil, the increasing number of endoscopy training workshops and investments in Australia, and several government initiatives in New Zealand to develop an efficient workforce for endoscopy services.

The major players in the global endoscopy equipment market include Ethicon (Johnson & Johnson) (U.S.), Olympus Corporation (Japan), Covidien Plc (Ireland), Karl Storz GmbH (Germany), Boston Scientific, Inc. (U.S.), Stryker Corporation (Japan), Cook Medical Incorporated (U.S.), Hoya Corporation (Pentax Medical System) (Japan), Fujifilm Holding Corporation (Fujinon) (Japan), Richard Wolf GmbH (Germany), Smith and Nephew, Inc. (U.S.), and Conmed Corporation (U.S.)

Details of the new report, table of contents and ordering information can be found on Publications’ web site.  View the Endoscopy Equipment Market Report.


Endoscopy Equipment Market worth $37.9 Billion by 2018

Wednesday, November 19, 2014

IPC Standards For PCB Design and CAD

IPC-7351B Requirements for Surface Mount Design and Land Pattern Standard

IPC-7351B includes both the standard and an IPC-7351B land pattern calculator on CD-ROM for accessing component and land pattern dimensional data. The calculator includes the document’s mathematical algorithms so users can build a land pattern for a corresponding surface mount part quickly and accurately.The tool also allows for modification of dimensional attributes of IPC approved land patterns.

This popular document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs, TSSOPs, QFPs, BGAs, QFNs and SONs. The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select a land pattern based on desired component density.

Revision B now includes land pattern design guidance and rules for component families such as resistor array packages, aluminum electrolytic capacitors, column and land grid arrays, flat lead devices (SOFL and SOTFL) and dual flat no-lead (DFN) devices. The revision also discusses the usage of thermal tabs and provides a new padstack naming convention that addresses the shape and dimensions of lands on different layers of printed boards.Purchasers also receive a 10-day trial of the IPC-7351 Land Pattern Wizard developed by Mentor Graphics, which is an advanced version of the IPC-7351B Land Pattern Calculator. The IPC-7351B Land Pattern Wizard tool enables users to not only save their land patterns within new land pattern library files, but also to instantly export land patterns to their preferred CAD format, such as Allegro, Board Station, Expedition, PADS, CADSTAR, OrCAD, Pantheon and P-CAD. 102 pages. Order and Download IPC Standard 7351B.

IPC-2221B Generic Standard on Printed Board Design

IPC-2221B is the foundation design standard for all documents in the IPC-2220 series and is included i the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer. Among the many updates to Revision B are new criteria for conductor characteristics, surface finishes, via protection, board electrical test, dielectric properties, board housings, thermal stress, compliant pins, panelization and internal and external foil thicknesses. Appendix A provides new test coupon designs used for lot acceptance and quality conformance testing. Order and Download IPC Standard 2221B.

IPC-2220 Set of IPC Standards for PCB Design and CAD

The series is built around the IPC-2221B, Generic Standard on Printed Board Design, the base document that covers all generic requirements for printed board design, regardless of materials. From there, the designer chooses the appropriate sectional standard for a specific technology. IPC-2221B and all five sectional standards are included with the series: IPC-2222A, Sectional Design Standard for Rigid Organic Printed Boards; IPC-2223C, Sectional Design Standard for Flexible Printed Boards; IPC-2224, Sectional Standard for Design of PWBs for PC Cards; IPC-2225, Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies; and IPC-2226, Sectional Design Standard for High Density Interconnect (HDI) Printed Boards. This series provides coverage on material and final finish selection, current carrying capacity and minimum electrical clearances, test specimen design, guidelines for V-groove scoring, dimensioning requirements and conductor thickness requirements. Order and Download IPC 2220 Family of Design Documents.


All IPC Standards are available from Publications

IPC Standards For PCB Design and CADIPC Member


IPC Standards For PCB Design and CAD

MEMS Applications For Medical, Automotive, Industrial And Defense Are Showing Healthy Growth

ELECTRONICS.CA PUBLICATIONS, the electronics industry market research and knowledge network, announces the availability of a new report entitled “Status of the MEMS Industry 2014“. According to this report, MEMS industry is expected to grow at a CAGR a 13% CAGR through 2019, resulting in a $24B MEMS market. Of the aforementioned applications, medical will have the largest individual CAGR (24%).

Indeed, medical is expected to be the fastest-growing MEMS market, driven by miniaturization, wireless communication and decreased power consumption. Many changes are contributing to this market dynamic. For example:

  • The demand for in-home digital blood pressure monitors is growing rapidly, as they allow hypertension patients to monitor their blood pressure levels at home

  • Accelerometers are emerging in patient activity monitoring systems

Microfluidics is still the largest market with different trends, for example:

  • Integration of sample preparation into the chip in order to obtain total analysis systems

  • Microfluidic chip cost reduction to address the disposable devices market through manufacturing techniques

  • Increased chip density for multiplexing, research applications and genome analysis

  •  Integration of functions mainly done at system level

  •  For dispensers, the largest growth is expected in the inhaler market, which might find applications outside the respiratory disease market

On the devices side, chemical MEMS, infrared sensors and new magnetic MEMS are also new opportunities. For example, the major changes in consumer applications will come from the adoption of chemical and humidity sensors in smartphones. With Samsung integrating Sensirion’s component in the Galaxy S4, we foresee consistent adoption of chemical sensors. Despite the suppression of this sensor from the S5 series, and even though no other smartphones currently integrate chemical sensing, we still expect progressive adoption of chemical sensors in smartphones beginning in 2016 with small volumes series first (CO2 sensors, etc.), and ramping-up in 2018.

These are just a few examples of factors driving the MEMS market. Our MIS 2014 report presents a deep analysis for every MEMS market: automotive, consumer, medical, defense, aeronautics, industrial and telecommunications.

MEMS Industry Report Details of the new report, table of contents and ordering information can be found on Publications’ web site. View the report: Status of the MEMS Industry 2014.



• Understanding of MEMS markets and applications

• Understanding of MEMS players’ strategies

• Evolution of competitive environment

• Analysis of MEMS technology challenges

• Analysis of the latest M&As and startups


• 2013-2019 MEMS markets (in units, $US and wafers)

• 2013 MEMS players ranking

• Description of 2013 MEMS applications: automotive, consumer, medical, defense, aeronautics, industrial, telecommunication

• Overview of current MEMS challenges: size reduction, cost pressure, packaging issues, new sensing principles, future manufacturing technologies

• Analysis of possible future technologies for sensors and MEMS

• Dedicated MEMS production analysis

• All MEMS devices and applications (220+ applications) are covered

COMPANIES CITED IN THE REPORT (non-exhaustive list)

AAC, Abbott, Advanced Micro Sensors, Advanced Thin Films, Aichi Mi, AKM, Alps Electric, Analog Devices, Apple, Asia Pacific Microsystems, ASMC, Autoliv, Avago Technologies, Axiom IC, Baxter, BD, Biocus Life Science, Bluechiip, BlueGnome, BMW, Boehringer Ingelheim microParts, Boston Scientific, Broadcom, bruco, Caliper Life Science, CANON, Cepheid, Colibrys, Consenic, Continental, CSMC, Delphi, DENSO, Digital Optics Corp, Discera, DNP, Domintech Technology, DRS, ELA Medical, EPCOS, Excelitas, First Sensor, FLIR Systems, FormFactor, Freescale Semiconducteurs, GE Healthcare, GE Sensing, Gettop, GLOBALFOUNDRIES, GoerTek, Goodrich-AIS, GSMC, GWIC, Hamamatsu, Handylab, Hewlett-Packard, Hillcrest Labs, Hitachi, HMT, Honeywell, Hosiden, HTC, Huigin, IMT, Infineon Technologies, Insound Medical, Intersil, InvenSense, JDS Uniphase, Kaiam, Kionix, Kistler, Knowles Electronics, Kulite, L3 com, Lab 901, Lemoptix, Lexmark, Life Technologies, Luxtera, Magnity, Magnotec, Maradin, MAS Oy, Maxim, mCube, Measurement Specialties, Mediatek, Medtronic, Meggitt’s Endevco, Melexis, Memjet, MEMS Foundry Itzehoe GmbH, MEMSCAP, MEMSENSING, MEMSIC, Micralyne, Micrel, Microfluidics International Corp., MicroLife, Micronics, MicroProbe, Microstrain, Microvision, Milwaukee Tools, MIRAMEMS, Mirrorcle, Motorola, Movea, MuOptics, MURATA, NetCrystal, Nike, Nintendo, Nippon Signal, Nokia, OLIVETTI, OLYMPUS, Omron, Panasonic, Phonak, Pioneer, Pixtronix, poLight, PYREOS, QMT, Quantalife, Raytheon, Respitronix, ROBERT BOSCH, Roche, Samsung, Santec, SCD, SEIKO EPSON, SEMEFAB, Senlution, SENODIA, SENSATA, Sensirion, Sensonor, Si Time, SigmaTech Inc, SiLabs, Silex Microsystems, SILICON SENSING SYSTEMS, Si-Ware, SMIC, SONY, Sorin, St Jude Medical, STMIicroelectronics, SYSTRON DONNER INERTIAL, Tamarack Scientific, Teledyne DALSA, Terumo, Tessera, Texas Instruments, The SmartPill Corporation, Touch Micro-system, Tronics Microsystems, TriQuint, Tronics Microsystems, TSMC, ULIS, UMC, UTC Aerospace Systems, VERATAG, Wavelens, WiSpry, WOLFSON, Xfab, Xsens, Yamaha, Yongsheng, ZMDI and many more.

MEMS Applications For Medical, Automotive, Industrial And Defense Are Showing Healthy Growth

iNEMI Roadmap 2014 New Initiatives

iNEMI (International Electronics Manufacturing Initiative) has identified nine new topics to be pursued for new project development this year. The potential projects are diverse, ranging from automotive (new materials and specifications for high-power and high-density PCBs used under the hood), to medical electronics (testing of implantable devices), to recommendations for high-reliability soldering of QFN-type packages for high-reliability applications.

How Initiatives were Identified

These new initiatives were identified through a survey of iNEMI members and the electronics industry at large to determine support for potential initiatives identified by the 2013 Roadmap and in subsequent gap analysis discussions.

We received input from 165 individuals representing a good mix of companies up and down the supply chain, along with research institutes and universities, and with strong input from all three major geographic regions.

Factors in the Final Choice

In making the final determination, we looked for critical mass in the number of organizations that indicated an interest in participating in a specific initiative, and assessed the potential leadership for these efforts. We also assessed our members’ interests and needs, along with several other factors.

Next Steps

We will develop formation teams for these nine initiatives between now and the end of Q2. People who volunteered to co-chair and who indicated interest in a specific topic will be asked to participate in the initial Statement of Work (SOW) definition. When the draft SOW is in place, we will issue a call for participation to all other interested parties.

The iNEMI Roadmap has become recognized as an important tool for defining the “state of the art” in the electronics industry as well as identifying emerging and disruptive technologies.  It also includes keys to developing future iNEMI projects and setting industry R&D priorities over the next 10 years.

The roadmap identifies major trends in the evolution of technology across numerous disciplines, with an emphasis on identifying potentially disruptive events (business and technology). It provides the information needed to identify critical technology and infrastructure gaps, prioritize R&D needs to meet those gaps, and initiate activities that address industry needs.

Through its roadmaps, iNEMI charts future opportunities and challenges for the electronics manufacturing industry.  Current version, the 2013 iNEMI Roadmap is the most comprehensive roadmap published to date by the International Electronics Manufacturing Initiative (iNEMI).  The 2013 Roadmap was developed by 20 Technology Working Groups (TWGs) in response to inputs regarding technology needs from representatives of OEMs in six Product Emulator Groups (PEGs).

iNEMI Roadmap 2013  can also be purchased by chapters from Publications:

Product Emulator Groups

Business Technologies

Manufacturing Technologies


iNEMI Roadmap 2014 New Initiatives