Friday, November 27, 2015

Military Communications Market: A $40 Billion Opportunity

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “The Military Communications Market: 2015 – 2030 – Opportunities, Challenges, Strategies & Forecasts”. According to this study, the military communications market will account for over $40 Billion in revenue by 2020. Armed forces throughout the globe rely on communication systems to enable information sharing and securely stay in constant contact. The role of these systems continues to grow in importance, with new mission areas such as the control of unmanned vehicles and time-critical targeting heavily reliant on network connectivity.

Despite pressures on overall defense expenditure, a universal trend towards network centric warfare combined with an unstable geopolitical landscape, is continuing to drive significant investments in military communications. The market is expected to account for over $40 Billion in revenue by the end of 2020, with investments ranging from the adoption of multi-band and multi-mode tactical radio systems, to the integration of ad hoc networking platforms in unmanned vehicles.

The “Military Communications Market: 2015 – 2030 – Opportunities, Challenges, Strategies & Forecasts” report presents an in-depth assessment of the military communications ecosystem including key trends, market drivers, challenges, enabling technologies, regional investment landscape, submarkets, leading applications, opportunities, future roadmap, value chain, ecosystem player profiles and strategies. The report also presents market size forecasts for military communications from 2015 through to 2030. The forecasts are segmented for 6 submarkets, 3 service branch classifications, 5 regions and 50 leading countries.Military organizations worldwide are increasingly moving away from proprietary, one-off, unique communication systems that are expensive in favor of similar, and often more advanced, systems readily available in the commercial marketplace at reduced costs from a variety of vendors.

Military Communications Market

Military Communications Market

The report will be of value to current and future potential investors into the military communications market, as well as armed forces, system integrators and vendors who wish to broaden their knowledge of the ecosystem.  Details of the new report, table of contents and ordering information can be found on Publications’ web site.  View the report:The Military Communications Market: 2015 – 2030 – Opportunities, Challenges, Strategies & Forecasts“.

Military Communications Market: A $40 Billion Opportunity

Key Nano-technologies and Markets in 2015 and Beyond

Nanotechnology and nanomaterials are key enablers for a whole new generation of products and processes, some of which have come onto the market in 2014 in sectors such as consumer electronics.

Key Nano-technologies and MarketsThe Nanotechnology Industry Review and Prospects Report is a comprehensive guide to materials, markets and products in nanotech over the past 12 months and future developments. This publication details leading developments within the industry during this period.

2014 witnessed numerous major advances enabled by nanomaterials in consumer electronics (quantum dots), medicine and coatings technology. The number of nanocellulose and graphene producers and applications developers has grown significantly. Other 2D nanomaterials are now the focus of widespread research.

The Nanotechnology Industry Review and Prospects Report focuses on the leading nanomaterials under development, with coverage on carbon nanotubes, graphene, quantum dots, nanocellulose and other key markets such as titanium dioxide nanoparticles and nanosilica. There are contributions from leading nanotech companies in the materials and coatings sectors, alliowing readers a unique market insight into these exceptional materials.

All the key breakthroughs and business developments in 2014 in graphene, carbon nanotubes, nanomedicine, nanocellulose, nanocoatings, nanomaterials regulation, nanowires, quantum dots and energy are covered. This publication provides a comprehensive review of the state of the nanotech sector at present, it’s development, and future prospects. Strategic analysis of the key global markets nanotech will impact is the core theme.

Key Nanomaterials Markets in 2015

  • Nanomaterials in the Li-ion battery market

  • The graphene market

  • Keys to success in graphene

  • Graphene in healthcare

  • Nanomaterials in 3D printing

  • Nanomaterials in Displays

  • Nanomaterials in Filtration

  • Nanomaterials in Energy

  • The Nanocoatings Market

  • Anti-fingerprint nanocoatings

  • Nanocoatings in the automotive industry

  • Nanocoatings in aerospace and aviation

  • Nanocoatings in construction and exterior protection

  • Nanocoatings in consumer electronics

  • Nanocoatings in sanitary and cleaning 54 Nanocoatings in the oil and gas sectors

  • Nanocoatings in the marine industry

  • Nanocoatings in the textile industry

  • Medical nanocoatings

  • Waterproof nanocoatings

  • Quantum Dots in Displays

Key Nanomaterials in 2015

  • Self-Healing nanocoatings

  • Gold nanoparticles

  • The Carbon nanotubes market

  • Single-walled carbon nanotubes prospects

  • Fullerenes

  • Nanosilver

  • Nanowires in electronics

  • Nanozirconia producers

  • Titanium dioxide nanoparticles

  • Nanoparticle inks for printed electroncs

  • Plasma nanocoatings

  • Nanosilica

  • Cellulose nanocrystals

Key Industry Developments in the last 12 months

  • Graphene industry developments

  • Nanomedicine industry developments

  • Nanomaterials regulation

  • Carbon nanotubes industry developments

  • Nanowires industry developments

  • Quantum dots industry developments

  • Nanocoatings industry developments

  • Nanoenergy industry developments

  • Nanocellulose industry developments

Learn more about nanotechnology and nanomaterials market and publications that provide informed perspective and relevant analysis of emergent technologies.


Key Nano-technologies and Markets in 2015 and Beyond

Wednesday, November 25, 2015

Identifying Emerging and Disruptive Technologies - 2015 Roadmap

The iNEMI Roadmap has become recognized as an important tool for defining the “state of the art” in the electronics industry as well as identifying emerging and disruptive technologies.  It also includes keys to developing future iNEMI projects and setting industry R&D priorities over the next 10 years.

The 2015 Roadmap was developed by five Product Emulator Groups (PEGs) and 19 Technology Working Groups (TWGs). There is one additional chapter on Test, developed in 2013, also included.  The PEGs and TWGs are defined below. The TWGs responded to the inputs and requirements outlined by representatives of OEMs in the five Product Emulator Groups (PEGs). These groups included more than 500 direct participants from over 280 private corporations, consortia, government agencies, and universities in 20 countries.

Five Product Emulators for the 2015 Roadmap

Industry Sector Product Characteristics
AutomotiveProducts that must operate in an automotive environment
Consumer/Office SystemsDriven by the need for maximum performance over a wide range of cost targets
High-End SystemsProducts that serve the high-performance computing, server, data storage, networking, datacom and telecom markets
MedicalProducts that must be highly reliable and, in some cases, support life-critical applications
Portable/WirelessProduced in high volumes, cost is the primary driver; hand-held, battery powered products are also driven by size and weight reduction


Identifying Emerging and Disruptive Technologies

Advanced Technology RoadmapThe 2015 iNWEMI Roadmap  is now on sale. As the only industry roadmap that looks at the entire supply chain, the iNEMI Roadmap delivers in-depth information about the challenges and opportunities facing the electronics manufacturing industry over the next 10 years. It also provides direction regarding the technologies required to meet the ever-evolving needs of this rapidly diversifying and growing industry.


Identifying Emerging and Disruptive Technologies - 2015 Roadmap

Some Questions Answered About IPC J-STD-001F and IPC A-610F

Two leading standards for the electronics assembly industry have been revised. IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies is recognized worldwide as the sole industry-consensus standard for soldering processes and materials. IPC-A-610FAcceptability of Electronic Assemblies, is a post-assembly acceptance standard used to ensure electronics assemblies meet the most current acceptance requirements.

Some significant changes to IPC-J-STD-001F and IPC-A-610F standards include:

  • Requirements added for two new SMT terminations
    • P-Style terminations

    • Butt/I terminations — Solder charged terminations

  • Revised Class 2 plated-through hole vertical solder fill requirements

  • Revised void criteria for BGA/CSP components

  • Revised class 2 flux activity criteria

  • Improved language for ease of readability and understanding

  • Revised soldering requirements for plastic SMT components

  • Expanded conformal coating section

  • New photos added for clarity

  • Simplified Imperial English dimensions utilized in the documents

  • Explicit to IPC J-STD-001, revised appendices including guidelines for soldering tools and equipment and objective evidence on material compatibility

Doenload IPC-J-STD-001F and IPC-A-610F PDFThe changes listed above are only some of the highlights of J-STD-001F and IPC-A-610F. In order to stay current with best practices in the electronics assemblies industry you need the most current standards, J-STD-001F and IPC-A-610F.

Some Questions Answered About IPC J-STD-001F and IPC A-610F

Monday, November 23, 2015

International Economic Outlook: Will High Risk Events Trigger a Recession?

Will High Risk Events Trigger a Recession?

In the worldwide business cycle, the group of the English-speaking countries has led historically global economic activity. Monthly predictive analytics signal an underlying weakness for several months in the English-speaking countries, which have posted negative or steadily declining growth rates in their leading indicators.

Globally, trade predictive analytics, which summarize worldwide merchandize exports, clearly point out an undergoing global slowdown contradicting the media created myth of transitory snowstorms in New England as the cause of an economic downswing in the United States in the first quarter of this year. In March of this year, global exports, on a year-to-year basis, declined by 12.4%, the sixth consecutive monthly decline in a row following an expansion since October 2014.  On a quarterly basis, in the first quarter of 2015 global exports dropped 10.2% from a year ago to $3.7 trillion, following a 2.6% decline in the last quarter of 2014. A major trigger for such dramatic changes in each county’s business cycle has been the “burst” of the oil-price bubble coupled with currency realignments from the strengthening of the US dollar as well as a slowdown in the growth in emerging economies.

In addition to geopolitical risks related to Middle East and Eastern Europe, there is high probability of bursting this year one or more  policy-created bubbles.  A hard landing in China from housing prices and/or stock market corrections; disintegration of the Euro Area; high debt to income ratios – both private and public – in several countries; and the timing of an exit from an ill-conceived and permanent-perceived monetary policy of zero interest rates in the United States. Any of these events may trigger a significant correction in stock markets leading to another major recession with no tools left for economic policy. …Assigning a 40% probability that any of these events will come suddenly into play this year .

By Evangelos Otto Simos, Ph.D.


International Economic Outlook: Will High Risk Events Trigger a Recession?

Download IPC Standards - Everything You Need From Start To Finish

To achieve a high quality end product and maintain a competitive position in the marketplace, you need to infuse quality throughout the manufacturing process.

Did you know there is an IPC standard associated with nearly every step of printed circuit board production and assembly?  From design and purchasing to assembly and acceptance, Publications offers IPC Standards to help you assure superior quality, reliability and consistency in the electronic assemblies that go into your product. Download IPC Standards Spec Tree – PDF file.

As with the manufacturing process — which uses a step-by-step approach – IPC standards also build upon one another. To achieve your desired results, it’s important to implement the appropriate IPC standards associated with each step of production.

Why Use IPC Standards in Your Manufacturing Process?

  • Gain Control Over End Product Quality and Reliability — Quality and reliability are the cornerstones of competing in the marketplace and critical to your company’s reputation and profitability. By implementing IPC standards throughout the manufacturing process, you help ensure better performance, longer life and compliance with lead-free regulations.

  • Improve Communication with Suppliers and Employees — IPC standards are the standards that your competitors, suppliers and EMS providers use. Working from an established IPC standard helps all of you to “speak the same language” — the language of the global electronic industry. In addition, using IPC standards eliminates confusion for employees, because they know they need to perform to an established industry standard.

  • Help Contain Costs — Ensuring that your design and the bare boards you purchase comply with IPC standards allows you to produce electronic assemblies that meet stringent quality tests down the line, minimizing costly delays, rework and scrap.

The Most Popular IPC Documents are available from Publications in PDF Format

Download IPC Standards

IPC A-610F – Acceptability of Electronic Assemblies
IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments.

IPC J-STD-001F – Requirements for Soldered Electrical and Electronic Assemblies
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies has emerged as the preeminent authority for electronics assembly manufacturing. The standard describes materials, methods and verification criteria for producing high quality soldered interconnections. The standard emphasizes process control and sets industry-consensus requirements for a broad range of electronic products. This revision now includes support for lead free manufacturing.

IPC A-620B – Requirements and Acceptance for Cable and Wire Harness Assemblies
Revision B is now available for the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies.

Now updated to Revision D of the latest IPC-A-610E and J-STD-001E – our Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections.

Useful as a training aid in the classroom or on the shop floor, DRM-SMT-E contains computer generated color illustrations of Chip component, Gull Wing and J-Lead solder joints.

J-STD-033 Provides Surface Mount Device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs.

IPC-J-STD-020D-1 standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress.


J-STD-075 provides test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing.

IPC Collections:

IPC-C-103 – Electronics Assembly Standards Collection

IPC-C-1000 Essential Document Collection for Board Design, Assembly and Manufacture

IPC-C-108 Cleaning Guides and Handbooks Collection

Through you can order IPC standards for printed circuit board design and manufacturing and electronics assembly, including handbooks, guidelines and IPC training videos.

Download IPC Standards - Everything You Need From Start To Finish

Friday, November 20, 2015

Rigid PCB Industry Report: Global Top 40 Rigid PCB Companies by Revenue

2014 was a good year for majority of PCB companies, as output value of PCB industry touched USD59.6 billion, rising 3.7% against 2013, the fastest growth rate since 2011. Looking forward to 2015, a collapse in prices of commodities, especially in that of copper, will significantly reduce raw materials costs of PCB companies, thus further driving their profit margins.

In 2014, in key regions of PCB manufacturing, euro, NTD, and yen all depreciated sharply, while the won appreciated, dealing a heavy blow to South Korean PCB industry and cutting profit margins of the country’s PCB companies, which all suffered declines in revenue and profit margins, no exception for Samsung’s SEMCO, whose revenue from PCB business glided 2.4%, revenue from IC Carrier business dropped by 19%, and operating margin fell to below 1% from about 9%.

Global Top 40 Rigid PCB Companies by Revenue, 2012-2014 (USD mln)

Rigid PCB Industry Report

Taiwanese companies and European ones, benefiting from currency devaluation, saw a surge in profit margins, while Japanese peers didn’t gain from yen depreciation, as more than half of their production bases are located in foreign countries, but still performed better than South Korean counterparts.

HDI was still a main engine of growth in rigid PCB field in 2014, and is expected to maintain the momentum in 2015. As mobile phone screens become larger, PCB for mobile phone has to react accordingly. To ensure light weight and thinness of mobile phone, the demand for more advanced Anylayer HDI increases tremendously. As Anylayer HDI technology is time- and -capacity consuming, combined with Panasonic’s withdrawal from Anylayer HDI field, various PCB companies will expand Anylayer HDI capacity in 2015. In 2014, the company registered largest growth in revenue from HDI PCB business was Taiwanese Compeq, which boasts customers like Apple and Xiaomi with impressive performance, jumping by 28.3% to USD690 million, one step away from industry leader Unimicron.

Another spotlight in 2014 was PCB for server. With further penetration of internet economy, the coming of big data era, and influx of large amounts of capital into network economy, the demand for server ushers in explosive growth. PCB for server requires high Tg and low Loss, with layer growing more higher, up to 28, driving continuous increase in unit price of PCB for server since 2009. The companies that specialize in PCB for server, such as Taiwanese WUS Printed Circuit and ACCL, accomplished good results, with WUS Printed Circuit’s revenue ascending by 20% and ACCL’s 27%.

Regarding rigid PCB, LED lighting stimulated demand for metal PCB with good heat elimination performance. Taiwanese T.P.T, GIA TZOONG, and mainland Chinese Shenzhen Kinwong Electronic, which are skilled in metal PCB, all enjoyed a decent level of growth. In addition, PCB for automobile also did a good performance.

The most sensational event in PCB industry in 2014 was the merger of TTM and Viasystems. The combined company is absolutely No. 1 manufacturer with total revenue approximating USD2.5 billion. TTM enjoys a strong position in cellular phone and networking/telecom, and Viasystems in automotive and industrial fields, showing a perfect complementation.

Details of the new report, table of contents and ordering information can be found on Publications’ web site.  View the report: Global and China Rigid PCB Industry Report, 2015.

Rigid PCB Industry Report: Global Top 40 Rigid PCB Companies by Revenue