Wednesday, November 26, 2014

Electric Double Layer Capacitors Market Report

According to Electrochemical Double Layer Capacitors Market Report, the EDLC super capacitors market will be worth over $11 billion in ten years. This broad-ranging report on supercapacitors and supercabatteries has up to date ten year forecasts and analysis of market, applications, technology, patent and profit trends and the manufacturers and researchers involved.


55% of the manufacturers and intending manufacturers of supercapacitors/supercabatteries (EDLC, AEDLC) are in East Asia, 28% are in North America but Europe is fast asleep at only 7%. Yet, being used for an increasing number of purposes in electric vehicles, mobile phones, energy harvesting, renewable energy and other products of the future, this market is roaring up to over $11 billion in ten years with considerable upside potential.


This report concerns Electrochemical Double Layer Capacitors (EDLCs). For brevity, we mainly use the second most popular word for them – supercapacitors. The third most popular term for them – ultracapacitors – is often used in heavy electrical applications. Included in the discussion and forecasts are so-called Asymmetric Electrochemical Double Layer Capacitors (AEDLCs) better known as supercabatteries. The report also features patent trends of supercapacitor technologies.


Supercapacitors are a curiously neglected aspect of electronics and electrical engineering with a multi-billion dollar market rapidly emerging. For example, for land, water and airborne electric vehicles, there are about 200 serious traction motor manufacturers and 110 serious traction battery suppliers compared to just a few supercapacitor manufacturers. In all, there are no more than 66 significant supercapacitor manufacturers with most concentrating on the easier small ones for consumer electronics such as power backup. However, in a repetition of the situation with rechargeable batteries, the largest part of the market has just become the heavy end, notably for electric and conventional vehicles.


Supercapacitors and supercabatteries mainly have properties intermediate between those of batteries and traditional capacitors but they are being improved more rapidly than either. That includes improvement in cost and results in them not just being used to enhance batteries but even replacing batteries and capacitors in an increasing number of applications from renewable energy down to microscopic electronics. For example, your mobile phone may have better sound and flash that works at ten times the distance because a supercapacitor has taken over these functions from conventional capacitors.


Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: Electrochemical Double Layer Capacitors: Supercapacitors 2014-2024.


 



Electric Double Layer Capacitors Market Report

Global Tablet PC Shipments to Reach 455 Million by 2017

Falling prices and advances in display technology will lead to higher shipments of tablet PCs, which will increasingly replace notebook PC shipments in 2014 and beyond. According to the DisplaySearch Quarterly Mobile PC Shipment and Forecast Report, global tablet PC shipments will rise to 315 million in 2014, comprising more than 65% of the market. By 2017 tablet PC shipments will climb to 455 million, encompassing nearly 75% of the mobile PC market.


The worldwide tablet PC average selling price (ASP) is expected to fall from $311 in 2014 to $296 in 2017, which will help increase adoption, particularly in emerging regions where first-time PC buyer penetration rates are the highest. As new technologies and features hit the market, consumers will have more options to choose from, including AMOLED and other display technologies, a greater variety of screen sizes, and higher resolutions.


Following weaker than expected shipment demand from the back-to-school and holiday seasons in 2013, notebook PC brands have reduced their shipment estimates for 2014, with an expected decline of nearly 7% Y/Y. Also, with penetration of less than 10% for 2013, touch panel integration in notebook PCs has not increased demand as much as expected. The result is weaker than expected demand for standard notebook PCs and ultra-slim PCs. Standard notebook PC shipments will decline from 155 million in 2013 to 105 million in 2017. Ultra-slim PC shipments will rise from 26 million in 2013 to 57 million in 2017.


The weak shipment forecast is forcing brands to re-evaluate their pricing strategies, and a rise in selling prices is expected. Features such as new designs and higher resolution displays will be used to justify higher selling prices. Standard notebook PC prices are expected to rise from $667 in 2013 to $693 in 2014, while ultra-slim PC prices are expected to rise from $885 to $936 in 2014.


In the tablet PC market, oxide, LTPS, AMOLED, and other emerging screen technologies, as well as 8.4”, 10.5”, and other new sizes, are expected to give brands increased flexibility to offer more differentiated products to consumers. At the same time, strong market trends continue to drive shipment growth. The shift towards smaller sizes continues to enable lower price points in emerging regions (i.e., Eastern Europe, China, Asia Pacific, Latin America, and Middle East and Africa), which will account for more than 60% of worldwide shipments in 2014. Tablet PCs with screens smaller than 9” will comprise approximately two-thirds of overall shipments in 2014. The most tablet PC market share will go to 7” screens, exceeding 30% by 2017.


Emerging regions will account for an increasing share of worldwide mobile PC shipments, growing from 57%, or 274 million in 2014, to 62%, or 385 million, by 2017. Growth will be led by tablet PCs, which will account for 70% of mobile PC shipments to emerging regions in 2014. Nearly half of tablet PC shipments into emerging regions in 2014 will be devices retailing for less than $200.


The DisplaySearch Quarterly Mobile PC Shipment and Forecast Report delivers insight and data into worldwide and regional mobile PC shipments for both global and regional brands.



Global Tablet PC Shipments to Reach 455 Million by 2017

Monday, November 24, 2014

3D NAND Cost and Investment Implications

The NAND flash industry is on the cusp of a technology inflection point.  2D NAND is reaching its scaling limits with 3D NAND its anointed successor.


In the 2D NAND era, the underlying process technology (with a few exceptions) is essentially the same amongst all the NAND flash manufacturers.


However, in the 3D NAND era, all the NAND flash manufacturers are developing different 3D NAND concepts with variations in the process implementation. The different processes will impact the investment and manufacturing cost for each of the 3D NAND technologies.


This report provides a detailed analysis of the fab and manufacturing implications of 3D floating gate and charge trap NAND concepts from Samsung, Toshiba, SK Hynix and Intel-Micron versus 16nm 2D NAND.  The analysis is based on a bottoms-up process flow analysis for each 3D NAND technology and 16nm 2D NAND.


Some of the questions addressed in this report include:


– What are the main drivers of the process complexity for 2D NAND and 3D NAND?

– What is the tool commonality between 3D NAND and 2D NAND?

– What is the cost impact of moving the CMOS under the array in 3D NAND?

– How much does it cost to build a Greenfield 3D NAND fab and how does it compare to a 2D NAND fab?  What is the equipment footprint required and the breakdown of the investment by process modules?

– What is the front end manufacturing cost of a 3D NAND wafer compared to a 2D NAND wafer?

– What is the investment required to convert an existing 2D NAND fab to 3D NAND?  What is the impact on the fab cycle time and manufacturing capacity?

– What is the incremental investment required to transition a 32 layer 3D NAND fab to 64 layers?  What is the impact on fab cycle time and manufacturing capacity?


3D NAND Cost 3D NAND Cost and Investment Implications


Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report:  Cost and Investment Implications of 3D NAND.


 



3D NAND Cost and Investment Implications

Global GaN Semiconductor Industry Report

Gallium Nitride is an upcoming alternate material to pure silicon in the field of semiconductors and electronics. Several advanced features of gallium nitride proved useful for semiconductors such as high-brightness emission and intensity when used in opto-semiconductors. High power efficiency, superior high frequency handling capacity, and flexibility are generally used in opto-semiconductors alongside various substrates such as Si, sapphire, SiC were discovered. Extensive research studies took place in the past decade to utilize gallium nitride for semiconductor devices and electronic systems in two major segments – power-semiconductors and opto-semiconductors. 


The penetration of GaN was the first in opto-semiconductors in 2001, followed by power semiconductors (merging both, pure-power and RF-power semiconductors) in 2007. Commercialization of GaN power semiconductors (discretes and ICs) started at a medium scale in 2008. While the penetration growth rate is healthy and substantial in opto-semiconductors, the penetration rate in power semiconductors is explosive. One of the prime reasons for this is the growing application areas in the medium-voltage (200 to 1 KV) ranges, where GaN offers unique and unbeatable power efficiency over pure silicon. Another reason is the superior capability offered by GaN to handle high switching frequencies (>1 GHz), particularly for RF-power functions such as power amplification and switching in RF devices. In power semiconductors, several transistors and diodes (and rectifiers) have been in the market since 2008, with extraordinary growth in the volume of power discretes (HEMTs, Diodes, and Rectifiers and FETs) boosting the total revenue of the SiC power semiconductors market. Another factor for revenue growth was from GaN power ICs, where new power ICs (hybrids) such as MMICs and RFICs were launched commercially every year by industry players after extensive R&D efforts on developing new technologies to enable the same. The complete GaN power semiconductors industry shifted to a mass-production scenario in 2011 with the success and revenue potential drawing the focus of several power semiconductor market giants.


The global GaN semiconductor industry’s value chain has grown to a vast network of players involved in various segments. There have been tremendous changes in the landscape of the value chain with several developments in segments such as raw material suppliers, EDA and design tool vendors, wafer manufacturers, wafer equipment vendors, foundry models, fabless players, fab facilities, IDMs, ODMs, OEMs, ATP players, and so on. The wafer manufacturers’ and wafer equipment manufacturers’ landscape is very dynamic, with increasing number of players in these two segments, and has a high level of collaborations, agreements, and partnerships activities among the players. The ODMs, IDMs segments are obviously the fastest growing segments with several new product launches, new technology launches taking place every year. In the supply chain landscape, both – upstream and downstream sectors have different landscapes, with new wafer manufacturing technologies related to epitaxy process, dyeing, etching, and wafer diameters playing a major role in the upstream and new device fabrication technologies related to technology node, circuit design, and assembly and packaging making their mark in the downstream.


Asia-Pacific (excluding Japan) holds the largest share in GaN semiconductors market among all the geographic segments. Owing to huge market potential, increasing focus of the semiconductor industry and diversifying and strengthening value chain segments in the upcoming markets such as China, South Korea, and Taiwan, the revenue share from APAC (excluding Japan) is expected to grow at the fastest rate. North America and Europe are the primary establishment base markets for GaN semiconductors.


Currently, GaN wafer market is majorly in “Research & Development” phase. Several research organizations are currently involved in numerous research activities in all the fields of GaN wafer development to produce the high purity material with improved thickness.


As the high thickness wafers such as 6-inch are already introduced in the market, the market value would decrease across the forecast period for low thick wafers. ASP of 2-inch wafers are preferable for R&D purpose, however, for commercial use larger wafers are preferred. Thus, the decrease in demand in the coming years is expected to bring the price down for smaller wafers.


GaN has been identified to have superior properties; however, it is not yet commercialized to its fullest extent. The main reason for this is the ultra-high prices of the raw material and complex manufacturing processes. The expenditure is very high to produce the material with high quality aspects. Furthermore, this will not affect the market in the long term as the average selling prices are expected to come down in the future.


GaN wafers have the capability to serve a vast pool of applications especially in military and defense, consumer electronics, and industrial among others. However, GaN competes with SiC in these verticals due to its affordable prices.



Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site:  Gallium Nitride Semiconductor Devices and Substrate Wafer Market Forecast & Analysis to 2013 – 2022.



Global GaN Semiconductor Industry Report


Partial List of Tables:


Table 1 GAN Semiconductor Devices Market Revenue, By Geography, 2013 – 2022 ($Million)

Table 2 Global GAN Semiconductor Devices &Substrate Wafer Market, 2013-2022 ($Million)

Table 3 Properties of the Major Semiconductor Materials

Table 4 Global GAN Semiconductor Devices Market Versus Overall Semiconductor Devices Market Revenue, 2013 – 2022 ($Billion)

Table 5 Global GAN Semiconductor Devices Market Revenue, By Application Sectors, 2013 – 2022 ($Million)

Table 6 Global GAN Semiconductor Devices Market Volume,By Application Sectors, 2013 – 2022 (Million Units)

Table 7 GAN Wafer Market Revenue, By Application Sector, 2013-2022 ($Million)

Table 8 Computers Sector: GAN Semiconductor Devices Market Revenue, 2013 – 2022 ($Million)

Table 9 Computers Sector: GAN Semiconductor Devices Market Volume, 2013 – 2022 ($Million)

Table 10 GAN Semiconductor Devices Market Revenue from Computers Hardware Power Modules, By Geography,2013 – 2022 ($Million)

Table 11 GAN Semiconductor Devices Market Revenue from UPS Systems, By Geography, 2013 – 2022 ($Million)

Table 12 Communication Infrastructure Sector: GAN Semiconductor Devices Market Revenue, 2013 – 2022 ($Million)

Table 13 Communication Infrastructure Sector: GAN Semiconductor Devices Volume, 2013 – 2022 (Million Units)

Table 14 GAN Semiconductor Devices Market Revenue from Signal Amplifiers & Switching Systems, By Geography,2013 – 2022 ($Million)

Table 15 GAN Semiconductor Devices Market Revenue from Wireless Applications, By Geography, 2013 – 2022 ($Million)

Table 16 GAN Semiconductor Devices Market Revenue from Wired Communication Devices, By Geography,2013 – 2022 ($Million)

Table 17 GAN Semiconductor Devices Market Revenue from Satellite Communication Applications, By Geography, 2013 – 2022 ($Million)

Table 18 GAN Semiconductor Devices Market Revenue from Radar Applications, By Geography, 2013 – 2022 ($Million)

Table 19 GAN Semiconductor Devices Market Revenue from RF Applications, By Geography, 2013 – 2022 ($Million)

Table 20 Consumer Electronics Sector: GAN Semiconductor Devices Revenue, 2013 – 2022 ($Million)

Table 21 Consumer Electronics Sector: GAN Semiconductor Devices Volume, 2013 – 2022 (Million Units)

Table 22 GAN Semiconductor Devices Market Revenue from Inverters in Consumer Applications, By Geography, 2013 – 2022 ($Million)

Table 23 GAN Semiconductor Devices Market Revenue from Led Lighting in Consumer Applications, By Geography, 2013 – 2022 ($Million)

Table 24 GAN Semiconductor Devices Market Revenue from Switch Mode Consumer Power Supply Systems, By Geography,2013 – 2022 ($Million)

Table 25 Automotive Sector: GAN Semiconductor Devices Revenue, 2013 – 2022 ($Million)

Table 26 Automotive Sector: GAN Semiconductor Devices Volume, 2013 – 2022 (Million Units)

Table 27 GAN Semiconductor Devices Market Revenue from Electric Vehicles & Hybrid Electric Vehicles, By Geography, 2013 – 2022 ($Million)

Table 28 GAN Semiconductor Devices Market Revenue from Automotive Braking Systems, By Geography, 2013 – 2022 ($Million)

Table 29 GAN Semiconductor Devices Market Revenue from Rail Traction, By Geography, 2013 – 2022 ($Million)

Table 30 GAN Semiconductor Devices Market Revenue from Automobile Motor Drives, By Geography, 2013 – 2022 ($Million)

Table 31 Industrial, Power, Solar and Wind Sector: GAN Semiconductor Devices Revenue ($Million), 2013 – 2022

Table 32 Industrial, Power and Solar Sector: GAN Semiconductor Devices Volume (Million Units), 2013 – 2022

Table 33 GAN Semiconductor Devices Market Revenue from Smart Grid Power Systems, By Geography, 2013 – 2022 ($Million)

Table 34 GAN Semiconductor Devices Market Revenue from Wind Turbines and Wind Power Systems, By Geography,2013 – 2022 ($Million)


 



Global GaN Semiconductor Industry Report

Friday, November 21, 2014

New IPC Standards For Printed Circuit Boards

NEW IPC-A-610F Acceptability of Electronic Assemblies


IPC-A-610 is the most widely used standard for circuit board production in the world. IPC-A-610F illustrates acceptability requirements for electronic assemblies with over 814 colour images and illustrations. Topics include flex attachment, board in board, part on part, lead free, component orientation and soldering criteria for through-hole, SMT (new termination styles) and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements. This revision F includes two new SMT termination styles, and changes in plated-through hole fill and BGA void criteria. Major topics include flex attachment, board-in-board, part-on-part, both lead-free and tin-lead criteria, component orientation and soldering criteria for through hole, SMT, cleaning, marking, coating and laminate requirements. IPC Standards for printed circuit boards: order and download IPC A-610F


IPC-A-610 is invaluable for all inspectors, operators and trainers. Revision F has 814 photos and illustrations of acceptability criteria — 86 of them new or updated. The document is most often used with the material and process standard IPC J-STD-001.


NEW J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies


J-STD-001F is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for both traditional solder alloys and for lead-free manufacturing. Revision to plated-through hole, PTH, minimum fill requirements; criteria for two new SMT termination types; and expanded conformal coating criteria. Clarification of criteria descriptions for easier understanding. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity. This standard fully complements IPC-A-610F and is supported by IPC-HDBK-001. Order and  download IPC J-STD-001F


IPC-7527 Requirements for Solder Paste Printing


IPC-7527 covers the many aspects of solder paste application, from initial placement on the board through production and testing. To equipment operators, the new standard serves as a reference guide with more than 50 photos packed into the 15-page standard.  IPC-7527 provides the operators with a standard that will help them make the right decisions when they face issues in production, and no professionals or specialists are present.


While there are standards that detail what a completed assembly should look like, IPC-7527 is the first one to provide requirements for what the printed solder paste should look like and how far off centers can be before they’re considered defects. It covers everything from basic squeegees to jet dispensers and needle dispensers to closed print heads. In addition, IPC-7527 provides information on automated paste inspection using either cameras or lasers. Order and download IPC-7527.


IPC-7093 Design and Assembly Process Implementation for Bottom Termination components




This standard describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body. The BTCs in this document include all types and forms of bottom-only termination components intended for surface mounting. This includes such industry descriptive nomenclature as QFN, DFN, SON, LGA, MLP and MLF. The focus of the information is on critical design, assembly, inspection, repair, and reliability issues associated with BTCs.


The target audiences for this document are managers, design and process engineers, and operators and technicians who deal with the electronic design, assembly, inspection and repair processes. The intent is to provide useful and practical information to those companies who are using or considering tin/lead, lead free, adhesives or other forms of interconnection processes for assembly of BTC type components. Although not a complete recipe, the document identifies many of the characteristics that influence the successful implementation of robust and reliable assembly processes and provides guidance information to component suppliers regarding the issues being faced in the assembly process. Order and  download IPC-7093


IPC-7095C Design and Assembly Process Implementation for BGAs




Implementing ball grid array (BGA) and fine-pitch ball grid array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095C delivers useful and practical information to anyone currently using BGAs or FBGAs. Many issues have become especially important due to the change in the alloys of the ball, the ball shape, and the attachment procedures. The major emphasis of Revision C is to provide information on some of the new mechanical failure issues such as cratering or laminate defects caused after assembly.


In addition to providing guidelines for BGA inspection and repair, IPC-7095C addresses reliability issues and the use of lead-free joint criteria associated with BGAs. There are many photographs of X-ray and endoscope illustrations to identify some of the conditions that the industry is experiencing in the implementation of BGA assembly processes. Order and download IPC-7095C


IPC-7711/7721B Rework, Modification and Repair of Electronic Assemblies




This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. Order and download IPC-7711/7721B.




Purchase and Download IPC Standards For Printed Circuit Boards from Electronics.ca Publications today!


Effective January 1, 2015, a price increase of 4 percent will be implemented on all standards.




IPC Standards For PCB Design and CADIPC Member

 











New IPC Standards For Printed Circuit Boards

CMP Consumables Market Resumes Sustainable Growth

The global CMP consumables market has resumed its growth trajectory prior to the 2008-2009 recession. At over $2.0B, 2013 CMP slurry and pad revenues are up 6.0% over 2012, and 2014 is projected to be up an additional 2.2%, according to a new report  “CMP Consumables 2014 – A Critical Materials Report“.  By 2019, the combined CMP pad and slurry market is expected to grow to $2.5B for a CAGR of 3.9% over this period.


The overall slurry market share of Cabot Microelectronics, the historical market leader, is estimated to be stable at just over 36% globally. Aside from Cabot, market ranking can be identified only in the context of a specific process application, as each segment functions as an independent market. This results in a highly fragmented slurry market with over a dozen suppliers, each with a significant market share in at least one process area. The pad market is still led by Dow Chemical with about two-thirds share globally. Cabot Microelectronics remains the only supplier clearly in the Tier 2 pad group with an estimated 9-10% share compared to 1-5% each for six others.


New product development continues to dominate the R&D budgets of slurry manufacturers as new device structures and material set combinations move into high volume chip manufacturing, including CMP processes related to FinFET and high-κ metal gate technologies. Defect reduction requirements and tighter specs on removal uniformity continue their relentless march to planarization perfection in order to satisfy the demands of device manufacturing below 20nm.


CMP Consumables Market ReportThe 2014 CMP Consumables Report includes supply chain segments on Slurries and Abrasives; Pads; Slurry Filters; Pad Conditioners; Post-CMP Cleaning Chemicals; PVA Brushes; Equipment; Retaining Rings; and Support Services. Reports on Process Flows, University Research and a CMP retrospective comprise the remaining three segments. Each section, including the popular Slurry and Pad reports, can be purchased separately, with a discount for purchase of the entire set:


 


 


 



CMP Consumables Market Resumes Sustainable Growth

Global Market for Transformers to Reach $48.3 Billion in 2019

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Global Markets for Transformers“.  The global transformers market is expected to grow to $48.3 billion by 2019, with a five-year compound annual growth rate (CAGR) of 7.3%.  The Asia-Pacific market, the fastest-growing region of the overall market, is moving at a significant 8.1% CAGR.


Tasked with the regulation of voltage output, transformers are critical to the electricity supply chain. Globally, the demand for this technology is driven by the increasing demand for electricity, replacement of older transformers, and environmental concerns, particularly in India and China.


Indeed, the Asia-Pacific region is the largest and fastest growing segment of the global market. Valued at just $13.2 billion in 2013, the Asia-Pacific market is expected to surge to $21.1 billion by 2019. Such rapid growth is attributed to improving economic conditions and the increasing use of the region as a hub for Western markets to outsource the manufacture of their transformers.


Meanwhile, the European and North American markets are projected to grow at a healthy CAGR of 7.2% and 5%, respectively.


The upgrading of existing networks and replacement of older transformers in Western regions offer a huge growth opportunity for the transformer market. This is especially the case for power and traction transformers, which have high performance properties to increase energy efficiency and reduce electricity losses. However, in the longer-term, the developing regions, including China, Brazil, India and others, will create huge opportunities for the transformer market with the increasing demand for electricity and increasing electricity production.


Increasing raw material prices and stricter environmental regulations on carbon emission levels have forced companies to focus on the development of advanced transmission technologies that will comply with current and future environmental regulations. The pressure to develop environmentally friendly transformers is increasing even in the Asia-Pacific and other developing regions.


GLOBAL MARKETS FOR TRANSFORMERS provides an overview of the global markets for transformers and related technologies. It includes analyses of global market trends, with data from 2013, estimates for 2014, and projections of CAGRs through 2019.


 


SAMPLE FIGURE

GLOBAL TRENDS OF THE HYDRAULIC PUMP MARKET BY REGION, THROUGH 2019

($ MILLIONS)


GLOBAL TRENDS OF THE HYDRAULIC PUMP MARKET BY REGION, THROUGH 2019

Global Markets for Transformers



Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the reportGlobal Markets for Transformers.


 



Global Market for Transformers to Reach $48.3 Billion in 2019