Friday, January 30, 2015

New Electronics Assembly Standards IPC J-STD-001F and IPC-A-610F Revisions Cover More Advanced Technologies

Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated ‘F’ Revisions Cover More Advanced Technologies


 IPC — Association Connecting Electronics Industries® has released the F revisions of two of the industry’s most widely used standards,  IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610 Acceptability of Electronics Assemblies. The documents have been updated to include technical advances in solder on plastic surface mount (SMT) components, new criteria for P-style and solder-charged Butt/I SMT terminations, a change to void criteria for BGAs, and enhancements to the language within the documents to provide ease of use and clarity. New photos facilitate further understanding.


The revision process involved dedicated volunteers from electronics companies in the Americas, Europe and Asia. With the mantra, “in data we trust,” IPC committee members focused major changes in areas such as the shrinking sizes of plastic packages that affect solder touching component bodies.


Dispelling past concerns that solder could not touch plastic components for fear of future failure, Teresa Rowe, IPC director of assembly technology, said “We [committee] didn’t find significant occurrences of failures when solder touched the plastic bodies.” Rowe explains that there was much discussion on this topic and expects that as research in this area continues, the committee will consider it in future revisions.


The chapter on conformal coatings also underwent significant changes. “We revised the way we look at conformal coatings, providing new information on coating thickness,” Rowe said. “We also looked at bubbles, voids and transparency, expanding our criterion for acceptance.”


The standards also cover Class 2 plated-through hole vertical solder fill requirements and Class 2 flux activity criteria.


IPC A-610 IPC A-610


Often used as companion documents, IPC J-STD-001F and IPC-A-610F each has a unique purpose. Whereas IPC J-STD-001 is a material and process requirements document and is critical for use during manufacturing, IPC-A-610 is a post-assembly acceptance standard.


Translations of the F revisions and training programs based on the revised standards will be released in the coming months. For more information on IPC J-STD-001F, visit www.ipc.org/001; for more information on IPC-A-610F, visitwww.ipc.org/610


Details of the new IPC J-STD-001F and IPC-A-610F standards, table of contents and ordering information can be found on Electronics.ca Publications’ web site: IPC J-STD-001F and IPC-A-610F.



New Electronics Assembly Standards IPC J-STD-001F and IPC-A-610F Revisions Cover More Advanced Technologies

Smart Machines Market Research

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Smart Machines: Technologies and Global Markets”. The global smart machines market was valued at $5.3 billion in 2013. This market is expected to increase to over $6.2 billion in 2014 and nearly $15.3 billion in 2019, a compound annual growth rate (CAGR) of 19.7% for the five-year period 2014 to 2019.


The possibilities and challenges created by smart machines replacing humans have been a staple of science fiction for nearly 150 years, beginning with Samuel Butler’s novel Erewhon. Since then, the theme of smart machines has been developed in numerous books and films, most of which portray smart machines either as mankind’s helpers (e.g., Isaac Asimov’s Robot books), its equal partners (Star Trek: The Next Generation’s Lt. Commander Data) or its implacable enemies (The Terminator’s Skynet).


As a result, it is difficult not to feel a sense of déjà vu at the recent Gartner Research report, “Surviving the Rise of ‘Smart Machines’, the Loss of ‘Dream Jobs’ and ‘90% Unemployment’ ”, published in late 2013. The report’s authors warn that by 2020, labor reductions caused by smart machines could cause social unrest in some advanced economies (i.e., smart machines as the enemy). Smart machines may also help to retrain workers and help them to acquire the skills needed for new jobs (smart machines as helpers), but in the end, smart machines should be recognized as part of the workforce (smart machines as partners).


Some critics have downplayed the Gartner report’s conclusions as overly pessimistic or at least premature, but there is no doubt the number of smart machines and their role in the modern economy and society are expanding rapidly. Not only that, the rate of progress in smart machines is set to increase dramatically thanks to a combination of Moore’s law and the melding of various enabling technologies, e.g., machine learning, voice recognition and nanotechnology.


Smart Machines MarketsDetails of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report:  “Smart Machines: Technologies and Global Markets


Smart Machines Market  – List of Tables


Summary Table : GLOBAL MARKET FOR SMART MACHINES, THROUGH 2024

Table 1 : GLOBAL MARKET FOR SMART MACHINES, THROUGH 2024

Table 2 : GLOBAL MARKET FOR EXPERT SYSTEMS, THROUGH 2024

Table 3 : REPORTED APPLICATIONS OF ANNs IN FINANCE AND ACCOUNTING

Table 4 : REPORTED APPLICATIONS OF ANNs IN THE MANUFACTURING INDUSTRY

Table 5 : REPORTED APPLICATIONS OF ANNs IN MARKETING AND SALES

Table 6 : REPORTED APPLICATIONS OF ANNS IN STRATEGIC MANAGEMENT AND BUSINESS POLICY

Table 7 : REPORTED APPLICATIONS OF ANNs IN TELECOMMUNICATIONS

Table 8 : REPORTED APPLICATIONS OF ANNs IN HEALTH CARE

Table 9 : MARKET FOR NEURAL COMPUTING TECHNOLOGIES, 2013-2024

Table 10 : PROJECTED MARKET FOR MEMRISTOR NEUROMORPHIC CHIPS, THROUGH 2024

Table 11 : PROJECTED MARKET FOR SOFTWARE ANNs, THROUGH 2024

Table 12 : GLOBAL MARKET FOR AUTONOMOUS ROBOTS, THROUGH 2024

Table 13 : MARKET FOR SELF-DRIVING VEHICLES, THROUGH 2024

Table 14 : MARKET FOR AUTONOMOUS INDUSTRIAL ROBOTS, THROUGH 2024

Table 15 : MARKET FOR AUTONOMOUS MILITARY ROBOTS, THROUGH 2024

Table 16 : MARKET FOR AUTONOMOUS UNDERSEA WARFARE ROBOTS, THROUGH 2024

Table 17 : MARKET FOR AUTONOMOUS AGRICULTURAL ROBOTS, THROUGH 2024

Table 18 : MARKET FOR AUTONOMOUS CLEANING ROBOTS, THROUGH 2024

Table 19 : MARKET FOR AUTONOMOUS ROBOTS IN HEALTH CARE APPLICATIONS, THROUGH 2024

Table 20 : MARKET FOR AUTONOMOUS ROBOTS IN MINING AND ENERGY PRODUCTION, THROUGH 2024

Table 21 : MARKET FOR AUTONOMOUS ROBOTS IN RESEARCH APPLICATIONS, THROUGH 2024

Table 22 : GLOBAL MARKET FOR SMART EMBEDDED SYSTEMS, THROUGH 2024

Table 23 : GLOBAL MARKET FOR INTELLIGENT ASSISTANTS, THROUGH 2024

Table 24 : LARGEST SMART MACHINE U.S. PATENT PORTFOLIOS



Smart Machines Market Research

Global Market for Biometric Technology to Reach $27.5 billion by 2019

ELECTRONICS.CA PUBLICATIONS announces the availability of a comprehensive global report on  Biometric Technology and Global Markets.  New report studies the global as well as regional markets for biometric technologies and devices, with a view to locate newer markets and to expand the present application market for various types of biometric devices. A realistic forecast has been made for the future market for different types of biometric technologies and devices. These biometric technologies and products are studied, with attention to their value globally, as well as in different regions, during the last three years and forecasted for the next five years. The application for each type of biometric technology is discussed in detail with a view to establishing global as well as regional usage. A future forecast has been made for such applications.


Biometric technologies are becoming the foundation for an extensive array of highly secure identification and personal verification solutions. A rapidly evolving technology widely used in forensics for criminal identification and in prison security, biometrics is quickly finding widespread application in a range of industries, including medicine, science, robotics, engineering, manufacturing, and all areas of vertical enterprise businesses. Technological advances, consumer and commercial acceptance and demand of the technology, as well as significant cost reductions across the industry will drive tremendous growth in this market for the foreseeable future.


According to the report, global biometric technologies market was estimated at $8.7 billion in 2013 and is expected to reach nearly $11.2 billion by 2014.   The market is projected to grow to nearly $27.5 billion by 2019, and register a five-year compound annual growth rate of 19.8% from 2014 to 2019.


Use this report to:


  • Gain an overview of the market for biometric technologies, including fingerprint, face, iris, vein, and voice technologies

  • Analyze market trends, with data from 2013, estimates for 2014, and projections of CAGRs through 2019

  • Assess variations in the growth of the industry in certain regions

  • Evaluate coverage of the competitive landscape, including mergers and acquisitions, collaborations and agreements, and new product development

  • Review comprehensive company profiles of major players in the industry

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: Biometrics:Technologies and Global Markets.


Partial List of Tables


Summary Table : GLOBAL MARKET FOR BIOMETRIC TECHNOLOGIES, THROUGH 2019

Table 1 : GLOBAL MARKET FOR BIOMETRIC TECHNOLOGIES, THROUGH 2019

Table 2 : REGIONAL MARKET FOR BIOMETRIC TECHNOLOGIES, THROUGH 2019

Table 3 : DISTRIBUTION OF NORTH AMERICAN MARKET FOR BIOMETRIC TECHNOLOGIES BY COUNTRY, THROUGH 2019

Table 4 : DISTRIBUTION OF EUROPEAN MARKET FOR BIOMETRIC TECHNOLOGIES BY COUNTRY, THROUGH 2019

Table 5 : DISTRIBUTION OF ASIA-PACIFIC MARKET FOR BIOMETRIC TECHNOLOGIES BY COUNTRY, THROUGH 2019

Table 6 : DISTRIBUTION OF REST OF THE WORLD MARKET FOR BIOMETRIC TECHNOLOGIES BY COUNTRY, THROUGH 2019

Table 7 : REGIONAL MARKET FOR FINGERPRINT RECOGNITION TECHNOLOGY, THROUGH 2019

Table 8 : REGIONAL MARKET FOR AUTOMATED FINGERPRINT IDENTIFICATION SYSTEM (AFIS)/LIVE SCAN TECHNOLOGIES, THROUGH 2019

Table 9 : REGIONAL MARKET FOR FACE RECOGNITION TECHNOLOGY, THROUGH 2019

Table 10 : REGIONAL MARKET FOR IRIS RECOGNITION TECHNOLOGY, THROUGH 2019

Table 11 : REGIONAL MARKET FOR VEIN RECOGNITION TECHNOLOGY, THROUGH 2019

Table 12 : REGIONAL MARKET FOR VOICE RECOGNITION TECHNOLOGY, THROUGH 2019

Table 13 : REGIONAL MARKET FOR HAND GEOMETRY TECHNOLOGY, THROUGH 2019

Table 14 : REGIONAL MARKET FOR SIGNATURE RECOGNITION TECHNOLOGY, THROUGH 2019

Table 15 : REGIONAL MARKET FOR EMERGING BIOMETRIC TECHNOLOGIES, THROUGH 2019

Table 16 : GLOBAL MARKET FOR BIOMETRIC APPLICATIONS, THROUGH 2019

Table 17 : REGIONAL MARKET FOR BIOMETRIC APPLICATIONS, THROUGH 2019

Table 18 : GLOBAL MARKET FOR BIOMETRIC IDENTIFICATION APPLICATIONS, THROUGH 2019

Table 19 : REGIONAL MARKET FOR BIOMETRICS IN IDENTIFICATION APPLICATIONS, THROUGH 2019

Table 20 : GLOBAL MARKET FOR BIOMETRICS IN CIVIL IDENTIFICATION APPLICATIONS, THROUGH 2019

Table 21 : GLOBAL MARKET FOR BIOMETRICS IN CRIMINAL IDENTIFICATION APPLICATIONS, THROUGH 2019

Table 22 : GLOBAL MARKET FOR BIOMETRICS IN CONSUMER IDENTIFICATION APPLICATIONS, THROUGH 2019

Table 23 : GLOBAL MARKET FOR BIOMETRICS IN ACCESS CONTROL APPLICATIONS, THROUGH 2019

Table 24 : REGIONAL MARKET FOR BIOMETRICS IN ACCESS CONTROL APPLICATIONS, THROUGH 2019

Table 25 : GLOBAL MARKET FOR BIOMETRICS IN LOGICAL ACCESS CONTROL APPLICATIONS, THROUGH 2019

Table 26 : GLOBAL MARKET FOR BIOMETRICS IN PHYSICAL ACCESS CONTROL APPLICATIONS, THROUGH 2019

Table 27 : GLOBAL MARKET FOR BIOMETRICS IN TRANSACTIONAL ACCESS CONTROL APPLICATIONS, THROUGH 2019

Table 28 : GLOBAL MARKET FOR BIOMETRICS IN SURVEILLANCE APPLICATIONS, THROUGH 2019

Table 29 : REGIONAL MARKET FOR BIOMETRICS IN SURVEILLANCE APPLICATIONS, THROUGH 2019

Table 30 : GLOBAL MARKET FOR BIOMETRICS IN MILITARY/BORDER CONTROL APPLICATIONS, THROUGH 2019

Table 31 : GLOBAL MARKET FOR BIOMETRICS IN FORENSIC AND LAW ENFORCEMENT APPLICATIONS, THROUGH 2019



Global Market for Biometric Technology to Reach $27.5 billion by 2019

IPC/WHMA-A-620B PDF Download - Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC/WHMA-A-620 is a collection of visual Quality Acceptability Requirements for Cable, Wire and Harness Assemblies.  IPC/WHMA-A-620 can be used as a stand-alone document for purchasing products, however it does not specify frequency of in-process inspection or frequency of end product inspection. No limit is placed on the number of process indicators or the number of allowable repair/rework of defects. Such information should be developed with a statistical process control plan (see IPC-9191).


This publication describes acceptability criteria for producing crimped, mechanically secured, or soldered interconnections and the associated lacing/restraining criteria associated with cable and harness assemblies. It is not the intent of this document to exclude any acceptable procedure used to make the electrical connection; however, the methods used must produce completed assemblies that conform to the acceptability requirements described in this document.


Significant technical updates, greater ease-of-use and compatibility with other key assembly standards are among the many changes users will find in the newly released B revision of IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies. This important industry standard is a joint effort of IPC and the Wire Harness Manufacturers’ Association (WHMA).


The revision addresses more than 500 documented comments and recommendations from users throughout the industry and features 125 new or changed illustrations.


Some of the most extensive changes appear in the molding and potting section, which has been expanded for increased coverage of Class 2 and 3 requirements, including 31 new illustrations. The document also provides new criteria for wires as small as 32 AWG, and has a section on requirements flow down, which requires companies to have their subcontractors use the standard to ensure all hardware is manufactured to the same guidelines.


IPC WHMA A-620B PDF Download IPC WHMA A-620B PDF Download


IPC/WHMA-A-620B is 400 pages long and features 682 full-color illustrations.  IPC/WHMA-A-620 B is the latest revision of IPC A620,


Purchase and download IPC/WHMA-A-620B standard from Electronics.ca Publications. IPC standards are also available on CD-ROM.


Also Avaliable in Spanish, Chinese, German, Danish, Polish, and French Versions.


 



IPC/WHMA-A-620B PDF Download - Requirements and Acceptance for Cable and Wire Harness Assemblies

Wednesday, January 28, 2015

Semiconductor Industry and Equipment Markets in China

China is by far the largest consumer of semiconductors; it accounts for about 45 percent of the worldwide demand for chips, used both in China and for exports. But more than 90 percent of its consumption relies on imported integrated circuits. Integrated-circuit companies in China entered the semiconductor market late—some two decades after the rest of the world—and have been playing catch-up ever since in an industry in which success depends on scale and learning efficiencies. The Chinese government made several attempts to build a local semiconductor industry, but none really took hold. Now, however, things are changing on both the business and policy fronts.


Low-cost smartphones designed in China are flooding the market. For instance, Android phones designed in China now represent more than 50 percent of the global market, compared with their negligible presence five years ago. Lenovo’s significant deals early in 2014—first acquiring IBM’s low-end x86-based server business for $2.3 billion and then buying Motorola from Google for almost $3 billion—further suggest that the customer base for hardware is moving to China. Meanwhile, Beijing and Shenzhen have become innovation hotbeds for wearable devices and other connected consumer electronics. Technology companies in these regions are not trailing others in this area of innovation; they are running neck and neck with other early entrants.


Multinational corporations in every industry—from automotive to industrial controls to enterprise equipment—increasingly are establishing design centers on the mainland to be closer to customers and benefit from local Chinese talent. McKinsey’s proprietary research indicates that more than 50 percent of PCs, and between 30 and 40 percent of embedded systems (commonly found in automotive, commercial, consumer, industrial, and medical applications), contain content designed in China, either directly by mainland companies or emerging from the Chinese labs of global players. As the migration of design continues, China could soon influence up to 50 percent of hardware designs globally (including phones, wireless devices, and other consumer electronics).


Fabless semiconductor companies are also emerging in China to serve local customers. For instance, Shanghai-based Spreadtrum Communications, which designs chips for mobile phones, and Shenzhen-based HiSilicon Technologies, a captive supplier to Huawei and one of the largest domestic designers of semiconductors in China, are among the local designers that have shown rapid growth over the past few years.


There has been slower but steady progress among local foundries. For reasons including costs and scale—and, in some cases, export controls—these players traditionally have been reluctant to invest in cutting-edge technologies, always lagging three or four years behind the industry leaders. But the performance gap is shrinking. As global players such as Samsung, Taiwan Semiconductor Manufacturing Company, and Texas Instruments set up shop in China, leading local foundries such as Shanghai Huali Microelectronics Corporation, SMIC, and XMC are poised to benefit from the development of a true technology cluster. At the same time, fewer and fewer chip designs will be moving to technologies that are 20 nanometers and below; following Moore’s law is becoming too expensive and is of limited benefit to all but a small set of global semiconductor companies. As a result, low-cost, lagging-edge Chinese technology companies will soon be able to address a larger part of the global market.


China released the high-level framework for its new national semiconductor policy in June 2014; the details and the long-term effects of its new approach to developing the semiconductor industry in China remain to be seen. Will it lead to a world-class semiconductor industry, or will Chinese semiconductor companies continue to lag behind global players? Three medium-term effects seem likely.


China’s strong desire for national champions may further tilt the system in favor of local players. According to industry estimates, Chinese original-equipment manufacturers will design more than half of the world’s phones in 2015.1 Under the national-champions model, they may be encouraged to take advantage of domestic suppliers’ low-cost strategies and strong local technical support. Additionally, in the wake of global data-privacy and security concerns, there has been even more of a push from the Chinese government for state-owned and private enterprises to purchase from local system suppliers (that, in turn, are more likely to source from local semiconductor vendors).


Mainland China represents a huge opportunity for semiconductor manufacturers and equipment and materials suppliers. More information is available in our updated market research report: Mainland China’s Semiconductor and Equipment Markets: A Complete Analysis of the Technical, Economic, and Political Issues.


 


 


 


 



Semiconductor Industry and Equipment Markets in China

Semiconductor Automated Test Equipment Business Report

Electronics.ca Publications announces the release of a comprehensive global report on Semiconductor Automated Test Equipment (ATE) markets. Global market for Semiconductor ATE is forecast to reach US$4.3 billion by 2020, spurred by strong chip fabrication activity against a backdrop of growing demand for electronic chips in consumer, industrial, automotive and medical electronics.


Demand for semiconductor ATE is intrinsically linked to the level of semiconductor fabrication activity, which in turn is largely influenced by the health of the global electronics industry. After a major setback during the 2007-2009 recession period, the global semiconductor ATE market made a strong rebound in the year 2010. The recovery soon after was however marred by weak financial climate in Europe and natural calamities in Japan, which disrupted the global supply chain. Rising cost of production, price sensitive end-use markets and the resulting shrinking profit margins accelerated the consolidation trend among semiconductor ATE vendors. Steadily recovering global economic growth, strong gains in manufacturing and PMI performance, are however expected to drive growth in the coming years. Need for additional capacity, as a result of increased outsourcing of fabrication activity, is resulting in increased investments in new fab constructions in Asia, which in turn is expected to drive demand for semiconductor ATE.


Fabrication companies are under constant pressure to employ latest technology to design and manufacture advanced ICs to meet the complexity challenges of silicon chips as they grow in performance in parallel with the Moore’s Law. Semiconductor ATE, under this scenario is assuming increasing importance. The software centric approach to automated testing is expected to emerge as a game changer in the ATE industry, with vendors increasingly using software as a tool for differentiating product offerings. Miniaturization, digitalization and high-speed computing represent trends in the electronics industry which are benefiting the market for semiconductor ATE. Increase in demand for ASICs and NAND flash memory devices as a result of growing adoption of tablet PCs and smartphones, increase in DRAM sales in line with resurgence in demand for PCs also continues to induce strong demand for semiconductors and semiconductor production equipment including ATE.


Boundary Scan (BS) ATE, also known as BS controllers, and functional ATEs are driving growth in the PCB ATE market. The telecom industry is currently a hotbed for innovation, with demand for testing instruments anticipated to rise supported by increased R&D spending on wireless technologies for next-gen solutions. Robust demand for SoCs for use in portable communication devices is additionally anticipated to continue to spur growth in the global semiconductor ATE market. FPGA based DSPs is fast becoming a mainstay for advanced RF Test equipment with user programmable measurement algorithms on FPGA expected to take T&M instruments to the next level. PLX and other on-chip testing technologies are gaining popularity among fabricators across the globe.


As stated by the new market research report on Semiconductor Automated Test Equipment (ATE), Taiwan represents the single largest regional market worldwide. The country also represents one of the fastest growing markets with a CAGR of 7.2% over the analysis period.


Major players covered in the report include Advantest Corporation, Aeroflex Inc., AMC Technology LLC, Astronics Test Systems Inc., Chroma ATE Inc., CREA (Collaudi Elettronici Automatizzati S.r.l.), LTX-Credence Corporation, Marvin Test Solutions Inc., National Instruments Corporation , Roos Instruments Inc., STAr Technologies Inc., and Teradyne Inc.


The research report titled “Semiconductor Automated Test Equipment (ATE): A Global Strategic Business Report” provides a comprehensive review of market trends, growth drivers, technological trends, major challenges, mergers, acquisitions and other strategic industry activities. The report provides market estimates and projections for major geographic markets including the US, Japan, Europe, China, South Korea, Taiwan, and Rest of World.


Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report:Semiconductor Automated Test Equipment (ATE): A Global Strategic Business Report”.


 



Semiconductor Automated Test Equipment Business Report

Tuesday, January 27, 2015

Global Market for Fuses and Circuit Breakers is Projected to Reach US$19.7 billion by 2020

ELECTRONICS.CA PUBLICATIONS announces the availability of a new comprehensive analysis of industry segments, trends, growth drivers, market share, market size and demand forecasts on the global Fuses and Circuit Breakers market. Global market for Fuses and Circuit Breakers is projected to reach US$19.7 billion by 2020, driven by sustained demand in commercial power distribution systems.


Sustained Demand from the Energy End-Use Sector Drives the Global Market for Fuses and Circuit Breakers


The growing prominence of power systems management and engineering, against a backdrop of increased use of electronic devices, is driving demand for fuses and circuit breakers. As sophisticated power protection devices, fuses and circuit breakers play instrumental roles in managing electrical loads. These devices assume critical importance in protecting electrical and electronic equipment from unexpected power fluctuations resulting from overvoltages, overload, ground faults and short circuits. Increasing focus on efficient power transmission and distribution is the principal factor driving demand for fuses and circuit breakers in electric utility applications. Emerging economies, which are currently at the forefront of establishing new energy infrastructure, are especially poised to spur growth. Manufacturers seeking emerging market exposure are increasingly looking beyond the BRICs. As BRIC countries slowdown highlighting the popping of the BRIC bubble, non-BRIC emerging markets are poised to turbo-charge opportunities in the energy end-use sector. These emerging countries, for instance, require huge amounts of energy to power economic growth and the rapid industrialization underway.


The market, over the past decade, has largely benefited from the robust sales of electronic and electric equipment all of which warrant the use of protection devices such as fuses and circuit breakers. Increased replacement of mechanical and electro-mechanical devices with electronic equipment in the manufacturing and industrial sectors is also expected to drive gains in the market. Urbanization and the ensuing rapid expansion in commercial building and residential units will also spur demand for fuses and circuit breakers. Environmental regulations mandating the need for more efficient power distribution and transmission equipment will further drive demand for fuses and circuit breakers in electric utility applications. Proliferation of IT technologies will drive increased need for power management in computer systems and server farms thus bringing in new opportunities for growth.


Electronics form a core part of modern automobiles with every sub-system electronically controlled, right from electronic power steering, four-wheel steering systems, anti-lock braking systems, climate control systems, occupant restraint airbag systems, power seat modules, door control, light controls, car security systems like engine immobilization, and keyless remote entry.


With electronics becoming an indispensable part of automobile design and engineering, wiring of electrical components is now more common thus providing widespread opportunities for the use of fuses and circuit breakers to protect the electrical components of the automobile.


As stated by the new market research report on Fuses and Circuit Breakers, the United States represents the largest market worldwide. Asia-Pacific ranks as the fastest growing regional market driven by sustained demand from key end-use industries in emerging Asian economies. Circuit Breakers represents the largest as well as the fastest growing market with growth projected to wax at a CAGR of 6.6% over the analysis period.


Major players in the global marketplace include ABB Limited, Alstom S.A, Automation Systems Interconnect, AVX Corporation, Bel Fuse Inc., Bentek Inc., Bourns Inc., Carling Technologies Inc., Eaton Corporation, EPCOS AG, E-T-A Elektrotechnische Apparate GmbH, Fuji Electric FA Components & Systems Co., Ltd., General Electric Company, Hitachi Ltd., Legrand S.A, Littelfuse Inc., Mersen SA, Mitsubishi Electric Corporation, Schneider Electric SA, SCHURTER AG, Sensata Technologies Inc., Siemens AG, TE Connectivity Ltd., and Vicor Corporation among others.


The research report titled “Fuses and Circuit Breakers: A Global Strategic Business Report”, provides a comprehensive review of market trends, issues, drivers, company profiles, mergers, acquisitions and other strategic industry activities. The report provides market estimates and projections in US dollars for major geographic markets including the US, Canada, Japan, Europe (France, Germany, Italy, UK, Spain, Russia and Rest of Europe), Asia-Pacific, Middle East and Latin America. Product segments analyzed in the report include Fuses and Circuit Breakers.


Global Market for Fuses and Circuit BreakersDetails of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: Fuses and Circuit Breakers: A Global Strategic Business Report“.



Global Market for Fuses and Circuit Breakers is Projected to Reach US$19.7 billion by 2020