Wednesday, April 23, 2014

Permanent Wafer Bonding Market Report

The permanent bonding market is evolving, currently dominated and fragmented by 3 main permanent bonding equipment suppliers: EV Group (EVG), SUSS MicroTec, and TEL (Tokyo Electron). These 3 vendors today account for almost 80% of the permanent bonding equipment market by focusing on MEMS and advanced packaging applications including BSI CIS, CIS capping WLP, and 3D stack TSV.

TSV INTEGRATION IS CREATING GROWTH IN PERMANENT WAFER BONDING

Permanent bonding technology is a key process for a wide range of applications in the semiconductor industry such as MEMS, Advanced Packaging (BSI CIS, CIS capping WLP, 3D stack TSV), LED devices, and SOI substrate applications. This type of application is quite complex due to the high diversity of existing bonding technologies.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications" web site. View the report: Permanent Wafer Bonding for Semiconductor: Application Trends & Technology Report.

No comments: