Two leading standards for the electronics assembly industry have been revised. IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies is recognized worldwide as the sole industry-consensus standard for soldering processes and materials. IPC-A-610F, Acceptability of Electronic Assemblies, is a post-assembly acceptance standard used to ensure electronics assemblies meet the most current acceptance requirements.
Some significant changes to IPC-J-STD-001F and IPC-A-610F standards include:
- Requirements added for two new SMT terminations
- P-Style terminations
- Butt/I terminations — Solder charged terminations
- Revised Class 2 plated-through hole vertical solder fill requirements
- Revised void criteria for BGA/CSP components
- Revised class 2 flux activity criteria
- Improved language for ease of readability and understanding
- Revised soldering requirements for plastic SMT components
- Expanded conformal coating section
- New photos added for clarity
- Simplified Imperial English dimensions utilized in the documents
- Explicit to IPC J-STD-001, revised appendices including guidelines for soldering tools and equipment and objective evidence on material compatibility
The changes listed above are only some of the highlights of J-STD-001F and IPC-A-610F. In order to stay current with best practices in the electronics assemblies industry you need the most current standards, J-STD-001F and IPC-A-610F.
Some Questions Answered About IPC J-STD-001F and IPC A-610F
