3D Printing Materials Market Will Be Worth in Excess of $600M

3D printing is currently the subject of a great deal of speculation and excitement in the media. Touted as the technology to bring about the next industrial revolution and the in-sourcing of manufacturing jobs back to the West, the term in fact refers to a raft of technologies each of which is compatible for use with a particular material type.

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In fact the materials market for 3D printing is possibly the most contentious issue in the 3D printing industry today. 3D printer manufacturers are increasingly engaging in practices which are perceived by end-users as anti-competitive by locking customers in to their own materials supplies via key-coding and RFID tagging of material cartridges, an activity which is effectively enabling monopoly pricing of the materials concerned.

Development of new materials for 3D printing is hindered by the practice of lock-in by some 3D printer manufacturers. Barriers to entry for 3rd party materials suppliers are high, and those who do enter the market are unable to get the economies of scale required to accelerate both materials development and progress towards a competitive market.

In the short to mid-term, downwards pressure on materials prices will be driven mainly by new entrants to the 3D printer manufacture arena that do not engage in lock-in practices and enable customers to source materials from the supplier(s) of their choice, and also by pressure from large end-users wielding buying power to force prices down.

This report gives forecasts to 2025 for the following materials supplies:

• Photopolymers


• Thermoplastics in solid form (ie. filaments and pellets)


• Thermoplastics in powder form


• Metal powders


• Powder-bed inkjet powders

SWOT analyses in each class are given and end-user requirements detailed.

Materials in development but not yet commercial, which research is mainly taking place in universities, are also discussed.

The market for photopolymers will retain the largest single segment of the market through to 2025 although the other materials markets will gain market share in terms of tons produced driven largely by the move away from prototyping/tooling applications towards final product manufacture.

Highest growth will be seen in the market for metal powders, although production, currently placed at less than 30 tons/year, will remain relatively low. This, in combination with high raw material and processing prices, will combine such that prices for these materials will fall more slowly than for alternative 3D printing materials.

Market growth in a business-as-usual scenario when lock-in remains common practice and prices remain high will be steady, as illustrated below.

However, extensive interviews with both materials developers and end-users indicate that prices are falling. This will modulate growth of the market size even as mass production increases in line with the growth of the cumulative installed base.

Further, for any given material class, market size (in terms of $M) is more sensitive to the installed base of the corresponding 3D printer technology than to the actual price of the materials themselves. Should material prices increase, only a small reduction in the average utilisation rate of the printer installed base is required for the market size to actually fall as a result.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: 3D Printing Materials 2015-2025: Status, Opportunities, Market Forecasts.

3D Printing Materials Market Will Be Worth in Excess of $600M

World PCB Production in 2014 Estimated at $60.2 Billion

The world market for printed circuit boards (PCBs) reached an estimated $60.2 billion in value in 2014, growing just 0.7 percent in real terms, according to IPC’s World PCB Production Report for the Year 2014. Production growth in China, Thailand and Vietnam compensated for declining PCB production in most other regions. Developed by a team of the world’s leading PCB industry analysts, the annual study is the definitive source of PCB production data, indicating the volumes and types of PCBs being made in the world’s major producing countries.

The report contains estimates of 2014 PCB production value by nine product categories and by 30 countries or sub-regions. Four categories of rigid PCBs, three categories of flexible circuits, and IC substrates are covered. The standard multilayer rigid PCB values are further segmented by those having microvia structures and those with non-microvia structures. The report also includes updates on metal-core PCBs, as well as regional trends and historical data on regional shifts in PCB production.

The data show that the worldwide rigid PCB market grew modestly in 2014, while flexible circuit growth was flat. Regional trends are also examined, including China’s slowing production growth and the spectacular growth in the PCB industries of Thailand and Vietnam.

“PCB production is an international business and the landscape continues to change,” says Sharon Starr, IPC director of market research. “Companies based in Taiwan, Japan and South Korea, are responsible for more than two-thirds of world PCB production. These and other companies around the world are powering the impressive growth of PCB production in southeast Asia.”

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View Report Contents: World Printed Circuit Borads Production Report for the Year 2014.

 

 

 

World PCB Production in 2014 Estimated at $60.2 Billion

Industrial Robots: -- Markets Reach $48.9 Billion By 2021

ELECTRONICS.CA PUBLICATIONS announces the availability of a new study “Industrial Robots: Market Shares, Strategies, and Forecasts, Worldwide, 2015 to 2021”. Robots in general are poised to change every aspect of modern life. Robots are poised to change everything, what we eat, how we eat it, what we drive, how we drive it, what we manufacture, how we manufacture it, and the military, how we defend ourselves.

Robot technology is based on platforms that leverage sensors, controllers, software modules, cameras, visualization, and locomotors deploying machines for control of all repeatable process. Industrialization is after all the repetition of some task to create process. Robots take this a step further to create automation of process with the ability to move the units.

Robots are promising to improve yields in every industry. Robots make crops safer by eliminating or virtually eliminating herbicides. Downstream processing system solutions and robots achieve automation of process. Robots meet stringent hygiene and safety regulations, work tirelessly 24 hours a day, and relieve human workers of physically arduous tasks. Robots contribute to the freshness, variety and quality of food. Projects are ongoing. Projects are ongoing.

What could be tastier than a fresh picked strawberry, fully ripe, full of juicy appetence, exquisite in every way? Plant factories, grow lights, vertical farming appliances, and robots that make them possible are poised to change the economics of food growing. Robots in general are poised to change every aspect of modern life. Robots are poised to change everything, what we eat, how we eat it, what we drive, how we drive it, what we manufacture, how we manufacture it, and the military, how we defend ourselves.

Robots are set to bring a new industrial revolution more important than anything seen before. Industrial robots perform repetitive tasks efficiently, they do not eat, they do not make mistakes, they do not get tired, they do what they are told, they work 24 hours per day 7 days a week. Manufacturing plants are frequently long aisles of nothing but robots, no human in sight.

Beyond industrial robots that repeat actions, more intelligent robots loaded with sensors are able to automate process using processors and cameras to control action. Use of microprocessors provides a measure of intelligent control over the activity of the robot based on input from the sensors and the cameras.

Tablet apps are congruent technology for all robots, adding platform functionality and providing basic platform controls. There is the potential for standardization so the robotic platforms are congruent, but that has not happened yet. Companies with a presence in tablet markets are poised to benefit enormously from the growth of robot markets. The app software provides a universal mechanism that will permit flexible response to changing market conditions.

According to Susan Eustis, lead author of the the study, “The opportunity to participate in robotic markets is compelling. This new market is evolving as new automated process based on breakthroughs and innovation in technology is expressed in robotic platforms. Microprocessor technology, optics, cameras, nanotechnology, new materials, thin film batteries, and sensors are among the technologies being put to use in innovative ways in robots. The ability to apply any technology from any company is phenomenal.”

Consideration of Robot Market Forecasts indicates that markets at $53 billion will reach $171.7 billion by 2020. Growth comes as every industry achieves efficiency by automating process robotically. Robots are unique because they can perform multiple steps without human intervention and they can adapt to different conditions and different types of devices to be manipulated. The sensors and the cameras in the robots make them flexible.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report:  “Industrial Robots: Market Shares, Strategies, and Forecasts, Worldwide, 2015 to 2021“.

 

 

Industrial Robots: -- Markets Reach $48.9 Billion By 2021

Next Generation Quantum Dot: Markets Change Rapidly

ELECTRONICS.CA PUBLICATIONS, the electronics industry market research  and knowledge network, announces the availability of a new report entitled “Quantum Dots: Market Shares, Strategy, and Forecasts, Worldwide, 2015 to 2021”. Worldwide quantum dot markets are poised to achieve significant growth as next generation systems provide a way to improve traditional displays with vibrant color and decrease the cost of making electronic devices by decreasing manufacturing costs while increasing quality.

Quantum Dots: — Markets Reach $4.6 Billion By 2021

Quantum dot markets are set for rapid growth. Quantum dot market driving forces relate to technology maturity. TV displays, fuel cell catalysts, solar quantum dots, a range of applications depend on the ability to manufacture quantum dots consistently and in sufficient quantity to be useful in a commercial environment. Large screen TV displays represent one of the first commercial application for quantum dots.

This TV display market is a good market. The overall flat panel display (FPD) market is anticipated to reach US$110 Billion by 2017. Growth is driven by widespread use of devices that embed electronic displays. Displays fit in electronic TVs, notebooks, and mobile smart phones. Ample opportunities exist in the automotive sector as display mediums for entertainment and driver assistance systems.

FPDs can tap into opportunities in the advertising sector, where they are used for both outdoor and indoor ad displays. Public display systems are becoming more common. Technology innovation, lower prices, and robust demand bodes well for market development.

Quantum dot films inside FPDs are indispensable to electronic devices that require human operation and as a result LCD and plasma technologies are now commonplace. In the television industry. Quantum dot penetration of flat panel display markets promise to be huge. Demand for thin TVs is strong, with wall mounted TVs accounting for a major portion of the market. FPDs are popular for buildings and transport applications. They are used in digital picture frames.

Challenges to existing display technology comes from viewer desire for pure colors and low energy consumption. These features are provided by quantum dots. End-use of big TV displays are expected to drive quantum dot markets throughout the forecast period. Industries analyzed include information systems, personal computers, telecom equipment, instrumentation, consumer appliances, transportation equipment, stationary fuels cells, and medical devices.

Quantum Dot (QD) and Quantum Dot LED (QLED) Market is evolving. The quantum dot market depends on techniques for the development of commercial quantity production. Kilogram quantity mass production of quantum dots is a game-changer. High quality, high quantity and low price quantum dots increase the rate of change in consumer electronics markets.

Quantum dot technology offers screen quality far beyond what has been available previously. The quality of light is better for displays with quantum dots. New products are emerging as manufacturers learn to integrate high efficiency / luminescence quantum dots into display products. The level of change represents a paradigm shift that creates new industries, products, and jobs in science and industry.

The list of possible quantum dot applications is ever expanding. New applications are waiting for the availability of quantum dots.

• Gold Nanoparticles Illustrate Properties Of Colloidal Nanocrystals Size Dependency


• Intrinsic physical sizes are comparable to the critical sizes of many important properties of a given class of functional materials


• Wavelength of the electron wave function


• Diameter of photo-generated excitons


• Domain size of magnetic single domains


• Large surface-to-volume atom ratio alters the chemical potential of the structural


• Large surface-to-volume atom ratio different in comparison to corresponding bulk crystals


• Strongly size-dependent solubility of nanocrystals


• Presence of size dependent structures in the nanometer regime


• Electron band configuration


• Surface structure


• Surface reconstruction


• Unique crystal structures


• Unique catalytic properties of gold nanocrystals can be considered an example

Quantum Dot and Quantum Dot LED (QLED) market segments include HDTV and displays, solar, LED lighting, cancer imaging, personalized medicine, telco lasers, and ID tags. All segments are anticipated to achieve spectacular growth, with TV display technology and solar markets reaching over $1 billion per year in revenue by 2021. Qdot cancer imaging / personalized medicine reaches $750 million and quantum dot ID Tags go to $700 million dollars by 2021.

Vendors, including Nanosys and QD Vision synthesize these materials in solution, and formulate them into inks and films. Quantum Dot LEDs (QLED) enable performance and cost benefits.

Quantum Dot LED (QLED) commercial focus has remained on key optical applications: Optical component lasers are emerging as a significant market. LED backlighting for LCD displays, LED general lighting, and solar power quantum dots are beginning to reach the market. Vendors continue to evaluate other applications.

Medical applications are potentially large and beginning to reach a level of maturity that represents real market presence. Early stage work with University College London in cancer imaging is progressing.

According to Susan Eustis, lead author of the team that prepared the study, “Quantum dots QDs are nano-particles in the range of 2 nm to 10 nm diameter. Quantum dots are tiny bits of semiconductor crystals with optical properties that are determined by their size and shape more than material composition. Their small size is of nanoparticles is only now making them able to be manufactured in commercial quantities. They are made through a synthesis process. Strong growth is anticipated as companies master manufacturing techniques that allow consistent production”

Quantum dot markets at $306 million in 2014 are anticipated to reach $4.6 billion by 2021 as next generation devices, systems, and displays are triggered by quantum dots. Quantum dots represent the next wave of semi conductor revolution, giving sophisticated functionality based on the size and shape of the nanoparticle not the base material. Because the materials science is so easy to manipulate, the devices can be made very inexpensively with a lot of variety.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: “Quantum Dots: Market Shares, Strategy, and Forecasts, Worldwide, 2015 to 2021“.

Next Generation Quantum Dot: Markets Change Rapidly

3D Printing Materials Market Will Be Worth in Excess of $600M

3D printing is currently the subject of a great deal of speculation and excitement in the media. Touted as the technology to bring about the next industrial revolution and the in-sourcing of manufacturing jobs back to the West, the term in fact refers to a raft of technologies each of which is compatible for use with a particular material type.

---

In fact the materials market for 3D printing is possibly the most contentious issue in the 3D printing industry today. 3D printer manufacturers are increasingly engaging in practices which are perceived by end-users as anti-competitive by locking customers in to their own materials supplies via key-coding and RFID tagging of material cartridges, an activity which is effectively enabling monopoly pricing of the materials concerned.

Development of new materials for 3D printing is hindered by the practice of lock-in by some 3D printer manufacturers. Barriers to entry for 3rd party materials suppliers are high, and those who do enter the market are unable to get the economies of scale required to accelerate both materials development and progress towards a competitive market.

In the short to mid-term, downwards pressure on materials prices will be driven mainly by new entrants to the 3D printer manufacture arena that do not engage in lock-in practices and enable customers to source materials from the supplier(s) of their choice, and also by pressure from large end-users wielding buying power to force prices down.

This report gives forecasts to 2025 for the following materials supplies:

• Photopolymers


• Thermoplastics in solid form (ie. filaments and pellets)


• Thermoplastics in powder form


• Metal powders


• Powder-bed inkjet powders

SWOT analyses in each class are given and end-user requirements detailed.

Materials in development but not yet commercial, which research is mainly taking place in universities, are also discussed.

The market for photopolymers will retain the largest single segment of the market through to 2025 although the other materials markets will gain market share in terms of tons produced driven largely by the move away from prototyping/tooling applications towards final product manufacture.

Highest growth will be seen in the market for metal powders, although production, currently placed at less than 30 tons/year, will remain relatively low. This, in combination with high raw material and processing prices, will combine such that prices for these materials will fall more slowly than for alternative 3D printing materials.

Market growth in a business-as-usual scenario when lock-in remains common practice and prices remain high will be steady, as illustrated below.

However, extensive interviews with both materials developers and end-users indicate that prices are falling. This will modulate growth of the market size even as mass production increases in line with the growth of the cumulative installed base.

Further, for any given material class, market size (in terms of $M) is more sensitive to the installed base of the corresponding 3D printer technology than to the actual price of the materials themselves. Should material prices increase, only a small reduction in the average utilisation rate of the printer installed base is required for the market size to actually fall as a result.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: 3D Printing Materials 2015-2025: Status, Opportunities, Market Forecasts.

3D Printing Materials Market Will Be Worth in Excess of $600M

Next Generation Quantum Dot: Markets Change Rapidly

ELECTRONICS.CA PUBLICATIONS, the electronics industry market research  and knowledge network, announces the availability of a new report entitled “Quantum Dots: Market Shares, Strategy, and Forecasts, Worldwide, 2015 to 2021”. Worldwide quantum dot markets are poised to achieve significant growth as next generation systems provide a way to improve traditional displays with vibrant color and decrease the cost of making electronic devices by decreasing manufacturing costs while increasing quality.

Quantum Dots: — Markets Reach $4.6 Billion By 2021

Quantum dot markets are set for rapid growth. Quantum dot market driving forces relate to technology maturity. TV displays, fuel cell catalysts, solar quantum dots, a range of applications depend on the ability to manufacture quantum dots consistently and in sufficient quantity to be useful in a commercial environment. Large screen TV displays represent one of the first commercial application for quantum dots.

This TV display market is a good market. The overall flat panel display (FPD) market is anticipated to reach US$110 Billion by 2017. Growth is driven by widespread use of devices that embed electronic displays. Displays fit in electronic TVs, notebooks, and mobile smart phones. Ample opportunities exist in the automotive sector as display mediums for entertainment and driver assistance systems.

FPDs can tap into opportunities in the advertising sector, where they are used for both outdoor and indoor ad displays. Public display systems are becoming more common. Technology innovation, lower prices, and robust demand bodes well for market development.

Quantum dot films inside FPDs are indispensable to electronic devices that require human operation and as a result LCD and plasma technologies are now commonplace. In the television industry. Quantum dot penetration of flat panel display markets promise to be huge. Demand for thin TVs is strong, with wall mounted TVs accounting for a major portion of the market. FPDs are popular for buildings and transport applications. They are used in digital picture frames.

Challenges to existing display technology comes from viewer desire for pure colors and low energy consumption. These features are provided by quantum dots. End-use of big TV displays are expected to drive quantum dot markets throughout the forecast period. Industries analyzed include information systems, personal computers, telecom equipment, instrumentation, consumer appliances, transportation equipment, stationary fuels cells, and medical devices.

Quantum Dot (QD) and Quantum Dot LED (QLED) Market is evolving. The quantum dot market depends on techniques for the development of commercial quantity production. Kilogram quantity mass production of quantum dots is a game-changer. High quality, high quantity and low price quantum dots increase the rate of change in consumer electronics markets.

Quantum dot technology offers screen quality far beyond what has been available previously. The quality of light is better for displays with quantum dots. New products are emerging as manufacturers learn to integrate high efficiency / luminescence quantum dots into display products. The level of change represents a paradigm shift that creates new industries, products, and jobs in science and industry.

The list of possible quantum dot applications is ever expanding. New applications are waiting for the availability of quantum dots.

• Gold Nanoparticles Illustrate Properties Of Colloidal Nanocrystals Size Dependency


• Intrinsic physical sizes are comparable to the critical sizes of many important properties of a given class of functional materials


• Wavelength of the electron wave function


• Diameter of photo-generated excitons


• Domain size of magnetic single domains


• Large surface-to-volume atom ratio alters the chemical potential of the structural


• Large surface-to-volume atom ratio different in comparison to corresponding bulk crystals


• Strongly size-dependent solubility of nanocrystals


• Presence of size dependent structures in the nanometer regime


• Electron band configuration


• Surface structure


• Surface reconstruction


• Unique crystal structures


• Unique catalytic properties of gold nanocrystals can be considered an example

Quantum Dot and Quantum Dot LED (QLED) market segments include HDTV and displays, solar, LED lighting, cancer imaging, personalized medicine, telco lasers, and ID tags. All segments are anticipated to achieve spectacular growth, with TV display technology and solar markets reaching over $1 billion per year in revenue by 2021. Qdot cancer imaging / personalized medicine reaches $750 million and quantum dot ID Tags go to $700 million dollars by 2021.

Vendors, including Nanosys and QD Vision synthesize these materials in solution, and formulate them into inks and films. Quantum Dot LEDs (QLED) enable performance and cost benefits.

Quantum Dot LED (QLED) commercial focus has remained on key optical applications: Optical component lasers are emerging as a significant market. LED backlighting for LCD displays, LED general lighting, and solar power quantum dots are beginning to reach the market. Vendors continue to evaluate other applications.

Medical applications are potentially large and beginning to reach a level of maturity that represents real market presence. Early stage work with University College London in cancer imaging is progressing.

According to Susan Eustis, lead author of the team that prepared the study, “Quantum dots QDs are nano-particles in the range of 2 nm to 10 nm diameter. Quantum dots are tiny bits of semiconductor crystals with optical properties that are determined by their size and shape more than material composition. Their small size is of nanoparticles is only now making them able to be manufactured in commercial quantities. They are made through a synthesis process. Strong growth is anticipated as companies master manufacturing techniques that allow consistent production”

Quantum dot markets at $306 million in 2014 are anticipated to reach $4.6 billion by 2021 as next generation devices, systems, and displays are triggered by quantum dots. Quantum dots represent the next wave of semi conductor revolution, giving sophisticated functionality based on the size and shape of the nanoparticle not the base material. Because the materials science is so easy to manipulate, the devices can be made very inexpensively with a lot of variety.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: “Quantum Dots: Market Shares, Strategy, and Forecasts, Worldwide, 2015 to 2021“.

Next Generation Quantum Dot: Markets Change Rapidly

200 Million Smart Home Safety and Security Devices by 2020

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Smart Home Safety & Security – A Market Dynamics Report”.  According to this report, competition is intensifying for smart home service providers. This market research report covers the global IP security/smart home market as well as smart home safety and security products and services in the managed services, retail and professional installer channels. 

“Cloud-based open platforms are disrupting and creating new opportunities for smart home services,” said Mareca Hatler ON World’s research director. “Consumers are demanding greater choices as well as lower costs and smart home service providers are responding through strategic alliances and open source initiatives.”

ON World’s recently completed survey with 1,000 U.S. adults found that 30% are likely to adopt a smart home system within three years. Over half would like to have at least two integrated smart home applications and 60% of these would like three or more integrated applications. For half the respondents, safety and security is the primary reason they would adopt a smart home system.

Consumers are most satisfied with smart garage door openers, motion sensors and door locks, according to ON World’s evaluation of 170 smart home safety and security products with 20,000 product reviews. Some of the fastest growing product segments include video doorbells, smart smoke detectors and multi-purpose motion sensors.

Open source initiatives such as the AllSeen Alliance, OIC and mozaiq operations aim to accelerate smart home IoT product development and ensure interoperability across applications and transport layers. The AllSeen Alliance has grown rapidly over the past two years with over 100 members including smart home software, hardware and platform market leaders and innovators such as AT&T, Cisco, D-Link, Icontrol Networks, Legrand, LG, Honeywell, Iris by Lowe’s, Microsoft, Muzzley and Technicolor.

By 2020, there will be 200 million Internet connected wireless smart home security and safety products installed worldwide. At this time, 53% will be sold through managed services providers down from three quarters this year as sales through the retail/DIY channel will increase faster.

“Smart Home Safety & Security – A Market Dynamics Report” covers the global IP security/smart home market including safety, security, HVAC/energy, lighting controls and others as well as 12 smart home safety and security product segments for the managed services, retail/DIY and professional installer channels. It includes the results from a survey with 1,000 U.S. consumers; an evaluation of 170 products and 20,000 reviews; a competitive analysis; and 6-year global forecasts for installed systems and devices, revenues for equipment, software and services, and annual unit shipments by market, product segment and technology.

Smart Home Safety & Security – A Market Dynamics Report

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View Report Contents: “Smart Home Safety & Security – A Market Dynamics Report”.

200 Million Smart Home Safety and Security Devices by 2020

What Benefit Do IPC Standards Have For The Electronic Hardware Supply Chain?

For more than 50 years, IPC has developed industry standards for the production of electronic hardware. After having been long considered North American standards, IPC standards over the past two decades have spread globally. The question now is: what benefit do IPC standards have for the electronic hardware supply chain?

Providing answers to that question, several companies in Europe representing electronic design, CAD, bare board production, assembly and soldering explain how they use IPC standards in their daily business routines.

This first article covers electronic design/CAD company, GED GmbH, located 30 km southeast of Cologne in Germany.

First experience with IPC standards

GED offers PCB design and engineering and, through the assistance of external subcontractors, bare board, assembly and test services. Currently the company has 14 employees and CAD systems from six different layout vendors. With these resources, the company produces 160 new PCBs and 80 updates per year for rigid, flex, flex-rigid and HDI boards for customers in Germany, Italy, Sweden, the Netherlands, France and the Czech Republic.

From its establishment in 1986 to the middle of the 1990s, the company used its customers’ internal standards from companies such as Siemens, Philips, Rheinmetall and Thyssen. This meant that a different standard was used for every customer. An example of this frustrating situation, says Hanno Platz, owner and managing director, “was when we received an inquiry from Hewlett Packard in Germany with an attachment of 100 pages of requirements for the PCB in question.” At that time, the staff did not know about IPC and its standards. In 1995, the company had a U.S. customer that demanded that the assembly and soldering of a back plane, developed and produced in Germany, be conducted at their U.S. premises according to IPC-A-610, Acceptability of Electronic Assemblies, Class 3 acceptance criteria.

Technology focused on standards

GED found IPC standards through FED, a local German organization with a long-time relationship with IPC, and bought first set of IPC standards. The back plane could now be designed and produced according to IPC standards. Having standards from different areas of the production chain that linked together was a new and positive experience for the company. The staff now regularly discusses how to use IPC standards in their own designs as well as in the purchasing process of bare boards plus assembling and soldering.

Currently, all employees have passed CID (Certified Interconnect Designer) and CID+ (Advanced Certified Interconnect Designer) and are familiar with nearly all IPC standards for electronic design and CAD. All of their order acknowledgments for designing a complete PCB include the following statement, “If nothing else has been agreed upon, PCBs will be manufactured according to IPC standards and its Class 2 acceptance criteria.”

At GED, designers also create PCB layouts. Today, most new PCBs are HDI (high density interconnected) with a high SI (signal integrity) level including high EMC (electromagnetic compatibility). IPC standards have an important influence on these complex boards. The company uses the following IPC standards in their design work:

• The IPC-2220 PCB design series for mechanical properties of track, isolation and PTH (plated-through holes)


• IPC-2223B, Sectional Design Standard for Flexible Printed Boards for flex-rigid PCBs and questions like adhesive type, placement of a flex layer into the rigid part and coverlay dimensions


• IPC-7351A, Generic Requirements for Surface Mount Design and Land Pattern Standard for footprint (land) design, which is even more important than before because of lead-free processes, especially when components like CSPs (chip scale packages) and QFNs (quad flat no leads) are specified in the BOM list.


• IPC-A-610F, Acceptability of Electronic Assemblies for acceptability of solder joints and assemblies


• IPC-2251, Design Guide for the Packaging of High Speed Electronic Circuits and IPC-2141A, Design Guide for High-Speed Controlled Impedance Circuit Boards.With the need to comply with EU Directive 2004/108/EC, and its requirements for high EMC on all PCBs placed in the EU market, SI has become more critical. These standards assist GED designers in selecting microstrip or stripline build up for impedance.

Tool with benefit

The company’s ISO 9002 certification states that Deutsches Institut für Normung e.V. (DIN) and IPC standards serve as the foundation for quality work. IPC standards are required as a tool when the company uses external vendors for bare boards and assembly. For all potential suppliers in Europe, the staff conducts company visits that include an audit of the bare board supplier and their use of IPC standards, especially the IPC-6010 board manufacturing series and IPC-A-600H, Acceptability of Printed Boards. According to Platz, “After visiting hundreds of bare board suppliers, we’ve concluded that the majority of suppliers understand IPC standards but very few can make boards according to IPC Class 3 acceptance criteria. This is absolutely something that needs to improve.”

According to GED, IPC standards are the basis of electronic product quality and reliability. In the design process, technical parameters like choice of base material, pad sizes, spaces/traces and isolation distances between layer and component pitches are constant considerations. The use of IPC standards makes it much easier to find solutions. Without IPC standards, the alternative can involve high repair/touch up costs and lots of scrap but also an imperfect electronic product from a quality and reliability point of view. In some cases, this has been a very costly experience for the company’s customers that have not used IPC standards. Platz gives two examples:

Example 1: Working to improve EMC capabilities on a PCB, a designer placed via holes directly in surface mount pads. The result was years of solder and wetting problems with only an 80 to 90 percent yield and difficult repairs. The designer, by not following the standard, placed vias in a pad that was too tight. The profit loss over several years was estimated to be 50,000 to 60,000 Euros. The company was ultimately able to solve the problem by redesigning via hole placement that improved EMC properties.

Example 2: A complex 12-layer HDI board with BGA components on both sides needed to be manufactured using a lead-free process. After the transfer, yield went down to 50 percent. The reason: wrong design parameters and bad layer configurations were used and pads too small for via holes were created. With a higher lead-free solder temperature, many irreparable barrel cracks were created in via holes. The total loss due to the 50% yield in the lead-free process was more than 100,000 Euros.

For GED, IPC standards have been an invaluable tool over the past two decades. IPC standards not only save money, they also make it easier to communicate with bare board suppliers and assembly companies across the world. IPC standards can significantly reduce mistakes and improve end-product quality and reliability.

What Benefit Do IPC Standards Have For The Electronic Hardware Supply Chain?

Asian Semiconductor Equipment Suppliers to Lose Market Share in 2015

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Asian Semiconductor Equipment Suppliers: Markets, Market Shares, Market Forecasts”. According to this report, semiconductor equipment suppliers headquartered in Asia will drop from 36.6% of the global wafer front end (WFE) market in 2014.  Revenues generated in U.S. Dollar terms were $10.6 billion out of a global market of $29.2 Billion.

Listed below are the top 10 Asian semiconductor suppliers and their revenue.

Supplier	Country	2014 Revenues (US$Billions)
Tokyo Electron	Japan	4.7
Screen Semiconductor Solutions	Japan	1.1
Hitachi High-Technologies	Japan	0.9
Nikon	Japan	0.8
Hitachi Kokusai Electric	Japan	0.6
SEMES	Korea	0.5
Daifuku	Japan	0.3
NuFlare Technology	Japan	0.3
Tokyo Seimitsu	Japan	0.3
Murata Machinery	Japan	0.3
Source: The Information Network

“Share of revenues will drop to 33.4% in 2015, noted Dr. Robert Castellano, president of The Information Network, primarily due to the strong U.S. dollar, which has appreciated nearly 15% from 2014 levels.”

The report notes, for example, that Japan’s Tokyo Electron exhibited revenue growth of 16.3% in Yen for the first three quarters of CY 2015.  However, when converted to US Dollars, the universally accepted currency historically used for market share data in the semiconductor industry, revenues show a revenue growth of just 1.2%.

“The strong US Dollar not only impacts the Japanese suppliers, but other Asian suppliers and even European suppliers,” added Dr. Castellano.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View Report Contents: “Asian Semiconductor Equipment Suppliers: Markets, Market Shares, Market Forecasts“.

Asian Semiconductor Equipment Suppliers to Lose Market Share in 2015

PCB Industry Results for September 2015

North American PCB Sales Growth Continues

IPC — Association Connecting Electronics Industries® announced today the September findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales growth continued in September and the book-to-bill ratio fell back to a more normal but still positive 1.05.

Total North American PCB shipments increased 3.3 percent in September 2015 compared to September 2014. Year-to-date shipment growth finally reached positive territory at 0.3 percent, after struggling to overcome negative sales growth rates seen earlier this year. Compared to the previous month, PCB shipments were up 12.1 percent.

PCB bookings decreased 2.0 percent compared to September 2014, reducing year-to-date order growth to 5.2 percent. Orders were down 7.4 percent in September compared to the previous month.

“The North American PCB industry continues to see modest but positive sales growth, the result of strong order growth in most months of 2015. Orders contracted in September bringing the book-to-bill ratio down from a 5-year high in August to a more moderate level,” said Sharon Starr, IPC’s director of market research. “The book-to-bill ratio remains positive for the 12th consecutive month,” she added, “which is a strong indicator of positive sales growth in the fourth quarter of this year and into next year.”

Detailed Data Available

The next edition of IPC’s North American PCB Market Report, containing detailed September data from IPC’s PCB Statistical Program, will be available within the next week. The monthly report presents detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, military and medical market growth, demand for prototypes, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to six months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio at the end of each month. Statistics for the current month are available in the last week of the following month.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View Report Contents: IPC’s North American PCB Market Report. Electronics.ca Publications is an IPC member and authorized distributor of IPC industry standards, workforce training products, and market research reports.

 

PCB Industry Results for September 2015

Worldwide ROADM Market Will Grow From $5.4 billion in 2015 to $8.8 Billion in 2020

Network Transmission Market Report and Analysis of Proposed Nokia / Alcatel-Lucent Merger

Nokia has recently announced that it is buying French telecom equipment maker Alcatel-Lucent for $16.6 billion. The merger of Nokia and Alcatel-Lucent will no doubt change the competitive landscape of the optical networking industry. A new report provides a quantitative forecast of a major part of the optical networking market that Nokia is buying into from its proposed purchase of Alcatel-Lucent.

According to a new market report “Network Transmission Market Analysis and Equipment Forecast: ROADMS, DWDM, Routers and Switches and the Impact of Net Neutrality”, the worldwide ROADM market will grow from $5.4 billion in 2015 to $8.8 billion in 2020. In addition to the ROADMs market, the report provides detailed analysis and forecasts for DWDM, Routers, and switches in North America and Worldwide.

This report is focused on forecasting demand for specific types of carrier-class network transmission equipment: ROADMS, DWDM, Routers and Switches.

To make that forecast it will investigate the demand parameters of this situation, which are primarily traffic forecasts. After reviewing the regulatory climate (Net Neutrality), and the market demand, the Report will look at capital expenditure forecasts as a surrogate for Supply. Then it will provide forecasts for various classes (ROADMs, DWDM, Routers and Switches) of optical network equipment in this environment.

Network Transmission Market Analysis Provides:

• Equipment descriptions and sales forecasts for ROADMS, DWDM, Routers, and Switches through 2020.


• A discussion of Net Neutrality, the players, the issues, and its impact on equipment sales.


• Traffic forecasts for the North American Internet through 2020


• N.A. and World forecasts for Mobile Traffic, Advanced Access Architecture lines(FiOS, U-Verse, Google), High-Speed lines (XDSL and cable modems) and International Traffic (North America only) through 2020.


• Capital Expenditure forecasts for the major telecom companies through 2020.


• Listing of Major Vendors in the Transmission Equipment space.

This report covers the very current topic of Network Neutrality, which is much in the headlines as this is being written, and its forecasted impact on network equipment sales.

The study also examines the network traffic and, through analysis, shows that traffic from four major sources (AAA lines, H-H lines, Mobile lines and International) is responsible for the vast preponderance of traffic and traffic growth. Forecasts are provided (through 2020) for these classes of traffic and for the Internet as a whole. Based on the information from the traffic forecasts, the uncertainty from regulation (Net Neutrality) and the capital investment plans and forecasts, the Report will then provide equipment sales forecasts (units and dollars) for ROADMs, DWDM, Routers, and Switches (all carrier class) through 2020 for North America and for the World. Detailed descriptions of each type of equipment being forecast is also provided.

 

 

 

Worldwide ROADM Market Will Grow From $5.4 billion in 2015 to $8.8 Billion in 2020

Download IPC Standards - Everything You Need From Start To Finish

To achieve a high quality end product and maintain a competitive position in the marketplace, you need to infuse quality throughout the manufacturing process.

Did you know there is an IPC standard associated with nearly every step of printed circuit board production and assembly?  From design and purchasing to assembly and acceptance, Electronics.ca Publications offers IPC Standards to help you assure superior quality, reliability and consistency in the electronic assemblies that go into your product. Download IPC Standards Spec Tree – PDF file.

As with the manufacturing process — which uses a step-by-step approach – IPC standards also build upon one another. To achieve your desired results, it’s important to implement the appropriate IPC standards associated with each step of production.

Download IPC Standards Spec Tree – PDF File

Why Use IPC Standards in Your Manufacturing Process?

• Gain Control Over End Product Quality and Reliability — Quality and reliability are the cornerstones of competing in the marketplace and critical to your company’s reputation and profitability. By implementing IPC standards throughout the manufacturing process, you help ensure better performance, longer life and compliance with lead-free regulations.


• Improve Communication with Suppliers and Employees — IPC standards are the standards that your competitors, suppliers and EMS providers use. Working from an established IPC standard helps all of you to “speak the same language” — the language of the global electronic industry. In addition, using IPC standards eliminates confusion for employees, because they know they need to perform to an established industry standard.


• Help Contain Costs — Ensuring that your design and the bare boards you purchase comply with IPC standards allows you to produce electronic assemblies that meet stringent quality tests down the line, minimizing costly delays, rework and scrap.

The Most Popular IPC Documents are available from Electronics.ca Publications in PDF Format

Download IPC Standards

IPC A-610F – Acceptability of Electronic Assemblies
IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments.

IPC J-STD-001F – Requirements for Soldered Electrical and Electronic Assemblies
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies has emerged as the preeminent authority for electronics assembly manufacturing. The standard describes materials, methods and verification criteria for producing high quality soldered interconnections. The standard emphasizes process control and sets industry-consensus requirements for a broad range of electronic products. This revision now includes support for lead free manufacturing.

IPC A-620B – Requirements and Acceptance for Cable and Wire Harness Assemblies
Revision B is now available for the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies.

IPC-DRM-PTH-E
Now updated to Revision D of the latest IPC-A-610E and J-STD-001E – our Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections.

IPC-DRM-SMT-E
Useful as a training aid in the classroom or on the shop floor, DRM-SMT-E contains computer generated color illustrations of Chip component, Gull Wing and J-Lead solder joints.

IPC-J-STD-033C
J-STD-033 Provides Surface Mount Device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs.

IPC-J-STD-020D-1
IPC-J-STD-020D-1 standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress.

J-STD-075

J-STD-075 provides test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing.

IPC Collections:

IPC-C-103 – Electronics Assembly Standards Collection

IPC-C-1000 Essential Document Collection for Board Design, Assembly and Manufacture

IPC-C-108 Cleaning Guides and Handbooks Collection

Through Electronics.ca you can order IPC standards for printed circuit board design and manufacturing and electronics assembly, including handbooks, guidelines and IPC training videos.

Download IPC Standards - Everything You Need From Start To Finish

New IPC Standards For Printed Circuit Boards

NEW IPC-A-610F Acceptability of Electronic Assemblies

IPC-A-610 is the most widely used standard for circuit board production in the world. IPC-A-610F illustrates acceptability requirements for electronic assemblies with over 814 colour images and illustrations. Topics include flex attachment, board in board, part on part, lead free, component orientation and soldering criteria for through-hole, SMT (new termination styles) and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements. This revision F includes two new SMT termination styles, and changes in plated-through hole fill and BGA void criteria. Major topics include flex attachment, board-in-board, part-on-part, both lead-free and tin-lead criteria, component orientation and soldering criteria for through hole, SMT, cleaning, marking, coating and laminate requirements. IPC Standards for printed circuit boards: order and download IPC A-610F

IPC-A-610 is invaluable for all inspectors, operators and trainers. Revision F has 814 photos and illustrations of acceptability criteria — 86 of them new or updated. The document is most often used with the material and process standard IPC J-STD-001.

NEW J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies

J-STD-001F is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for both traditional solder alloys and for lead-free manufacturing. Revision to plated-through hole, PTH, minimum fill requirements; criteria for two new SMT termination types; and expanded conformal coating criteria. Clarification of criteria descriptions for easier understanding. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity. This standard fully complements IPC-A-610F and is supported by IPC-HDBK-001. Order and  download IPC J-STD-001F

IPC-7527 Requirements for Solder Paste Printing

IPC-7527 covers the many aspects of solder paste application, from initial placement on the board through production and testing. To equipment operators, the new standard serves as a reference guide with more than 50 photos packed into the 15-page standard.  IPC-7527 provides the operators with a standard that will help them make the right decisions when they face issues in production, and no professionals or specialists are present.

While there are standards that detail what a completed assembly should look like, IPC-7527 is the first one to provide requirements for what the printed solder paste should look like and how far off centers can be before they’re considered defects. It covers everything from basic squeegees to jet dispensers and needle dispensers to closed print heads. In addition, IPC-7527 provides information on automated paste inspection using either cameras or lasers. Order and download IPC-7527.

IPC-7093 Design and Assembly Process Implementation for Bottom Termination components

This standard describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body. The BTCs in this document include all types and forms of bottom-only termination components intended for surface mounting. This includes such industry descriptive nomenclature as QFN, DFN, SON, LGA, MLP and MLF. The focus of the information is on critical design, assembly, inspection, repair, and reliability issues associated with BTCs.

The target audiences for this document are managers, design and process engineers, and operators and technicians who deal with the electronic design, assembly, inspection and repair processes. The intent is to provide useful and practical information to those companies who are using or considering tin/lead, lead free, adhesives or other forms of interconnection processes for assembly of BTC type components. Although not a complete recipe, the document identifies many of the characteristics that influence the successful implementation of robust and reliable assembly processes and provides guidance information to component suppliers regarding the issues being faced in the assembly process. Order and  download IPC-7093

IPC-7095C Design and Assembly Process Implementation for BGAs

Implementing ball grid array (BGA) and fine-pitch ball grid array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095C delivers useful and practical information to anyone currently using BGAs or FBGAs. Many issues have become especially important due to the change in the alloys of the ball, the ball shape, and the attachment procedures. The major emphasis of Revision C is to provide information on some of the new mechanical failure issues such as cratering or laminate defects caused after assembly.

In addition to providing guidelines for BGA inspection and repair, IPC-7095C addresses reliability issues and the use of lead-free joint criteria associated with BGAs. There are many photographs of X-ray and endoscope illustrations to identify some of the conditions that the industry is experiencing in the implementation of BGA assembly processes. Order and download IPC-7095C

IPC-7711/7721B Rework, Modification and Repair of Electronic Assemblies

This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. Order and download IPC-7711/7721B.

Purchase and Download IPC Standards For Printed Circuit Boards from Electronics.ca Publications today!

Effective January 1, 2015, a price increase of 4 percent will be implemented on all standards.

 

New IPC Standards For Printed Circuit Boards

200 Million Smart Home Safety and Security Devices by 2020

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Smart Home Safety & Security – A Market Dynamics Report”.  According to this report, competition is intensifying for smart home service providers. This market research report covers the global IP security/smart home market as well as smart home safety and security products and services in the managed services, retail and professional installer channels. 

“Cloud-based open platforms are disrupting and creating new opportunities for smart home services,” said Mareca Hatler ON World’s research director. “Consumers are demanding greater choices as well as lower costs and smart home service providers are responding through strategic alliances and open source initiatives.”

ON World’s recently completed survey with 1,000 U.S. adults found that 30% are likely to adopt a smart home system within three years. Over half would like to have at least two integrated smart home applications and 60% of these would like three or more integrated applications. For half the respondents, safety and security is the primary reason they would adopt a smart home system.

Consumers are most satisfied with smart garage door openers, motion sensors and door locks, according to ON World’s evaluation of 170 smart home safety and security products with 20,000 product reviews. Some of the fastest growing product segments include video doorbells, smart smoke detectors and multi-purpose motion sensors.

Open source initiatives such as the AllSeen Alliance, OIC and mozaiq operations aim to accelerate smart home IoT product development and ensure interoperability across applications and transport layers. The AllSeen Alliance has grown rapidly over the past two years with over 100 members including smart home software, hardware and platform market leaders and innovators such as AT&T, Cisco, D-Link, Icontrol Networks, Legrand, LG, Honeywell, Iris by Lowe’s, Microsoft, Muzzley and Technicolor.

By 2020, there will be 200 million Internet connected wireless smart home security and safety products installed worldwide. At this time, 53% will be sold through managed services providers down from three quarters this year as sales through the retail/DIY channel will increase faster.

“Smart Home Safety & Security – A Market Dynamics Report” covers the global IP security/smart home market including safety, security, HVAC/energy, lighting controls and others as well as 12 smart home safety and security product segments for the managed services, retail/DIY and professional installer channels. It includes the results from a survey with 1,000 U.S. consumers; an evaluation of 170 products and 20,000 reviews; a competitive analysis; and 6-year global forecasts for installed systems and devices, revenues for equipment, software and services, and annual unit shipments by market, product segment and technology.

Smart Home Safety & Security – A Market Dynamics Report

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View Report Contents: “Smart Home Safety & Security – A Market Dynamics Report”.

200 Million Smart Home Safety and Security Devices by 2020

U.S.A. Electronic Security Product Demand to Exceed $16 Billion in 2019

Demand for electronic security products in the US is projected to rise 7.0 percent annually through 2019 to $16.2 billion.

Strengthening new construction expenditures following the recession-impacted 2009-14 period will drive gains. A heightened perceived risk of crime due to widespread media coverage will also support gains, even as the actual number of crimes has declined in recent years. Technological advances will promote sales gains in all segments, both by providing a boost to value demand via the incorporation of value-added features and by increasing market penetration.

These and other trends are presented in the new study Electronic Security Products. This study represents a unique combination of the research skills and resources of The Freedonia Group and the security industry insight of the Security Industry Association (SIA) and its members.

Demand for video surveillance products and systems designed for use in security-related settings will advance 8.2 percent annually, the fastest growth of the five primary electronic security product categories. In 2014, there were approximately 35 million total video surveillance security cameras installed and in use in the United States. That number will continue to expand for the foreseeable future as market penetration increases and as locations add more cameras to their existing surveillance systems.

Access control systems will see strong gains as smart card-based systems gain traction over less secure technologies such as proximity and magnetic stripe cards. Access control systems that integrate increasingly advanced layers of credentials, such as mobile phones and biometrics, will support further gains. Rising consumer familiarity with biometric systems, driven by the use of biometric technologies in identification applications, will help promote demand for the small but rapidly growing biometric access control segment. Improvements in reliability and efficiency of biometric devices, coupled with falling prices, will further aid adoption.

Interoperability as well as innovations in mobile monitoring will boost demand for alarms, which accounted for the largest share of sales in 2014. “The increasing array of plug-and-play electronic security devices that are self-monitored will expand the potential market base of consumers willing to purchase supplemental security measures,” notes analyst Katherine Brink. “These smart products are controlled and accessed via mobile devices, aiding security equipment sales as interest in smart home automation systems also rises.” The alarm segment will further benefit from innovations in personal emergency response service (PERS) alarms.

US ELECTRONIC SECURITY PRODUCT DEMAND (million dollars)
% Annual Growth
Item	2009	2014	2019	2009- 2014	2014- 2019
Security Product Demand	9445	11550	16200	4.1	7.0
Alarms	2725	3375	4750	4.4	7.1
Access Controls	2850	3145	4470	2.0	7.3
Video Surveillance	2135	3075	4555	7.6	8.2
Contraband Detection	1140	1355	1675	3.5	4.3
Electronic Article Surveillance	426	400	485	-1.3	3.9
Other	169	200	265	3.4	5.8

Source: Freedonia Electronic Security Products study

(published 11/2015, 424 pages) is available from Electronics.ca Publications.

 

U.S.A. Electronic Security Product Demand to Exceed $16 Billion in 2019

European Manufacturing Spotlight: Trends, Innovations, and Growth

IPC President and CEO John Mitchell discusses the growth of the European manufacturing industry and how IPC supports IPC members through standards, education and advocacy efforts.

https://www.youtube.com/watch?v=N07iGd5zbsI

To achieve a high quality end product and maintain a competitive position in the marketplace, you need to infuse quality throughout the manufacturing process.

Did you know there is an IPC standard associated with nearly every step of printed circuit board production and assembly?  From design and purchasing to assembly and acceptance, Electronics.ca Publications offers IPC Standards to help you assure superior quality, reliability and consistency in the electronic assemblies that go into your product. Download IPC Standards Spec Tree – PDF file.

As with the manufacturing process — which uses a step-by-step approach – IPC standards also build upon one another. To achieve your desired results, it’s important to implement the appropriate IPC standards associated with each step of production.

IPC Standards are available from Electronics.ca Publications in English, German, French, Spanish, Chinese, Japanese, and other languages. IPC-Richtlinien in deutscher Übersetzung Les normes IPC en Français  Adquirir estándares de IPC  IPC 行业标准 (in Chinese) IPC から IPC ELECTRONICS.CA 標準を購入

Download IPC Standards Spec Tree – PDF File

Why Use IPC Standards in Your Manufacturing Process?

• Gain Control Over End Product Quality and Reliability — Quality and reliability are the cornerstones of competing in the marketplace and critical to your company’s reputation and profitability. By implementing IPC standards throughout the manufacturing process, you help ensure better performance, longer life and compliance with lead-free regulations.


• Improve Communication with Suppliers and Employees — IPC standards are the standards that your competitors, suppliers and EMS providers use. Working from an established IPC standard helps all of you to “speak the same language” — the language of the global electronic industry. In addition, using IPC standards eliminates confusion for employees, because they know they need to perform to an established industry standard.


• Help Contain Costs — Ensuring that your design and the bare boards you purchase comply with IPC standards allows you to produce electronic assemblies that meet stringent quality tests down the line, minimizing costly delays, rework and scrap.

The Most Popular IPC Documents are available from Electronics.ca Publications in PDF Format

Download IPC Standards

IPC A-610F – Acceptability of Electronic Assemblies
IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments.

IPC J-STD-001F – Requirements for Soldered Electrical and Electronic Assemblies
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies has emerged as the preeminent authority for electronics assembly manufacturing. The standard describes materials, methods and verification criteria for producing high quality soldered interconnections. The standard emphasizes process control and sets industry-consensus requirements for a broad range of electronic products. This revision now includes support for lead free manufacturing.

IPC A-620B – Requirements and Acceptance for Cable and Wire Harness Assemblies
Revision B is now available for the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies.

IPC-DRM-PTH-E
Now updated to Revision D of the latest IPC-A-610E and J-STD-001E – our Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections.

IPC-DRM-SMT-E
Useful as a training aid in the classroom or on the shop floor, DRM-SMT-E contains computer generated color illustrations of Chip component, Gull Wing and J-Lead solder joints.

IPC-J-STD-033C
J-STD-033 Provides Surface Mount Device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs.

IPC-J-STD-020D-1
IPC-J-STD-020D-1 standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress.

J-STD-075

J-STD-075 provides test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing.

IPC Collections:

IPC-C-103 – Electronics Assembly Standards Collection

IPC-C-1000 Essential Document Collection for Board Design, Assembly and Manufacture

IPC-C-108 Cleaning Guides and Handbooks Collection

Through Electronics.ca you can order IPC standards for printed circuit board design and manufacturing and electronics assembly, including handbooks, guidelines and IPC training videos.

Learn more about European manufacturing market and publications that provide informed perspective and relevant analysis of emergent technologies.

European Manufacturing Spotlight: Trends, Innovations, and Growth

Thin Film and Printed Battery (TFB) Market Opportunities

Thin, Flexible and Printed Battery Market Will Increase To Over $300m By 2024

Form factor is becoming a major driver shaping innovation and transforming the energy storage industry globally. This is fueled by the emergence of new market categories such as wearable electronic devices and Internet of Things, which demand thinness and flexibility. These new market categories will help the market for thin and flexible batteries reach $300 million in 2024.

Thin, flexible or printed batteries have commercially existed for more than ten years. Traditionally, the micro-power thin and printed batteries were used in skin patches, RFID tags and smart cards. Today, however, the composition of the target market is undergoing drastic change driven by the emergence of new addressable market categories. This trend has enticed many large players to enter the foray, starting to transform a business landscape that was once populated predominantly by small firms.

The change in target markets is inevitably driving change in the technology landscape too. This means that the market in 2024 will look vastly different from that in 2014, both on the technology and market level. Technology and markets that are major contributes today will have a small role to play, while new segments and technology will grow to dominate this sector.

For more details of the new report on flexible and printed battery market, visit: Flexible, Printed and Thin Film Batteries 2015-2025: Technologies, Forecasts, Players.

 

Thin Film and Printed Battery (TFB) Market Opportunities

Silicon Photonics Market Analysis by Products, Applications & Geography - Analysis & Forecast

Silicon Photonics is a relatively new technology which uses optical rays in order to transfer data between different computer chips and peripherals. New report covers particularly the markets for final products, devices and equipment that function on Silicon Photonics technology for six major application verticals namely: Telecommunications, Data communication, displays and consumer electronics, sensing, metrology, high performance computing and medicines. The silicon photonics market is expected to increase at a compound annual growth rate (CAGR) of 27.74% from 2014 to $497.53m by 2020.

Silicon photonics is being implemented by various companies in their product portfolios due to features such as high-speed data transfer and the integration of large data into a small device. With the help of silicon photonics, products such as optical waveguides, modulators, and photo-detectors can be integrated within a single device, providing a smaller form factor. In particular, wavelength division multiplexer filters (WDMF) and silicon optical modulators (SOM) have the highest share in the North American market currently. Thus, this shows that WDMF and SOM products in the silicon photonics market have great potential to grow over time.

The silicon photonics market is dominated by the North American region in terms of market size. Growing demand to transfer data as well as government funding in silicon photonics are motivating companies to launch silicon photonics products in the North American market, says the market research firm. However, the Asia-Pacific (APAC) region has been growing at the highest CAGR.

In terms of the competitive landscape, the market is witnessing new product launches and large-scale collaborations, as well as agreements and partnerships across the value chain, with a number of tier-one players around the globe, notes the report.

The report lists the major players in the silicon photonics market as Intel (USA), Hamamatsu Photonics, K.K (Japan), Finisar (USA), IBM (USA), Luxtera (USA), ST Microelectronics (Switzerland), 3S Photonics (France), Oclaro (USA), Mellanox Technologies (USA), and Infinera (USA).

The figure below shows the life-cycle analysis of the various silicon Photonics application sectors based on factors like the time-to-market and the key features of the products in the different application sectors.

Silicon Photonics Application Life-Cycle Analysis

Silicon Photonics Market Analysis

The figure above shows in detail the short-term, medium-term and long-term applications for silicon photonics products, against the different features of the products for each applications. Datacom application revenue will dwarf all the other sectors in the coming future. The low-power consuming feature and the high data transfer rate capabilities achieved using silicon photonics are the main reason for the growth in the Datacom sector in the near future.

In applications like Telecom (Long-haul and Metro/LAN applications), Bio-medical sensors, Fiber-to-the-home (FTTH) and others, the major advantage of using silicon photonics will be the durability of the products as compared to the current conventional substitutes. Thus these applications will emerge in the medium-term (5-7 years).

In the long-term (beyond 10 years), silicon photonics is expected to become a default component of digital communication at the chip-level and board-level. These will open up doors to high volume of production and sales in the future.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: Silicon Photonics Market Analysis by Products, Applications  & Geography – Analysis & Forecast.

Silicon Photonics Market Analysis by Products, Applications & Geography - Analysis & Forecast