This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry. Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world. The content of this report is based on primary data obtained through interviews, and publicly available information such as corporate financial statements. The report finds that, after continuous expansion in two quarters in a row, shipment value of the Taiwanese IC packaging and testing industry saw a slight sequential decline in the fourth quarter of 2013. The downturn is expected to continue well into the first quarter of 2014, before a bounce-back being anticipated in the second quarter. Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications" web site. View the report: Taiwanese IC Packaging & Testing Industry.
Electronics.ca Publications is a world-class research network and publishing company whose focus is technology and market research for the electronics industry.
Tuesday, June 17, 2014
Taiwanese IC Packaging & Testing Industry
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