Download IPC Standards - Everything You Need From Start To Finish

To achieve a high quality end product and maintain a competitive position in the marketplace, you need to infuse quality throughout the manufacturing process.

Did you know there is an IPC standard associated with nearly every step of printed circuit board production and assembly?  From design and purchasing to assembly and acceptance, Electronics.ca Publications offers IPC Standards to help you assure superior quality, reliability and consistency in the electronic assemblies that go into your product. Download IPC Standards Spec Tree – PDF file.

As with the manufacturing process — which uses a step-by-step approach – IPC standards also build upon one another. To achieve your desired results, it’s important to implement the appropriate IPC standards associated with each step of production.

Download IPC Standards Spec Tree – PDF File

Why Use IPC Standards in Your Manufacturing Process?

• Gain Control Over End Product Quality and Reliability — Quality and reliability are the cornerstones of competing in the marketplace and critical to your company’s reputation and profitability. By implementing IPC standards throughout the manufacturing process, you help ensure better performance, longer life and compliance with lead-free regulations.


• Improve Communication with Suppliers and Employees — IPC standards are the standards that your competitors, suppliers and EMS providers use. Working from an established IPC standard helps all of you to “speak the same language” — the language of the global electronic industry. In addition, using IPC standards eliminates confusion for employees, because they know they need to perform to an established industry standard.


• Help Contain Costs — Ensuring that your design and the bare boards you purchase comply with IPC standards allows you to produce electronic assemblies that meet stringent quality tests down the line, minimizing costly delays, rework and scrap.

The Most Popular IPC Documents are available from Electronics.ca Publications in PDF Format

Download IPC Standards

IPC A-610F – Acceptability of Electronic Assemblies
IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments.

IPC J-STD-001F – Requirements for Soldered Electrical and Electronic Assemblies
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies has emerged as the preeminent authority for electronics assembly manufacturing. The standard describes materials, methods and verification criteria for producing high quality soldered interconnections. The standard emphasizes process control and sets industry-consensus requirements for a broad range of electronic products. This revision now includes support for lead free manufacturing.

IPC A-620B – Requirements and Acceptance for Cable and Wire Harness Assemblies
Revision B is now available for the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies.

IPC-DRM-PTH-E
Now updated to Revision D of the latest IPC-A-610E and J-STD-001E – our Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections.

IPC-DRM-SMT-E
Useful as a training aid in the classroom or on the shop floor, DRM-SMT-E contains computer generated color illustrations of Chip component, Gull Wing and J-Lead solder joints.

IPC-J-STD-033C
J-STD-033 Provides Surface Mount Device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs.

IPC-J-STD-020D-1
IPC-J-STD-020D-1 standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress.

J-STD-075

J-STD-075 provides test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing.

IPC Collections:

IPC-C-103 – Electronics Assembly Standards Collection

IPC-C-1000 Essential Document Collection for Board Design, Assembly and Manufacture

IPC-C-108 Cleaning Guides and Handbooks Collection

Through Electronics.ca you can order IPC standards for printed circuit board design and manufacturing and electronics assembly, including handbooks, guidelines and IPC training videos.

Download IPC Standards - Everything You Need From Start To Finish

U.S.A. Electronic Security Product Demand to Exceed $16 Billion in 2019

Demand for electronic security products in the US is projected to rise 7.0 percent annually through 2019 to $16.2 billion.

Strengthening new construction expenditures following the recession-impacted 2009-14 period will drive gains. A heightened perceived risk of crime due to widespread media coverage will also support gains, even as the actual number of crimes has declined in recent years. Technological advances will promote sales gains in all segments, both by providing a boost to value demand via the incorporation of value-added features and by increasing market penetration.

These and other trends are presented in the new study Electronic Security Products. This study represents a unique combination of the research skills and resources of The Freedonia Group and the security industry insight of the Security Industry Association (SIA) and its members.

Demand for video surveillance products and systems designed for use in security-related settings will advance 8.2 percent annually, the fastest growth of the five primary electronic security product categories. In 2014, there were approximately 35 million total video surveillance security cameras installed and in use in the United States. That number will continue to expand for the foreseeable future as market penetration increases and as locations add more cameras to their existing surveillance systems.

Access control systems will see strong gains as smart card-based systems gain traction over less secure technologies such as proximity and magnetic stripe cards. Access control systems that integrate increasingly advanced layers of credentials, such as mobile phones and biometrics, will support further gains. Rising consumer familiarity with biometric systems, driven by the use of biometric technologies in identification applications, will help promote demand for the small but rapidly growing biometric access control segment. Improvements in reliability and efficiency of biometric devices, coupled with falling prices, will further aid adoption.

Interoperability as well as innovations in mobile monitoring will boost demand for alarms, which accounted for the largest share of sales in 2014. “The increasing array of plug-and-play electronic security devices that are self-monitored will expand the potential market base of consumers willing to purchase supplemental security measures,” notes analyst Katherine Brink. “These smart products are controlled and accessed via mobile devices, aiding security equipment sales as interest in smart home automation systems also rises.” The alarm segment will further benefit from innovations in personal emergency response service (PERS) alarms.

US ELECTRONIC SECURITY PRODUCT DEMAND (million dollars)
% Annual Growth
Item	2009	2014	2019	2009- 2014	2014- 2019
Security Product Demand	9445	11550	16200	4.1	7.0
Alarms	2725	3375	4750	4.4	7.1
Access Controls	2850	3145	4470	2.0	7.3
Video Surveillance	2135	3075	4555	7.6	8.2
Contraband Detection	1140	1355	1675	3.5	4.3
Electronic Article Surveillance	426	400	485	-1.3	3.9
Other	169	200	265	3.4	5.8

Source: Freedonia Electronic Security Products study

(published 11/2015, 424 pages) is available from Electronics.ca Publications.

 

U.S.A. Electronic Security Product Demand to Exceed $16 Billion in 2019

International Economic Outlook: Will High Risk Events Trigger a Recession?

Will High Risk Events Trigger a Recession?

In the worldwide business cycle, the group of the English-speaking countries has led historically global economic activity. Monthly predictive analytics signal an underlying weakness for several months in the English-speaking countries, which have posted negative or steadily declining growth rates in their leading indicators.

Globally, trade predictive analytics, which summarize worldwide merchandize exports, clearly point out an undergoing global slowdown contradicting the media created myth of transitory snowstorms in New England as the cause of an economic downswing in the United States in the first quarter of this year. In March of this year, global exports, on a year-to-year basis, declined by 12.4%, the sixth consecutive monthly decline in a row following an expansion since October 2014.  On a quarterly basis, in the first quarter of 2015 global exports dropped 10.2% from a year ago to $3.7 trillion, following a 2.6% decline in the last quarter of 2014. A major trigger for such dramatic changes in each county’s business cycle has been the “burst” of the oil-price bubble coupled with currency realignments from the strengthening of the US dollar as well as a slowdown in the growth in emerging economies.

In addition to geopolitical risks related to Middle East and Eastern Europe, there is high probability of bursting this year one or more  policy-created bubbles.  A hard landing in China from housing prices and/or stock market corrections; disintegration of the Euro Area; high debt to income ratios – both private and public – in several countries; and the timing of an exit from an ill-conceived and permanent-perceived monetary policy of zero interest rates in the United States. Any of these events may trigger a significant correction in stock markets leading to another major recession with no tools left for economic policy. …Assigning a 40% probability that any of these events will come suddenly into play this year .

By Evangelos Otto Simos, Ph.D.

• Related Research: Global Semiconductor Industry Leading Indicator and Forecast Report.

 

International Economic Outlook: Will High Risk Events Trigger a Recession?

Download IPC Standards - Everything You Need From Start To Finish

To achieve a high quality end product and maintain a competitive position in the marketplace, you need to infuse quality throughout the manufacturing process.

Did you know there is an IPC standard associated with nearly every step of printed circuit board production and assembly?  From design and purchasing to assembly and acceptance, Electronics.ca Publications offers IPC Standards to help you assure superior quality, reliability and consistency in the electronic assemblies that go into your product. Download IPC Standards Spec Tree – PDF file.

As with the manufacturing process — which uses a step-by-step approach – IPC standards also build upon one another. To achieve your desired results, it’s important to implement the appropriate IPC standards associated with each step of production.

Download IPC Standards Spec Tree – PDF File

Why Use IPC Standards in Your Manufacturing Process?

• Gain Control Over End Product Quality and Reliability — Quality and reliability are the cornerstones of competing in the marketplace and critical to your company’s reputation and profitability. By implementing IPC standards throughout the manufacturing process, you help ensure better performance, longer life and compliance with lead-free regulations.


• Improve Communication with Suppliers and Employees — IPC standards are the standards that your competitors, suppliers and EMS providers use. Working from an established IPC standard helps all of you to “speak the same language” — the language of the global electronic industry. In addition, using IPC standards eliminates confusion for employees, because they know they need to perform to an established industry standard.


• Help Contain Costs — Ensuring that your design and the bare boards you purchase comply with IPC standards allows you to produce electronic assemblies that meet stringent quality tests down the line, minimizing costly delays, rework and scrap.

The Most Popular IPC Documents are available from Electronics.ca Publications in PDF Format

Download IPC Standards

IPC A-610F – Acceptability of Electronic Assemblies
IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments.

IPC J-STD-001F – Requirements for Soldered Electrical and Electronic Assemblies
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies has emerged as the preeminent authority for electronics assembly manufacturing. The standard describes materials, methods and verification criteria for producing high quality soldered interconnections. The standard emphasizes process control and sets industry-consensus requirements for a broad range of electronic products. This revision now includes support for lead free manufacturing.

IPC A-620B – Requirements and Acceptance for Cable and Wire Harness Assemblies
Revision B is now available for the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies.

IPC-DRM-PTH-E
Now updated to Revision D of the latest IPC-A-610E and J-STD-001E – our Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections.

IPC-DRM-SMT-E
Useful as a training aid in the classroom or on the shop floor, DRM-SMT-E contains computer generated color illustrations of Chip component, Gull Wing and J-Lead solder joints.

IPC-J-STD-033C
J-STD-033 Provides Surface Mount Device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs.

IPC-J-STD-020D-1
IPC-J-STD-020D-1 standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress.

J-STD-075

J-STD-075 provides test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing.

IPC Collections:

IPC-C-103 – Electronics Assembly Standards Collection

IPC-C-1000 Essential Document Collection for Board Design, Assembly and Manufacture

IPC-C-108 Cleaning Guides and Handbooks Collection

Through Electronics.ca you can order IPC standards for printed circuit board design and manufacturing and electronics assembly, including handbooks, guidelines and IPC training videos.

Download IPC Standards - Everything You Need From Start To Finish

Virtual Reality Hardware to Soar Past the $2 Billion Mark in 2016

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Worldwide Augmented and Virtual Reality Hardware Forecast, 2016–2020“. Worldwide shipments of Virtual Reality (VR) hardware will skyrocket in 2016, with total volumes reaching 9.6 million units. Led by key products from Samsung, Sony, HTC, and Oculus, the category should generate hardware revenues of approximately $2.3 billion in 2016. While VR will drive nearly all of the hardware volume in 2016, Augmented Reality (AR) hardware is forecast to ramp up over the next few years. According to the first worldwide AR/VR forecast, the combined device markets will see hardware shipments surge past 110 million units in 2020.

---

This report identifies three major device categories across the Augmented and Virtual Reality markets. They include: Screenless viewers that use the screen of specific smartphones to drive an AR/VR experience (example: Samsung Gear VR); Tethered Head Mounted Displays (HMDs) that utilize an existing compute device such as a PC, game console, or even a smartphone to drive a head-worn display (example: Oculus Rift); and Standalone HMDs that integrate processing within the head-worn display itself (example: Microsoft HoloLens). IDC is specifically not forecasting Google Cardboard-based products in its totals, nor any other viewer accessory that lacks electronics.

“In 2016, the first major VR Tethered HMDs from Oculus, HTC, and Sony should drive combined shipments of over 2 million units,” said Tom Mainelli, vice president for Devices & Displays at IDC. “When you combine this with robust shipments of screenless viewers from Samsung and other vendors launching later this year, you start to see the beginning of a reasonable installed base for content creators to target.”

“Video games will clearly be the lead rationale for people to pick up an Oculus Rift, HTC Vive, or PlayStation VR this year,” added Lewis Ward, research director of Gaming. “While there have been some launch window hardware shipment hiccups that must be addressed near-term, I’m confident that they will be ironed out before the holiday season. The addition of exciting new titles will lead to a new wave of VR HMD hardware interest among those buying for themselves or family members and friends.”

IDC expects AR hardware to take longer to bring to market. “While development kits from players such as Microsoft, Meta, and others point to a strong future in AR hardware, these devices are dramatically harder to produce than VR products,” said Mainelli. “Doing this right is more important than doing it fast, and we urge the industry to continue its slow and steady approach to hardware development here, as AR is going to have a profound impact on the way we interact with technology and the way we do our jobs for many years to come. In the meantime, we expect companies to begin experimenting with AR software on devices already in use: smartphones and tablets.”

Virtual Reality Hardware to Soar Past the $2 Billion Mark in 2016

Worldwide Augmented and Virtual Reality Hardware Shipments and 5-Year CAGR (shipments in millions)
Product Category	2016 Shipments	2020 Shipments	2016-2020 CAGR
Virtual Reality Hardware	9.6	64.8	183.8%
Augmented Reality Hardware	0.4	45.6	189.8%
Source: IDC, April 2016

Source: IDC, April 2016

The new forecast, Worldwide Augmented and Virtual Reality Hardware Forecast, 2016–2020, provides shipment data for the three major device types, as well as average selling price (ASP) and revenues projections. The report also offers consumer and commercial shipment data.

 

Virtual Reality Hardware to Soar Past the $2 Billion Mark in 2016

International Economic Outlook: Will High Risk Events Trigger a Recession?

Will High Risk Events Trigger a Recession?

In the worldwide business cycle, the group of the English-speaking countries has led historically global economic activity. Monthly predictive analytics signal an underlying weakness for several months in the English-speaking countries, which have posted negative or steadily declining growth rates in their leading indicators.

Globally, trade predictive analytics, which summarize worldwide merchandize exports, clearly point out an undergoing global slowdown contradicting the media created myth of transitory snowstorms in New England as the cause of an economic downswing in the United States in the first quarter of this year. In March of this year, global exports, on a year-to-year basis, declined by 12.4%, the sixth consecutive monthly decline in a row following an expansion since October 2014.  On a quarterly basis, in the first quarter of 2015 global exports dropped 10.2% from a year ago to $3.7 trillion, following a 2.6% decline in the last quarter of 2014. A major trigger for such dramatic changes in each county’s business cycle has been the “burst” of the oil-price bubble coupled with currency realignments from the strengthening of the US dollar as well as a slowdown in the growth in emerging economies.

In addition to geopolitical risks related to Middle East and Eastern Europe, there is high probability of bursting this year one or more  policy-created bubbles.  A hard landing in China from housing prices and/or stock market corrections; disintegration of the Euro Area; high debt to income ratios – both private and public – in several countries; and the timing of an exit from an ill-conceived and permanent-perceived monetary policy of zero interest rates in the United States. Any of these events may trigger a significant correction in stock markets leading to another major recession with no tools left for economic policy. …Assigning a 40% probability that any of these events will come suddenly into play this year .

By Evangelos Otto Simos, Ph.D.

• Related Research: Global Semiconductor Industry Leading Indicator and Forecast Report.

 

International Economic Outlook: Will High Risk Events Trigger a Recession?

IPC-4101D-WAM1 Brings Significant Changes and Clarifications

If you need the most current specifications for PCB materials used in rigid or multilayered printed boards, then it is time to upgrade to IPC-4101D-WAM1. This newly revised standard brings critical updates to the already valuable IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards.

Why wait? Upgrade to the IPC-4101D-WAM1 today!

IPC-4101D-WAM1 delivers key updates for board designers, specifiers of board materials, and OEM’s who use and keep boards current with base materials used in PCBs.

This revision:

• covers requirements for laminate or prepreg base materials used primarily for rigid and multilayer printed boards for electrical and electronic circuits


• contains 64 individual, keyword searchable specification sheets, including a brand new sheet that expands offerings for commercially available laminates and prepregs


• clarifies what is stated in the original release of IPC-4101D for the FR-4.0 materials as “None” for inorganic filler content, now states “<5%” is allowed


• adds table 3-10, Permissible Laminate Substitutions for Specification Sheets /21, /24, /26 and /30

IPC4101D-WAM1

This revision brings significant changes and clarifications. Learn more about how these updates can benefit you. Order IPC4101D-WAM1 today!

 

 

IPC-4101D-WAM1 Brings Significant Changes and Clarifications