Wednesday, February 11, 2015

Worldwide Market for Thermal Management Products to Reach $15.56 Billion by 2018

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Electronic Thermal Management – Technologies, Materials, Devices, New Developments, Industry Structure and Global Markets”. According to this study, the worldwide market for thermal management products is predicted to grow from about $8.8 billion in 2013 to $15.56 billion by 2018, at an average annual growth rate (CAGR) of 12.1%.


“Thermal management” denotes the array of problem-solving design tools and material technologies that systems manufacturers apply to regulate the unwanted heat caused by the normal functioning of an electronic system. Increasing power densities and decreasing transistor dimensions are hallmarks of modern computer chips. Both trends are increasing the thermal management challenge within the chip and surrounding packaging, as well as accelerating research progress on high conductivity materials.


Dramatic changes are underway in the computer, telecommunications and consumer electronics industries. There is a trend toward systems “convergence,” combining computer, telecommunications and consumer system functions all into one system. There is also a trend toward micro-miniaturization and microsystem technologies integrating digital, optical, radio frequency and microelectromechanical systems (MEMS) devices. Microsystem packaging is at the heart of all of these products, since it is this technology that provides the system integration in addition to controlling the size, performance, reliability and cost of the final microsystem.


High-density packaging has been the trend in electronic circuits during the last decade, and that will continue for at least the next five years. In 2013, a typical megaprocessor could pack a staggering 41 million transistors onto a single chip. Running flat out, that chip would dissipate 130 watts of heat – more than a bright household light bulb – from an area the size of a postage stamp.


The trend line of the thermal management industry aligns with the developments of technology in the semiconductor, microprocessor and computer industries. For every advance in performance of these systems, there is a corresponding increase in the operating heat generated by the system. To simply say, however, that demands for thermal management products have increased as the requirements of applications have increased, does not do justice to the unique character of this industry. It is probably more accurate to state that the development of thermal management as an industry is the result of a synergy of solutions constantly engineered to manage excess heat in today’s electronic systems.


electronic thermal management reportDetails of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: Electronic Thermal Management – Technologies, Materials, Devices, New Developments, Industry Structure and Global Markets.



Worldwide Market for Thermal Management Products to Reach $15.56 Billion by 2018

Printed and Flexible Sensors Market Opportunities

Opportunities in established and emerging markets


Printed and flexible sensors market already represented a value of $6.3 billion in 2013. The biggest market is currently biosensors, where disposable glucose test strips are used to improve the lives of diabetics. However, other types of printed sensors are emerging, taking advantage of the latest materials. By 2024, these emerging applications will take a significant share of the total printed sensor market:


Relative market size for printed and flexible sensors in 2024
printed and flexible sensors market

Source: Printed and Flexible Sensors 2014-2024: Technologies, Players, Forecasts


IDTechEx research group expects new hybrid CMOS image sensors to quickly become the second largest market, with organic or quantum dot semiconductors replacing silicon as the photosensitive material in several applications.


Piezoresistive sensing is already an established market. Growth in piezoresistive sensors will however get additional momentum, explained by a combination of favourable trends. While the two biggest market segments are currently in Consumer Electronics and Healthcare, the next five years will see Automotive take a larger share, ultimately outgrowing Healthcare. In this scenario, IDTechEx expects the piezoresistive sensor market to triple by 2018, corresponding to a 23% CAGR.


Other types of printed and flexible sensors such as photodetectors, temperature sensors or gas sensors are only emerging but they promise better performances, new form factors and ease of customisation. Now is the right time to enter the market and some companies are already positioned to reap the benefits.


The complete picture


Save months of research by quickly learning who the key players are in printed and flexible sensors by using the latest information. Get the complete picture on the various technologies, their applications and the market sizes.


The report includes technology reviews and market forecasts until 2024 for the following printed sensors:


• Biosensors

• Capacitive sensors (not including touchscreens)

• Piezoresistive sensors

• Piezoelectric sensors

• Photodetector

• Hybrid CMOS sensors

• Digital X-ray sensors

• Temperature sensors

• Gas sensors


Sensors that are processed at high temperature (ceramic pressure sensors, as well as some types of piezoelectric, temperature and gas sensors) are described in the report but not included in the forecast figures since they cannot be considered part of printed electronics.


Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: Printed and Flexible Sensors 2014-2024: Technologies, Players, Forecasts. Included in the report, a listing of 70 companies sorted by category helps you identify potential partners and suppliers.



Printed and Flexible Sensors Market Opportunities

Wireless Power Charging IC Market Forecast

The wireless power charging IC market is projected to see tremendous growth over the next five years, with a dollar market increasing from $284.3 million in 2015 to over $2.8 billion in 2020, a compounded annual growth rate (CAGR) of 58.7%. The wireless power charging market covered in this report is made up of both wireless charging receiver ICs and transmitter ICs. Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications" web site. View the report: Wireless Power Charging IC Market Forecast.

Monday, February 9, 2015

Big Data Market in ICT and Telecom

Big Data is much more than its technical definition implies: A collection of data sets so large and complex that it becomes difficult to process using on-hand database management tool. From a business perspective, Big Data represents a major inflection point for the ICT and Telecom sectors as it will transform business asset utility and value forever more. Every large corporation collects and maintains a huge amount of data associated with its customers including their preferences, purchases, habits, travels, and other personal information. However, value realization and the implications for using this data is often little understood and under-appreciated.


New market research report, entitled “Big Data in ICT and Telecom: Transforming Industry Verticals 2013 – 2018“, evaluates Big Data market and challenges including management, mining, and analytics as well as the impact on telecom and ICT systems. This research also analyzes Big Data in key industry verticals including retail, financial services, healthcare, government, manufacturing, energy, and transportation. This report also assesses Big Data within government including homeland security, defense, and law enforcement. The report includes a market value assessment and forecasts for 2013 – 2018 for Big Data in telecommunications and industry verticals.


This report includes a comprehensive assessment of select companies in the Big Data ecosystem including: Accenture, CSC, Fujitsu, Hewlett Packard, Informatica, Mu Sigma, Opera Solutions, Oracle, Tata Consultancy Services. The assessment for the above companies includes the following areas


• Company Overview

• Offering Analysis

• Strategies and Plans

• Mergers and Acquisitions

• Partnerships and Alliances

• Financial and Operational Review

• Key Contract Wins Assessment

• Analysis and Conclusions



Target Audience:



  • Any governmental agency

  • Big Data and analytics companies

  • Data as a Service (DaaS) companies

  • Fortune 1000 corporations of all types

  • Cloud-based service providers of all types

  • Data processing and management companies

  • Application Programmer Interface (API) companies

  • Data aggregators, storage and management providers

  • Telecommunications infrastructure and service providers





Report Benefits:



  • Big Data market forecasts 2013 – 2018

  • Big Data market assessment for select industry verticals

  • Assessment of leading companies in Big Data ecosystem

  • Identify drivers for Big Data infrastructure, spending, and services

  • Understand the market dynamics for Big Data in various industries

  • Identify sources of Big (unstructured) Data and associated challenges

  • Identify key emerging trends such as Data as a Service (DaaS) and others

  • Understand Big Data operations including data capture and management

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: “Big Data in ICT and Telecom: Transforming Industry Verticals 2013 – 2018”






Big Data Market in ICT and Telecom

IPC Standards For PCB Design and CAD

IPC-7351B Requirements for Surface Mount Design and Land Pattern Standard


IPC-7351B includes both the standard and an IPC-7351B land pattern calculator on CD-ROM for accessing component and land pattern dimensional data. The calculator includes the document’s mathematical algorithms so users can build a land pattern for a corresponding surface mount part quickly and accurately.The tool also allows for modification of dimensional attributes of IPC approved land patterns.


This popular document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs, TSSOPs, QFPs, BGAs, QFNs and SONs. The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select a land pattern based on desired component density.


Revision B now includes land pattern design guidance and rules for component families such as resistor array packages, aluminum electrolytic capacitors, column and land grid arrays, flat lead devices (SOFL and SOTFL) and dual flat no-lead (DFN) devices. The revision also discusses the usage of thermal tabs and provides a new padstack naming convention that addresses the shape and dimensions of lands on different layers of printed boards.Purchasers also receive a 10-day trial of the IPC-7351 Land Pattern Wizard developed by Mentor Graphics, which is an advanced version of the IPC-7351B Land Pattern Calculator. The IPC-7351B Land Pattern Wizard tool enables users to not only save their land patterns within new land pattern library files, but also to instantly export land patterns to their preferred CAD format, such as Allegro, Board Station, Expedition, PADS, CADSTAR, OrCAD, Pantheon and P-CAD. 102 pages. Order and Download IPC Standard 7351B.

IPC-2221B Generic Standard on Printed Board Design


IPC-2221B is the foundation design standard for all documents in the IPC-2220 series and is included i the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer. Among the many updates to Revision B are new criteria for conductor characteristics, surface finishes, via protection, board electrical test, dielectric properties, board housings, thermal stress, compliant pins, panelization and internal and external foil thicknesses. Appendix A provides new test coupon designs used for lot acceptance and quality conformance testing. Order and Download IPC Standard 2221B.


IPC-2220 Set of IPC Standards for PCB Design and CAD


The series is built around the IPC-2221B, Generic Standard on Printed Board Design, the base document that covers all generic requirements for printed board design, regardless of materials. From there, the designer chooses the appropriate sectional standard for a specific technology. IPC-2221B and all five sectional standards are included with the series: IPC-2222A, Sectional Design Standard for Rigid Organic Printed Boards; IPC-2223C, Sectional Design Standard for Flexible Printed Boards; IPC-2224, Sectional Standard for Design of PWBs for PC Cards; IPC-2225, Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies; and IPC-2226, Sectional Design Standard for High Density Interconnect (HDI) Printed Boards. This series provides coverage on material and final finish selection, current carrying capacity and minimum electrical clearances, test specimen design, guidelines for V-groove scoring, dimensioning requirements and conductor thickness requirements. Order and Download IPC 2220 Family of Design Documents.


 


All IPC Standards are available from Electronics.ca Publications




IPC Standards For PCB Design and CADIPC Member

 




IPC Standards For PCB Design and CAD

Friday, February 6, 2015

Electronics Assembly IPC Standards Collection

It takes a lot to be successful in electronics assembly. Get the reference documents you need on all aspects of the job from solder materials, component characteristics, manufacturing and quality requirements, and acceptability of the final assembly. Includes 41 key documents for SMT and through-hole assembly, including the widely used IPC-A-610, J-STD-001 and IPC-A-620.  Get the complete IPC standards collection and save 55% on individual document prices. Users can also purchase and download IPC standards from Electronics.ca Publications by following IPC specs below.


Electronics Assembly IPC Standards Collection Includes


IPC 2611 Generic Requirements for Electronic Product Documentation
IPC 2612-2 Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descript
IPC 2612-1 Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC 3406 Guidelines for Electrically Conductive Surface Mount Adhesives
IPC 3408 General Requirements for Anisotropically Conductive Adhesives Films
IPC 7095C Design and Assembly Process Implementation for BGAs
IPC 7351B Generic Requirements for Surface Mount Design and Land Pattern Standard
IPC 9202 Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemic
IPC 9203 Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC 9701A Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
IPC 9702 IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects
IPC 9703 IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
IPC 9704A Printed Circuit Assembly Strain Gage Test Guideline
IPC 9706 Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder
IPC 9707 Spherical Bend Test Method for Characterization of Board Level Interconnects
IPC 9708 Test Methods for Characterization of Printed Board Assembly Pad Cratering
IPC 9709 Test Guidelines for Acoustic Emission Measurement during Mechanical Testing
IPC A-610F Acceptability of Electronics Assembly
IPC A-620B IPC/WHMA-A-620B Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC C-406 Design & Application Guidelines for Surface Mount Connectors
IPC CA-821 General Requirements for Thermally Conductive Adhesives
IPC CC-830B Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
IPC CM-770E Component Mounting Guidelines for Printed Boards
IPC D-326A Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies
IPC FC-234A Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards
IPC HDBK-001E Handbook and Guide to Supplement J-STD-001
IPC HDBK-005 Guide to Solder Paste Assessment
IPC JP002 JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies
IPC J-STD-002D EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
IPC J-STD-003C-WAM1 Solderability Tests for Printed Boards
IPC J-STD-004B Requirements for Soldering Fluxes
IPC J-STD-005A Requirements for Soldering Pastes
IPC J-STD-006C Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders
IPC J-STD-020D-1 IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surf
IPC J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size Configurations
IPC J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps
IPC J-STD-030A Selection and Application of Board Level Underfill Materials
IPC J-STD-033C-1 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Device
IPC J-STD-075 Classification of Non-IC Electronic Components for Assembly Processes
IPC MC-790 Guidelines for Multichip Module Technology Utilization
IPC S-816 SMT Process Guideline & Checklist
IPC SM-780 Component Packaging & Interconnecting with Emphasis on Surface Mounting
IPC SM-784 Guidelines for Chip-on-Board Technology Implementation
IPC SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Attachments
IPC SM-817 General Requirements for Dielectric Surface Mounting Adhesives
IPC SM-817A General Requirements for Dielectric Surface Mount Adhesives
IPC T-50K Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC TR-001 An Introduction to Tape Automated Bonding Fine Pitch Technology


Downlaod ipc standards



Electronics Assembly IPC Standards Collection

Speciality Chemicals and Materials Will Reach Over $50 Billion in 2023

Speciality Chemicals needed for future electronics: morphologies, forms, derivatives: opportunities, trends, reasons: de-risk your investment!


According to a new study, speciality chemicals and  and materials will reach over $50 billion in 2023.  The chemistry of the new electronics and electrics is key to its future, whether it is invisible, tightly rollable, biodegradable, edible, employing the memristor logic of the human brain or possessing any other previously- impossible capability in a manufactured device. De-risking that material development is vital yet the information on which to base that has been unavailable. No more.


See how the metals aluminium, copper and silver are widely deployed, sometimes in mildly alloyed, nano, precursor, ink or other form. Understand the 12 basic compounds most widely used in the new electronics and electrics and compare them with compounds exhibiting the broadest range of appropriate electrical and optical functions for the future. Those seeking low volume, premium priced opportunities can learn of other broad opportunities. Indeed, we cover in detail all the key inorganic and organic compounds and carbon isomers. We show how the element silicon has a new and very different place beyond the silicon chip. Learn how the tailoring of a chosen, widely-applicable chemical can permit premium pricing and barriers to entry based on strong new intellectual property. For example, see which of 15 basic formulations are used in the anode or cathode of the re-invented lithium-ion batteries of 131 manufacturers and what comes next.


The chart below shows the breakdown of most popular inorganic compounds in new electronics including:


  • Aluminium compound

  • Boron compound

  • Copper compound

  • Gallium compound

  • Indium compound

  • Lithium compound

  • Manganese compound

  • Silicon compound

  • Titanium compound

  • Zinc compound

Speciality Chemicals and Materials Most popular inorganic compounds in the new electronics by device family


For the full data set please purchase this report. Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: Functional Materials for Future Electronics: Metals, Inorganic & Organic Compounds, Graphene, CNT.


 


 



Speciality Chemicals and Materials Will Reach Over $50 Billion in 2023