If you need the most current specifications for PCB materials used in rigid or multilayered printed boards, then it is time to upgrade to IPC-4101D-WAM1. This newly revised standard brings critical updates to the already valuable IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards.
Why wait? Upgrade to the IPC-4101D-WAM1 today!
IPC-4101D-WAM1 delivers key updates for board designers, specifiers of board materials, and OEM’s who use and keep boards current with base materials used in PCBs.
This revision:
- covers requirements for laminate or prepreg base materials used primarily for rigid and multilayer printed boards for electrical and electronic circuits
- contains 64 individual, keyword searchable specification sheets, including a brand new sheet that expands offerings for commercially available laminates and prepregs
- clarifies what is stated in the original release of IPC-4101D for the FR-4.0 materials as “None” for inorganic filler content, now states “<5%” is allowed
- adds table 3-10, Permissible Laminate Substitutions for Specification Sheets /21, /24, /26 and /30
IPC4101D-WAM1
This revision brings significant changes and clarifications. Learn more about how these updates can benefit you. Order IPC4101D-WAM1 today!
IPC-4101D-WAM1 Brings Significant Changes and Clarifications
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