System-in-Package Technology (SiP) is unique in its ability to combine the principles of electronic circuit design along with that of semiconductor packaging. It is also the only packaging technique that is pitted against SoC, a completely different methodology of integrating multiple functionalities. The simplicity of SiP makes it possible to combine perse functionalities that SoC cannot cater to. SiP thus caters to a wide array of uses across application areas. This new report is an effort to quantify the market in terms of dollar sales and shipment volumes—a departure from the predominantly service-focused coverage of the semiconductor-packaging market.
SiP-based chipsets are essentially systems or subsystems that combine multiple passive components and active dies. The quantification of such subsystems is not the mainstream tracking mode. Most market studies track the market at inpidual component level—active or passive. This report quantifies the entire package, which provides new insight into the market dynamics.
This report also sheds light on the challenges and limitations faced by SiP. It also gives due coverage to alternative integration methodologies, such as SoC. This look at the alternatives provides a balance to the report coverage.
Essentially, the report focuses on end-use applications, which can be easily quantified and whose physical attributes can be compared, contrasted, tracked and analyzed.
Each end-use application has its own dynamics, benefits and challenges with respect to levels of adoption of SiP-enabled chipsets. On a larger note, each end-use application has its own market momentum dictated by the health of the regional and country markets. When these aspects are mapped for inpidual countries, they produce a fascinating collage of local market conditions that add to the larger picture. This report provides a refined view of inpidual country markets in volume and value terms for 17 key nations spanning all global regions.
Partial list of tables:
Summary Table : DOLLAR SALES FOR SIP-BASED CHIPSETS, BY REGION, THROUGH 2018
Table 1 : SHIPMENT SALES FOR SIP-BASED CHIPSETS, BY REGION, THROUGH 2018
Table 2 : DOLLAR SALES FOR SIP-BASED CHIPSETS, BY DIE COMPOSITION, THROUGH 2018
Table 3 : SHIPMENT SALES FOR SIP-BASED CHIPSETS, BY DIE COMPOSITION, THROUGH 2018
Table 4 : GROUP III-V COMPOUND SEMICONDUCTORS BY CHEMICAL COMPOSITION
Table 5 : GROUP II-VI COMPOUND SEMICONDUCTORS BY CHEMICAL COMPOSITION
Table 6 : GROUP IV COMPOUND SEMICONDUCTORS
Table 7 : OTHER COMPOUND SEMICONDUCTORS BY CHEMICAL COMPOSITION
Table 8 : DOLLAR SALES FOR SIP-BASED CHIPSETS, BY END APPLICATION, THROUGH 2018
Table 9 : SHIPMENT SALES FOR SIP-BASED CHIPSETS, BY END APPLICATION, THROUGH 2018
Table 10 : DOLLAR SALES OF SIP-BASED CHIPSETS TO TELECOMMUNICATIONS END APPLICATION, BY REGION, THROUGH 2018
Table 11 : SHIPMENT SALES OF SIP-BASED CHIPSETS TO TELECOMMUNICATIONS END APPLICATION, BY REGION, THROUGH 2018
Table 12 : DOLLAR SALES OF SIP-BASED CHIPSETS TO TELECOMMUNICATIONS END APPLICATION, BY DIE COMPOSITION, THROUGH 2018
Table 13 : SHIPMENT SALES OF SIP-BASED CHIPSETS TO TELECOMMUNICATIONS END APPLICATION, BY DIE COMPOSITION, THROUGH 2018
Table 14 : DOLLAR SALES OF SIP-BASED CHIPSETS TO INSTRUMENTATION AND SCIENTIFIC-RESEARCH END APPLICATION, BY REGION, THROUGH 2018
Table 15 : SHIPMENT SALES OF SIP-BASED CHIPSETS TO INSTRUMENTATION AND SCIENTIFIC-RESEARCH END APPLICATION, BY REGION, THROUGH 2018
Table 16 : DOLLAR SALES OF SIP-BASED CHIPSETS TO INSTRUMENTATION AND SCIENTIFIC-RESEARCH END APPLICATION, BY DIE COMPOSITION, THROUGH 2018
Table 17 : SHIPMENT SALES OF SIP-BASED CHIPSETS TO INSTRUMENTATION AND SCIENTIFIC-RESEARCH END APPLICATION, BY DIE COMPOSITION, THROUGH 2018
Table 18 : DOLLAR SALES OF SIP-BASED CHIPSETS TO MEDICINE END APPLICATION, BY REGION, THROUGH 2018
Table 19 : SHIPMENT SALES OF SIP-BASED CHIPSETS TO MEDICINE END APPLICATION, BY REGION, THROUGH 2018
Table 20 : DOLLAR SALES OF SIP-BASED CHIPSETS TO MEDICINE END APPLICATION, BY DIE COMPOSITION, THROUGH 2018
Table 21 : SHIPMENT SALES OF SIP-BASED CHIPSETS TO MEDICINE END APPLICATION, BY DIE COMPOSITION, THROUGH 2018
Table 22 : DOLLAR SALES OF SIP-BASED CHIPSETS TO ENERGY, DEFENSE AND SURVEILLANCE END APPLICATION, BY REGION, THROUGH 2018
System-in-Package Technology and Global SiP Markets
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