MEMS Cost Model and MEMS Price Model

ELECTRONICS.CA PUBLICATIONS, the electronics industry market research and knowledge network, announces the availability of updated Cost Model for Micro-Electro-Mechanical Systems (MEMS).  The IC Knowledge – MEMS Cost Model is now the MEMS Cost and MEMS Price Model.  The MEMS Cost and Price Model allows the user to easily estimate the manufacturing cost and selling price for most MEMS products. The new 1400 release features a completely redesigned and easier to use interface, new data, process, products, fabs and features. The model support pre-defined processes and products or the user can define their own.

The IC Knowledge – MEMS Cost Model is  the industry standard for cost modeling of MEMS products. Very easy to use tech model allows for up to two MEMS and up to two integrated circuit die in the same package providing a full MEMS product solution. The model then presents a detailed analysis of cost. The model supports both pre-defined and user defined products, processes and process steps. Cost includes wafer fabrication, wafer test, packaging and final test.

The following MEMS Fabs are included in the MEMS Cost Model

1. ADI (Analog Devices)  Cambridge

2. AKM (Asahi Kasei Microdevices)  Noboka

3. APM (Asia Pacific Microsystems Inc.)  Fab 1

4. APM (Asia Pacific Microsystems Inc.)  Fab 2

5. Colibrys Ltd.  None

6. Dalsa  100mm Line

7. Dalsa  150mm Line

8. Freescale  Sendai Fab

9. Freescale  Oak Hill

10. Global Foundries  Fab 3E

11. Hewlett Packard  HP Inkjet Wafer Fab II

12. IMT (Innovative Micro Technology)  Fab 1

13. Infineon  Fab 1

14. Infineon  Megafab

15. Infineon  Horton

16. Infotonics  ITC

17. Jazz  Newport Beach

18. Kionix  Ithaca Fab

19. MEMSCap S.A.  North Carolina

20. MEMSTech  SensFab

21. Micralyne  None

22. None

23. Robert Bosch  150mm Fab

24. Robert Bosch  200mm Fab

25. Semefab  Fab 2

26. Silex Microsystems  150mm Fab

27. Silex Microsystems  200mm Fab

28. SMI (Silicon Microstructures Inc.)  None

29. Sony  Kyushu Corp

30. ST Micro  Fab 1 (AG 8)

31. ST Micro  Fab 6

32. Tronics Microsystems S.A.  Fab 1

33. TSMC  Fab 2

34. TSMC  Fab 3

The following MEMS processes are included in the MEMS Cost Model
he model now supports multiple IC as well as MEMS die per product and “none” is used to turn off individual die and enter steps is used when the user is defining their own process.

1. None

2. Enter steps

3. 2 Layer Poly

4. Bulk Pressure Sensor

5. Cap wafer

6. Coventor  RF Relay

7. Discera  MEMS Oscillator with cap

8. Electrosatic Motor

9. Floating Element Flow Sensor

10. HP  Print Head

11. IMEPKU  2 layer poly

12. Infineon  Bulk Accoustic Wave

13. Infineon  Tire Pressure Measurement

14. Infotonics  Hybrid SOI

15. Invensense  Accelerometer (includes ASIC cavity formation)

16. Kionix  accelerometer

17. Knowles  Microphone

18. Lear  Tire Pressure Sensor

19. MEMSCap  Metal MUMPS

20. MEMSCap  Poly MUMPS

21. MEMSCap  SOI MUMPS

22. Protein Sensor

23. RF Relay

24. Robert Bosch  Accelerometer

25. SiTime  Oscillator

26. STMicro  Thelma

27. SUMMiT  3 poly layers

28. User Defined

Product details and ordering information can be found on Electronics.ca Publications’ web site. View:  The IC Knowledge - MEMS Cost and Price Model.

 

MEMS Cost Model and MEMS Price Model