The recently released 2013 Roadmap from
the International Electronics Manufacturing Initiative (iNEMI)
identifies numerous key trends that will shape the landscape of the
electronics manufacturing industry over the next decade. Cloud
computing, the explosive growth of MEMS and sensors, and sustainability
issues, including recycling, are common themes throughout the document.
The roadmap also pinpoints critical technology gaps and areas where
R&D efforts should be focused.
This tenth edition of iNEMI’s roadmap is now available to industry
through the iNEMI website. It represents an estimated eight man-years of
work by more than 650 individuals from over 350 corporations,
consortia, government agencies and universities in 18 countries.
“In the 20 years that we’ve been creating these roadmaps for the
electronics manufacturing industry, each successive edition has built
on, and improved upon, the previous roadmap,” said Bill Bader, CEO of
iNEMI. “The first roadmap, published in 1994, was created by the U.S.
electronics industry and covered only nine technology areas, focusing
primarily on assembly and packaging, and electronic components. Since
then, we have broadened our focus, both in terms of geography and
technology, and increased the depth of discussion. We now have a truly
global perspective, thanks to contributors located around the world, and
this latest roadmap covers 20 technology areas and six product sectors,
encompassing the entire electronics manufacturing supply chain.”
“The 2013 Roadmap is an invaluable tool that can help companies
prioritize investments in R&D and technology deployment,” said
Bader. “It can also help university-based research programs focus their
efforts on topics relevant to industry and provide guidance for
government agencies investing in emerging technologies.”
Key Trends
- Cloud computing figures prominently in this latest edition of the
roadmap, and has the potential to create the most significant paradigm
shifts, bringing about major changes to business models in the next four
to five years. Similarly, the increased use of MEMS and sensors in a
growing number of applications (cell phones, medical electronics,
automotive) has repercussions across multiple product sectors.
- Concerns about sustainability are still at the forefront while
companies continue to grapple with the lack of industry-wide assessment
methodologies to evaluate alternative materials and the need for data to
assess and quantify environmental impact of products in a consistent
way.
- Faster rates of change in miniaturization, driven by the explosion of
smart phones, tablets and other mobile devices, are resulting in
increased use of complex, 3D assemblies and solutions, such as
system-in-package (SiP). These solutions, however, come with their own
sets of challenges. Lack of test access, pick and place of 3D thin chips
or bare 3D stacked chips with irregular shapes, rework processes and
heat sink attachment all become more difficult.
Ordering Information
The full roadmap, as well as individual chapters, is now available for
purchase. This latest edition of the iNEMI roadmap is provided on a USB
drive, which replaces the CD format used for the previous nine
roadmaps. Individual chapters are provided electronically. For more details about purchasing options, go to 2013 iNEMI Roadmap.
Electronics.ca Publications is a world-class research network and publishing company whose focus is technology and market research for the electronics industry.
Sunday, May 26, 2013
Tuesday, February 12, 2013
Global Market For Thermal Management To Reach $10.1 Billion In 2017
ATR-Newswire (Press Release) - Feb 12, 2013 - ELECTRONICS.CA
PUBLICATIONS, the electronics industry market research and knowledge
network, announces the availability of a new report entitled "The Market for Thermal Management Technologies ". According to this report, the market for thermal management
technologies was valued at $6.7 billion in 2011 and reached $7 billion
in 2012. Total market value is expected to reach $10.1 billion in 2017
after increasing at a five-year compound annual growth rate (CAGR) of
7.6%.
Thermal management hardware (e.g., fans and blowers, heat sinks, etc.) account for about 80% of the total thermal management market. The other main thermal management product segments –software, interface materials, and substrates – each account for between 5% and 7% of the market.
The largest end markets for thermal management products in 2011 were the computer industry (50.8% of total revenues), telecommunications (16.8%), and medical/office equipment (11.5%). Computers are projected to increase their market share to 57.1% by 2017, while telecommunications applications’ share drops to 13.6%. Medical/office equipment’s share should remain steady at around 11.5%.
The North American market should maintain its number one position throughout the period under review, with a market share of about 37%, followed by Asia-Pacific with around 25%. The Asia-Pacific countries (except Japan) are not only the second-largest market in absolute terms, but they also have the highest projected growth rate (i.e., a CAGR of 9% between 2012 and 2017).
The overall goal of this report is to provide an analysis of the most recent developments and current trends in the global thermal management marketplace.
Specific objectives include:
- Identifying thermal management technologies and products with the greatest commercial potential in the near to mid-term (2012–2017)
- Analyzing the key drivers and constraints that will shape the market for thermal management technologies and products over the next five years
- Estimating the current and future demand for thermal management technologies and products
- Ascertaining the companies that are best positioned to meet this demand because of proprietary technologies, strategic alliances, or other advantages.
This report will be valuable to many industry participants, including the following:
- Thermal management product manufacturers
- Thermal management specialists
- End users and distributors
- Financial institutions
- Academic and research institutions.
Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications' web site. View the report: The Market for Thermal Management Technologies .
Thermal management hardware (e.g., fans and blowers, heat sinks, etc.) account for about 80% of the total thermal management market. The other main thermal management product segments –software, interface materials, and substrates – each account for between 5% and 7% of the market.
The largest end markets for thermal management products in 2011 were the computer industry (50.8% of total revenues), telecommunications (16.8%), and medical/office equipment (11.5%). Computers are projected to increase their market share to 57.1% by 2017, while telecommunications applications’ share drops to 13.6%. Medical/office equipment’s share should remain steady at around 11.5%.
The North American market should maintain its number one position throughout the period under review, with a market share of about 37%, followed by Asia-Pacific with around 25%. The Asia-Pacific countries (except Japan) are not only the second-largest market in absolute terms, but they also have the highest projected growth rate (i.e., a CAGR of 9% between 2012 and 2017).
The overall goal of this report is to provide an analysis of the most recent developments and current trends in the global thermal management marketplace.
Specific objectives include:
- Identifying thermal management technologies and products with the greatest commercial potential in the near to mid-term (2012–2017)
- Analyzing the key drivers and constraints that will shape the market for thermal management technologies and products over the next five years
- Estimating the current and future demand for thermal management technologies and products
- Ascertaining the companies that are best positioned to meet this demand because of proprietary technologies, strategic alliances, or other advantages.
This report will be valuable to many industry participants, including the following:
- Thermal management product manufacturers
- Thermal management specialists
- End users and distributors
- Financial institutions
- Academic and research institutions.
Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications' web site. View the report: The Market for Thermal Management Technologies .
Friday, July 27, 2012
Semiconductor Devices Dedicated to Power Electronics Industry to Reach $20 Billion in Market Size
MONTREAL, July 25, 2012 /ATR-Newswire/ ELECTRONICS.CA PUBLICATIONS, the
electronics industry market research and knowledge network, announces
the availability of a new report entitled "Status of the Power
Electronics Industry".
In 2012, all semiconductor devices (discrete, modules and ICs) dedicated to the power electronics industry will reach $20 billion in market size. With applications as diversified as hybrid cars, PV inverters, lighting, energy, and voltage range as wide as a few volts to a few thousands volts, power electronics is and will remain one of the most attractive branches of the semiconductor industry for the next decade.
This report provides a complete breakdown of market forecasts and player shares depending on the application, the voltage range and the geography for power discrete and modules, as well as wafers used for power semiconductor device manufacturing.
The power electronics industry now deals with conversion and motion and needs lighter/smaller, cheaper and more efficient systems. This evolution starts with improvements at the semiconductor level and there are four technologies which are the best candidates to handle new system requirements: silicon IGBT, Super Junction (SJ) MOSFETs, Gallium Nitride (GaN) and Silicon Carbide (SiC) based devices.
Already well established onto the market, IGBTs account for $1.6 billion in the medium to high voltage market. In this report, analysts describe a trend to decrease voltage range in order to target consumer applications such as TVs, computer adapters and cameras in order to access more segments. At the same time, SJ MOSFETs present on those applications present faster switching frequencies and competitive cost. We estimate the SJ MOSFET market to reach $567 million by the end of the year.
GaN and SiC also look promising to overpass silicon performance and enhance inverter capabilities. However, materials are still expensive and the technology is not ready yet. On the other hand, both of these materials can benefit from their developed status in the LED industry and we have seen plenty of LED players paying attention to the opportunity that power electronics represent.
Each technology faces strong developments
In this report, the needs to use those four main technologies are clearly identified. Nevertheless, all of them still have issues in bringing ideal solutions for every application at every power/voltage range. There are two consequences:
While SJ MOSFETs see new players and Foundry service suppliers, the IGBT dies’ industry is getting consolidated by the presence of large players involved in many applications, such as Infineon, Mitsubishi Electric and Fuji. However, IGBT (and SJ MOSFET) modules business is increasing and we see new players entering to provide solutions for cooling, interconnections, substrates, packaging, and gel.
On the other hand, the SiC industry, which has been led by CREE, is now an interesting playground for newplayers. With access to lower cost material, the SiC industry now has the possibility to ramp up and get organized. However, apart from the PFC business, technological capabilities of SiC show that it will surely be dedicated to high power/voltage applications. Last but not least, SiC companies have appeared in China, which will definitely provide competition and tougher access to local markets.
At this point in time, the GaN industry is mostly a US business. International Rectifier, EPC, Transphorm, Microsemi or GaN Systems now propose fully off-the-shelf or customized products. However, some pioneers like MicroGaN, NEC or Powdec, are showing there is a trend to globalize the GaN manufacturing industry. At the same time, the market is still soft and LED players are considering using their technological platform to enter this power electronics market, which will be very much low power/voltage oriented.
In this report, analysts describe how each industry is doing, how they interact between each other and how they will evolve in the future, and what type of market we will see. In addition, supply chain questions and how business will be segmented are answered. The power electronics industry has great growth potential, mostly driven by energy (production, distribution, consumption) which is open and accessible, even for small players.
Technological & cost requirements imposed to power semiconductors are driven by the inverter industry
Because power semiconductors are “just a piece” of the power electronics industry, the power semiconductor industry has to answer requirements from a bigger system: the inverter. For example, some expensive solutions are still not implemented even if device and module performance are much higher than current output.
Researchers provide their analysis of the inverter market and players, as well as the industry evolution in order to illustrate the role of power semiconductors and analyze which drivers will be key for which applications. In addition, this report underlines the expected technical developments of an inverter – depending on the applications – and how power semiconductors will among contribute to these improvements. Indeed, power devices ameliorations will be useful only if they fit with passive and connective devices, defined by inverter needs.
Geographical positioning is also critical in the power electronics area, especially with the boom in China and other emerging countries, but also because several applications (PV, wind, electric vehicles) are supported by local governments.
Yole provides a geographical and supply chain analysis for the power electronics industry, from semiconductors and passive devices to inverter levels.
Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications' website. View the report: Status of the Power Electronics Industry
In 2012, all semiconductor devices (discrete, modules and ICs) dedicated to the power electronics industry will reach $20 billion in market size. With applications as diversified as hybrid cars, PV inverters, lighting, energy, and voltage range as wide as a few volts to a few thousands volts, power electronics is and will remain one of the most attractive branches of the semiconductor industry for the next decade.
This report provides a complete breakdown of market forecasts and player shares depending on the application, the voltage range and the geography for power discrete and modules, as well as wafers used for power semiconductor device manufacturing.
The power electronics industry now deals with conversion and motion and needs lighter/smaller, cheaper and more efficient systems. This evolution starts with improvements at the semiconductor level and there are four technologies which are the best candidates to handle new system requirements: silicon IGBT, Super Junction (SJ) MOSFETs, Gallium Nitride (GaN) and Silicon Carbide (SiC) based devices.
Already well established onto the market, IGBTs account for $1.6 billion in the medium to high voltage market. In this report, analysts describe a trend to decrease voltage range in order to target consumer applications such as TVs, computer adapters and cameras in order to access more segments. At the same time, SJ MOSFETs present on those applications present faster switching frequencies and competitive cost. We estimate the SJ MOSFET market to reach $567 million by the end of the year.
GaN and SiC also look promising to overpass silicon performance and enhance inverter capabilities. However, materials are still expensive and the technology is not ready yet. On the other hand, both of these materials can benefit from their developed status in the LED industry and we have seen plenty of LED players paying attention to the opportunity that power electronics represent.
Each technology faces strong developments
In this report, the needs to use those four main technologies are clearly identified. Nevertheless, all of them still have issues in bringing ideal solutions for every application at every power/voltage range. There are two consequences:
- GaN and SiC are not mature yet for the power electronics market: the first one requiring technological enhancement of the manufacturing process, especially for the Epitaxy thickness and the second one being an expensive material that does not allow implementation within consumer-like businesses.
- A segmentation between technology and the power/voltage range will take place, therefore some segments will only accept one "best" technology.
While SJ MOSFETs see new players and Foundry service suppliers, the IGBT dies’ industry is getting consolidated by the presence of large players involved in many applications, such as Infineon, Mitsubishi Electric and Fuji. However, IGBT (and SJ MOSFET) modules business is increasing and we see new players entering to provide solutions for cooling, interconnections, substrates, packaging, and gel.
On the other hand, the SiC industry, which has been led by CREE, is now an interesting playground for newplayers. With access to lower cost material, the SiC industry now has the possibility to ramp up and get organized. However, apart from the PFC business, technological capabilities of SiC show that it will surely be dedicated to high power/voltage applications. Last but not least, SiC companies have appeared in China, which will definitely provide competition and tougher access to local markets.
At this point in time, the GaN industry is mostly a US business. International Rectifier, EPC, Transphorm, Microsemi or GaN Systems now propose fully off-the-shelf or customized products. However, some pioneers like MicroGaN, NEC or Powdec, are showing there is a trend to globalize the GaN manufacturing industry. At the same time, the market is still soft and LED players are considering using their technological platform to enter this power electronics market, which will be very much low power/voltage oriented.
In this report, analysts describe how each industry is doing, how they interact between each other and how they will evolve in the future, and what type of market we will see. In addition, supply chain questions and how business will be segmented are answered. The power electronics industry has great growth potential, mostly driven by energy (production, distribution, consumption) which is open and accessible, even for small players.
Technological & cost requirements imposed to power semiconductors are driven by the inverter industry
Because power semiconductors are “just a piece” of the power electronics industry, the power semiconductor industry has to answer requirements from a bigger system: the inverter. For example, some expensive solutions are still not implemented even if device and module performance are much higher than current output.
Researchers provide their analysis of the inverter market and players, as well as the industry evolution in order to illustrate the role of power semiconductors and analyze which drivers will be key for which applications. In addition, this report underlines the expected technical developments of an inverter – depending on the applications – and how power semiconductors will among contribute to these improvements. Indeed, power devices ameliorations will be useful only if they fit with passive and connective devices, defined by inverter needs.
Geographical positioning is also critical in the power electronics area, especially with the boom in China and other emerging countries, but also because several applications (PV, wind, electric vehicles) are supported by local governments.
Yole provides a geographical and supply chain analysis for the power electronics industry, from semiconductors and passive devices to inverter levels.
Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications' website. View the report: Status of the Power Electronics Industry
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