Electronics.ca Publications is a world-class research network and publishing company whose focus is technology and market research for the electronics industry.
IoT Solutions, Business Opportunities and New Markets
The Internet of Things (IoT) is poised to fundamentally transform M2M communications, global IT support systems, and business processes in virtually every industry vertical. IoT will significantly impact wireless (short range and macro networks), network signaling, authentication, and data management systems. Embedded systems will also be at the cornerstone for IoT deployment, especially within Industrial Internet of Things (IIoT) applications. Data generated through sensors embedded in various things/objects will generate massive amounts of unstructured (big) data on real-time basis that holds the promise for intelligence and insights
for dramatically improved decision processes.
Accordingly, there is an emerging significant business opportunity for Cloud Service Providers and Big Data Analytics within IoT. There is an increasingly urgent need for end-to-end security for IoT systems and services as we anticipate that their intrusions will become increasingly impactful leading to the potential for operational disruption, industrial espionage, damage to enterprise assets, and even potential physical harm to human beings.
This research offering is the most comprehensive available covering business drivers, technologies, leading companies and solutions, applications, services, market segments, and future outlook for IoT.
Forecasts are provided for 2015 to 2020 for major IoT focus areas including:
* Big Data in IoT
* Security in IoT
* Smart Cities and IoT
* IoT and Data as a Service
* IoT and Embedded Systems
* IoT and the Industrial Internet
This research bundle is value-priced as the sum total of each report purchased individually would be significantly more expensive. This report bundle purchase includes time with an expert analyst who will help you link key findings in the report to the business issues you’re addressing. This needs to be used within three months of purchasing the report.
Target Audience:
* Security companies
* Internet of Things companies
* Wireless device manufacturers
* Wearable technology suppliers
* Digital signal processor providers
* Telephony infrastructure providers
* Computer and semiconductor companies
* Embedded hardware, software and OS providers
* Mobile/wireless network operators and service providers
* Next generation application developers and content providers
* Consumer electronics merchandisers and application providers
Table of Contents:
This research package includes the following reports:
Data as a Service (DaaS) Market and Forecasts 2015 – 2020
Wireless IoT Wide Area Network (WAN) Technologies and Solutions
M2M, IoT, Sensors, and Connected World: Market and Forecast 2015 – 2020
Connected Home and IoT: Market Opportunities and Forecasts 2015 – 2020
M2M/IoT, Cloud, Big Data and Analytics: Market Dynamics and Opportunities
Connected Vehicles: Market and Forecast for LTE and Telematics Applications 2015 – 2020
Industrial Internet of Things (IIoT): Key Trends, Opportunities and Market Forecasts 2015 – 2020
Big Data in Internet of Things (IoT): Key Trends, Opportunities and Market Forecasts 2015 – 2020
The IoT Software Market and OEM Ecosystem: Opportunities, Challenges, and Forecast 2015 – 2020
The IoT Hardware Market and OEM Ecosystem: Opportunities, Challenges, and Forecast 2015 – 2020
Internet of Things (IoT) and Wireless Networks: Technologies, Business Drivers, and Market Outlook
Security and Privacy in the Internet of Things (IoT): Challenges, Market Opportunities and Forecast 2015 – 2020
Smart City Business Drivers, Technologies, Companies, and Solutions: Global Outlook and Forecasts 2015 – 2020
Internet of Things (IoT) Leaders: ARM, Broadcom, Cisco, Freescale, Google, Intel, McAfee, Oracle, PTC, Qualcomm, Samsung
Embedded Infrastructure and Devices in the Internet of Things (IoT) Ecosystem: Next Generation Embedded System Hardware, Software, Tools, and OSs 2015 – 2020
Internet of Things Solutions, Business Opportunities, and IoT Forecasts 2015 – 2020
In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.
In order for a standard to be successful, it needs to grow and evolve with industry demand. To achieve this, IPC has released two new amendments that address evolving manufacturing requirements. The first amendment is for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies. This standard is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes, including support for both traditional solder alloys and for lead-free manufacturing.
The second amendment is for IPC-A-610F, Acceptability of Electronic Assemblies. This widely used standard is a must for all quality assurance and assembly departments. This standard illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions.
For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 embodies a critical shift to deliver necessary updates to these already robust standards. Both amendments tackle a variety of issues manufactures are currently facing in the electronics industry.
Included with this is the reintroduction of the Space Shuttle symbol to show where there are different criteria in the J-STD-001FS, Space Applications Electronic Hardware Addendum to IPC J-STD-001F. Other topics range from vertical hole fill to BGA voiding, as well as the revision of Class 2 requirements for vertical solder fill on plated through holes with less than 14 leads to include requirements when there is a connected internal thermal plane. The amendments also work toeliminate requirements for BGA voiding for BGA components with noncollapsing balls.
IPC-A-610 Revision F with Amendment 1 and J-STD -001 Revision F with Amendment 1, where the Amendment 1 is incorporated into the document, are being released in this new format for customers who want the criteria presented in one document. To make it clear, the documents in this format are not redline documents and do not show where the changes were made from Revision F to the Amendment.
In both instances, the emphasis is on quality. These IPC documents can be purchased from Electronics.ca Publications as a Printed Copy, or PDF download with single user, site user, or global user license:
To achieve a high quality end product and maintain a competitive position in the marketplace, you need to infuse quality throughout the manufacturing process.
Did you know there is an IPC standard associated with nearly every step of printed circuit board production and assembly? From design and purchasing to assembly and acceptance, Electronics.ca Publications offers IPC Standards to help you assure superior quality, reliability and consistency in the electronic assemblies that go into your product. Download IPC Standards Spec Tree – PDF file.
As with the manufacturing process — which uses a step-by-step approach – IPC standards also build upon one another. To achieve your desired results, it’s important to implement the appropriate IPC standards associated with each step of production.
Why Use IPC Standards in Your Manufacturing Process?
Gain Control Over End Product Quality and Reliability — Quality and reliability are the cornerstones of competing in the marketplace and critical to your company’s reputation and profitability. By implementing IPC standards throughout the manufacturing process, you help ensure better performance, longer life and compliance with lead-free regulations.
Improve Communication with Suppliers and Employees — IPC standards are the standards that your competitors, suppliers and EMS providers use. Working from an established IPC standard helps all of you to “speak the same language” — the language of the global electronic industry. In addition, using IPC standards eliminates confusion for employees, because they know they need to perform to an established industry standard.
Help Contain Costs — Ensuring that your design and the bare boards you purchase comply with IPC standards allows you to produce electronic assemblies that meet stringent quality tests down the line, minimizing costly delays, rework and scrap.
The Most Popular IPC Documents are available from Electronics.ca Publications in PDF Format
IPC J-STD-001F – Requirements for Soldered Electrical and Electronic Assemblies J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies has emerged as the preeminent authority for electronics assembly manufacturing. The standard describes materials, methods and verification criteria for producing high quality soldered interconnections. The standard emphasizes process control and sets industry-consensus requirements for a broad range of electronic products. This revision now includes support for lead free manufacturing.
IPC-DRM-PTH-E Now updated to Revision D of the latest IPC-A-610E and J-STD-001E – our Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections.
IPC-DRM-SMT-E Useful as a training aid in the classroom or on the shop floor, DRM-SMT-E contains computer generated color illustrations of Chip component, Gull Wing and J-Lead solder joints.
IPC-J-STD-033C J-STD-033 Provides Surface Mount Device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs.
IPC-J-STD-020D-1 IPC-J-STD-020D-1 standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress.
J-STD-075 provides test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing.
IPC-C-1000 Essential Document Collection for Board Design, Assembly and Manufacture
IPC-C-108 Cleaning Guides and Handbooks Collection
Through Electronics.ca you can order IPC standards for printed circuit board design and manufacturing and electronics assembly, including handbooks, guidelines and IPC training videos.
To achieve a high quality end product and maintain a competitive position in the marketplace, you need to infuse quality throughout the manufacturing process.
Did you know there is an IPC standard associated with nearly every step of printed circuit board production and assembly? From design and purchasing to assembly and acceptance, Electronics.ca Publications offers IPC Standards to help you assure superior quality, reliability and consistency in the electronic assemblies that go into your product. Download IPC Standards Spec Tree – PDF file.
As with the manufacturing process — which uses a step-by-step approach – IPC standards also build upon one another. To achieve your desired results, it’s important to implement the appropriate IPC standards associated with each step of production.
Why Use IPC Standards in Your Manufacturing Process?
Gain Control Over End Product Quality and Reliability — Quality and reliability are the cornerstones of competing in the marketplace and critical to your company’s reputation and profitability. By implementing IPC standards throughout the manufacturing process, you help ensure better performance, longer life and compliance with lead-free regulations.
Improve Communication with Suppliers and Employees — IPC standards are the standards that your competitors, suppliers and EMS providers use. Working from an established IPC standard helps all of you to “speak the same language” — the language of the global electronic industry. In addition, using IPC standards eliminates confusion for employees, because they know they need to perform to an established industry standard.
Help Contain Costs — Ensuring that your design and the bare boards you purchase comply with IPC standards allows you to produce electronic assemblies that meet stringent quality tests down the line, minimizing costly delays, rework and scrap.
The Most Popular IPC Documents are available from Electronics.ca Publications in PDF Format
IPC J-STD-001F – Requirements for Soldered Electrical and Electronic Assemblies J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies has emerged as the preeminent authority for electronics assembly manufacturing. The standard describes materials, methods and verification criteria for producing high quality soldered interconnections. The standard emphasizes process control and sets industry-consensus requirements for a broad range of electronic products. This revision now includes support for lead free manufacturing.
IPC-DRM-PTH-E Now updated to Revision D of the latest IPC-A-610E and J-STD-001E – our Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections.
IPC-DRM-SMT-E Useful as a training aid in the classroom or on the shop floor, DRM-SMT-E contains computer generated color illustrations of Chip component, Gull Wing and J-Lead solder joints.
IPC-J-STD-033C J-STD-033 Provides Surface Mount Device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs.
IPC-J-STD-020D-1 IPC-J-STD-020D-1 standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress.
J-STD-075 provides test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing.
IPC-C-1000 Essential Document Collection for Board Design, Assembly and Manufacture
IPC-C-108 Cleaning Guides and Handbooks Collection
Through Electronics.ca you can order IPC standards for printed circuit board design and manufacturing and electronics assembly, including handbooks, guidelines and IPC training videos.
ELECTRONICS.CA PUBLICATIONS, the electronics industry market research and knowledge network, announces the availability of a new report entitled “Graphene: Technologies, Applications and Markets“. Although the nascent commercial market for graphene-based products currently is very small, between 2015 and 2025 the market should achieve unprecedented growth rates through technological advancements. New report reveals that increasing patent activity suggests technology trends are under way, ripening the market for explosive future growth.
Graphene is a sheet of carbon atoms bound together with double electron bonds in a thin film only one atom thick. The atoms in graphene are arranged in a honeycomb-style lattice pattern, an arrangement that provides strength, flexibility and electrical conductivity. The basic structural element of several forms of carbon, including graphite, carbon nanotubes and fullerenes, graphene has opened up new horizons for high-energy particle physics research and electronic, optical and energy applications.
Potential electronics applications of graphene include ultra-small transistors, super-dense data storage, touchscreens and wearable electronics. In the energy field, potential applications include ultracapacitors to store and transmit electrical power as well as highly efficient solar cells.
Global Market for Graphene
BCC research group expects a commercially significant market for graphene products to develop between 2015 and 2020, when the market is projected to be worth more than $310.4 million. The graphene market should continue to grow rapidly after 2020, approaching $2 billion by 2025.
Graphene printed electronics currently account for virtually all of the (very small) commercial market for graphene technologies. By 2020, structural materials should lead the market (23.2% market share) followed by displays (16.9% market share), graphene capacitors (16.9% market share) and high-performance computing applications (10.5% market share). Capacitors are projected to account for the largest share (31.6%) of the market for graphene technologies by 2025.
One challenge of chemical vapor deposition (CVD) for the production of graphene is removing the graphene film from the metal substrate without contaminating it or ruining it. Several groups of researchers are working on solutions to this challenge. One of the most promising potential applications foreseen for this technology is the production of transparent electrodes for electronics screens.
In a field where many products and applications are still under development, an analysis of recent patents granted is a useful indicator of technology trends that will affect the graphene market in the mid-to-long term.
The number of U.S.patents granted for graphene-related inventions has been growing over the last 10 years, from four patents in 2005 to 309 in 2014 and 386 in just the first 10 months of 2015. Among the 355 patents issued for graphene applications, structural materials account for the largest number of patents identified. This trend is a clear indication of the growing interest in graphene.
Graphene: Technologies, Applications and Markets examines markets for graphene, with specific coverage of graphene technologies and applications. Analyses of global market drivers and trends, with data from 2014, estimates for 2015, and projections of CAGRs through 2020, and through 2025, are provided.
Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: “Graphene: Technologies, Applications and Markets“.
The origin of negative interest rate of central banks lies in the neutral rate identified by Knut Wicksell almost a century ago. Negative interest rates meant that the rate of interest required to bring an economy back to full employment with a stable inflation, which could be even negative. The real job creators in any free market economy are not only producers but also consumers. Hence, both producers and consumers have to prosper for a robust economic growth.
On macroeconomic level, there is a huge income inequality in global economy because of the reluctance of their central banks to follow a monetary policy which would usher a true free market economy. The Fed has also printed several trillion dollars in its ambitious Quantitative Easing (QE) program after 2008 stock market crash. As a result, the economy stabilized in 2009 and began to grow in 2010. However, real wages of Americans fell, while the corporate profits sky-rocketed. How did that happen? Because, the entire increase in government spending from rising budget deficit went into the coffers of already wealthy producers. This is how Goldman Sachs alone could give bonuses of over $20 billion to its executives in 2009, while millions of ordinary Americans were still being laid off from their jobs. While the consumer debt actually fell, the government spending and hence its debt actually rose so much that executives received hefty extra compensation.
Due to absence of a free market economy where wages keep pace with productivity, the central banks have to print dollars just to sustain deficits in respective economies. The trade deficits of the US are a result of offshoring of manufacturing Low Labor Cost (LLCs) Asian countries to increase the corporate profits of US based MNCs. With a lost domestic manufacturing in developed economies to countries in Asia, the citizens in developed countries are relegated to low paying service sector jobs. Hence, the real wages of majority of citizens in the U.S. have actually decreased with rising trade deficits. These trade deficits however have benefited the external share holders of corporations who have reaped huge profits from the rising share prices resulting from a practice of offshoring.
The growing economic disparity has also reduced the ability of low wage earning citizens to pay a fair share of their taxes. Additionally, the tax cuts that are offered to corporations have added further to national budget deficits. Now, the growing trade and budget deficits can be sustained only by means of printing more currency. With their monetary policies, the central banks like Federal Reserve (Fed) or European Central Bank (ECB) prints more money to bring down the rate of interest, and lower interest rates induces people to increase their borrowing or it increases consumer debt. As the wages fall with rising productivity resulting from technological progress, the wage-productivity gap keeps rising so fast that even the government has to raise its own spending and debt constantly to sustain an economic demand from the growing gap between wages and productivity. In this way, even the national debt keeps rising because of increased government spending.
Hence, Central banks keep printing more and more money and all the printed money keeps entering into the pockets of already wealthy individuals and corporations but such policies do not help boost domestic consumer purchasing power in economy. Hence, the real economic demand keeps stagnating and even falling in some cases. Since, wages contribute to economic demand and productivity contributes to an economic supply, wage-productivity gap contributes to demand-supply gap.
The Fed’s benchmark interest rates are already close to zero percent and just to keep the value of the dollar high in order to be able to export more goods to the U.S., the ECB entered into negative interest territory in June 2014. This unprecedented step of imposing a negative interest rate on banks for their deposits is in effect charging lenders to park money with the banks. Additionally, the monetary policies of central banks let wages trail productivity resulting in a lack of economic demand. This causes all the money that is not put into the bank accounts to not get invested into the economy due to a poor economic demand. In fact, negative interest rates are causing money to get stashed underneath mattresses, thereby steadily shrinking of the consumer credit in the economy.
When Fed hiked its benchmark interest rate by only 0.25 percent in early 2016, there was a net inflow of funds from developing economies into the U.S. This move has strengthened USD as compared to its other trading partners. The Asian trading partners like Japan are also following an unconventional monetary policy and Japanese central banks are moving into a negative interest rate territory just to maintain a net trade surplus with the U.S. Hence, any reluctance by the Fed to hike its benchmark interest rate is undone by a decision of US trading partners to enter into a negative interest rate territory.
A rising value of US dollar from all these policies is not good for the US economy as U.S. is unable to export its goods to other countries due to high value of USD. Hence, US trade deficits are steadily rising and could rise further if the Fed hikes its interest rates further in 2016. Rising USD combined with falling US exports are crashing the profits of US MNCs. All of this causes an inability of the U.S. to be able to balance its budget in order to retain its AAA rating. The corporate bonds can no longer retain an excellent credit rating when corporate profits keep crashing because of falling consumer demand in the economy.
A net inflow of capital from developing economies into the U.S. has also triggered a panic in the developing economies as they are dependent on the capital arriving from developed economies. The US based MNCs have neglected consumer demand in US economy, in search of a better RoI from Asian economies and this is crashing MNC profits in both developing as well as developed economies. Everything depends on the ability of the U.S. to service its sovereign debt which would no longer retain its AAA rating as corporate profits start crashing. The end result of all this would be exactly like what has happened with the housing market crash of 2008, but this time the crisis will be much more severe than the housing market meltdown. Once the U.S. defaults on its debt, the global economy would collapse like a ‘Fire Cracker’.
This article is a sequel to Apek Mulay’s two published articles on LinkedIn viz:
Apek Mulay is Business and Technology Consultant at Mulay’s Consultancy Services. He is also a senior analyst and macroeconomist in US Semiconductor Industry. He is author of book Mass Capitalism: A Blueprint for Economic Revival. Mulay has also authored another book Sustaining Moore’s Law: Uncertainty leading to a Certainty of IoT Revolution with Morgan & Claypool publishers. He pursued undergraduate studies in Electronics Engineering (EE) at the University of Mumbai in India and has completed master’s degree in EE at Texas Tech University, Lubbock. Mulay authored a patent “Surface Imaging with Materials Identified by Colors” during his employment in Advanced CMOS technology development team at Texas Instruments Inc. He has also chaired technical sessions at International Symposium for Testing and Failure Analysis (ISTFA) for consecutive years. USCIS approved his US permanent residency under the category of foreign nationals with extraordinary abilities in science and technologies even though he did not pursue a PhD degree in engineering or economics. He has been cited as an ‘Engineer-cum-Economist’ by superstar economist Professor Ravi Batra in his 2015 Volume ‘End Unemployment Now: How to Eliminate Poverty, Debt and Joblessness despite Congress’. He has appeared on National Radio shows, made Cover Story for Industry Magazines, authors articles for newspapers as well as several reputed blogs & industry publications, as well as has been invited on several Television shows ( because of his accurate macroeconomic forecasts ) for his ideas about Mass Capitalism. He is also an investing partner in an ecommerce business Calcuttahandicraft.in which he started to envision his ideas about Mass Capitalism. www.ApekMulay.com.
In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.
In order for a standard to be successful, it needs to grow and evolve with industry demand. To achieve this, IPC has released two new amendments that address evolving manufacturing requirements. The first amendment is for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies. This standard is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes, including support for both traditional solder alloys and for lead-free manufacturing.
The second amendment is for IPC-A-610F, Acceptability of Electronic Assemblies. This widely used standard is a must for all quality assurance and assembly departments. This standard illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions.
For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 embodies a critical shift to deliver necessary updates to these already robust standards. Both amendments tackle a variety of issues manufactures are currently facing in the electronics industry.
Included with this is the reintroduction of the Space Shuttle symbol to show where there are different criteria in the J-STD-001FS, Space Applications Electronic Hardware Addendum to IPC J-STD-001F. Other topics range from vertical hole fill to BGA voiding, as well as the revision of Class 2 requirements for vertical solder fill on plated through holes with less than 14 leads to include requirements when there is a connected internal thermal plane. The amendments also work toeliminate requirements for BGA voiding for BGA components with noncollapsing balls.
IPC-A-610 Revision F with Amendment 1 and J-STD -001 Revision F with Amendment 1, where the Amendment 1 is incorporated into the document, are being released in this new format for customers who want the criteria presented in one document. To make it clear, the documents in this format are not redline documents and do not show where the changes were made from Revision F to the Amendment.
In both instances, the emphasis is on quality. These IPC documents can be purchased from Electronics.ca Publications as a Printed Copy, or PDF download with single user, site user, or global user license:
