Next Generation Quantum Dot: Markets Change Rapidly

ELECTRONICS.CA PUBLICATIONS, the electronics industry market research  and knowledge network, announces the availability of a new report entitled “Quantum Dots: Market Shares, Strategy, and Forecasts, Worldwide, 2015 to 2021”. Worldwide quantum dot markets are poised to achieve significant growth as next generation systems provide a way to improve traditional displays with vibrant color and decrease the cost of making electronic devices by decreasing manufacturing costs while increasing quality.

Quantum Dots: — Markets Reach $4.6 Billion By 2021

Quantum dot markets are set for rapid growth. Quantum dot market driving forces relate to technology maturity. TV displays, fuel cell catalysts, solar quantum dots, a range of applications depend on the ability to manufacture quantum dots consistently and in sufficient quantity to be useful in a commercial environment. Large screen TV displays represent one of the first commercial application for quantum dots.

This TV display market is a good market. The overall flat panel display (FPD) market is anticipated to reach US$110 Billion by 2017. Growth is driven by widespread use of devices that embed electronic displays. Displays fit in electronic TVs, notebooks, and mobile smart phones. Ample opportunities exist in the automotive sector as display mediums for entertainment and driver assistance systems.

FPDs can tap into opportunities in the advertising sector, where they are used for both outdoor and indoor ad displays. Public display systems are becoming more common. Technology innovation, lower prices, and robust demand bodes well for market development.

Quantum dot films inside FPDs are indispensable to electronic devices that require human operation and as a result LCD and plasma technologies are now commonplace. In the television industry. Quantum dot penetration of flat panel display markets promise to be huge. Demand for thin TVs is strong, with wall mounted TVs accounting for a major portion of the market. FPDs are popular for buildings and transport applications. They are used in digital picture frames.

Challenges to existing display technology comes from viewer desire for pure colors and low energy consumption. These features are provided by quantum dots. End-use of big TV displays are expected to drive quantum dot markets throughout the forecast period. Industries analyzed include information systems, personal computers, telecom equipment, instrumentation, consumer appliances, transportation equipment, stationary fuels cells, and medical devices.

Quantum Dot (QD) and Quantum Dot LED (QLED) Market is evolving. The quantum dot market depends on techniques for the development of commercial quantity production. Kilogram quantity mass production of quantum dots is a game-changer. High quality, high quantity and low price quantum dots increase the rate of change in consumer electronics markets.

Quantum dot technology offers screen quality far beyond what has been available previously. The quality of light is better for displays with quantum dots. New products are emerging as manufacturers learn to integrate high efficiency / luminescence quantum dots into display products. The level of change represents a paradigm shift that creates new industries, products, and jobs in science and industry.

The list of possible quantum dot applications is ever expanding. New applications are waiting for the availability of quantum dots.

• Gold Nanoparticles Illustrate Properties Of Colloidal Nanocrystals Size Dependency


• Intrinsic physical sizes are comparable to the critical sizes of many important properties of a given class of functional materials


• Wavelength of the electron wave function


• Diameter of photo-generated excitons


• Domain size of magnetic single domains


• Large surface-to-volume atom ratio alters the chemical potential of the structural


• Large surface-to-volume atom ratio different in comparison to corresponding bulk crystals


• Strongly size-dependent solubility of nanocrystals


• Presence of size dependent structures in the nanometer regime


• Electron band configuration


• Surface structure


• Surface reconstruction


• Unique crystal structures


• Unique catalytic properties of gold nanocrystals can be considered an example

Quantum Dot and Quantum Dot LED (QLED) market segments include HDTV and displays, solar, LED lighting, cancer imaging, personalized medicine, telco lasers, and ID tags. All segments are anticipated to achieve spectacular growth, with TV display technology and solar markets reaching over $1 billion per year in revenue by 2021. Qdot cancer imaging / personalized medicine reaches $750 million and quantum dot ID Tags go to $700 million dollars by 2021.

Vendors, including Nanosys and QD Vision synthesize these materials in solution, and formulate them into inks and films. Quantum Dot LEDs (QLED) enable performance and cost benefits.

Quantum Dot LED (QLED) commercial focus has remained on key optical applications: Optical component lasers are emerging as a significant market. LED backlighting for LCD displays, LED general lighting, and solar power quantum dots are beginning to reach the market. Vendors continue to evaluate other applications.

Medical applications are potentially large and beginning to reach a level of maturity that represents real market presence. Early stage work with University College London in cancer imaging is progressing.

According to Susan Eustis, lead author of the team that prepared the study, “Quantum dots QDs are nano-particles in the range of 2 nm to 10 nm diameter. Quantum dots are tiny bits of semiconductor crystals with optical properties that are determined by their size and shape more than material composition. Their small size is of nanoparticles is only now making them able to be manufactured in commercial quantities. They are made through a synthesis process. Strong growth is anticipated as companies master manufacturing techniques that allow consistent production”

Quantum dot markets at $306 million in 2014 are anticipated to reach $4.6 billion by 2021 as next generation devices, systems, and displays are triggered by quantum dots. Quantum dots represent the next wave of semi conductor revolution, giving sophisticated functionality based on the size and shape of the nanoparticle not the base material. Because the materials science is so easy to manipulate, the devices can be made very inexpensively with a lot of variety.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: “Quantum Dots: Market Shares, Strategy, and Forecasts, Worldwide, 2015 to 2021“.

Next Generation Quantum Dot: Markets Change Rapidly

ZigBee Standards Will Be Used in Over 80% of 802.15.4 Chipset Shipments in 2020

ELECTRONICS.CA PUBLICATIONS, the electronics industry market research and knowledge network, announces the availability of a new report entitled “ZigBee Lights Up the Internet of Things: A Market Dynamics Report“.  New research finds that annual shipments of IEEE 802.15.4 chipsets nearly doubled last year and will increase by 550% over the next five years. In 2020, ZigBee standards will be used in 8 out of 10 of the 802.15.4 chipset shipments.

---

“ZigBee has always provided flexibility for developers and now ZigBee is rapidly becoming the consumer technology of choice for emerging smart home products,” says Mareca Hatler, ON World’s research director. “This trend is expected to accelerate as ZigBee 3.0 unifies its application profiles and the Thread Group provides a standards based IP addressable wireless mesh network layer.”

Annual unit shipments for ZigBee/802.15.4 nearly doubled last year and will increase by 550% over the next five years. In addition to ZigBee PRO, the most widely adopted wireless mesh network protocol, the ZigBee Alliance also certifies ZigBee RF4CE devices for simple, ultra-low power remote controls and the ZigBee Alliance is also working on a new specification for outdoor wireless mesh networking using IEEE 802.15.4g and 6LoWPAN.

The Thread specification that is scheduled to be released this July will simplify and streamline the creation of smart home IoT products and services. Through a collaboration with the ZigBee Alliance, the Thread Group benefits from over a decade of development of application profiles and ZigBee 3.0 in particular. ZigBee 3.0 is scheduled to be completed this year and will unify commonly used ZigBee profiles such as ZigBee Light Link, ZigBee Home Automation, ZigBee Health Care and others into a single application profile suite, significantly streamlining product development and interoperability among vendors.

Applications for the IoT continue to expand with a growing number of IoT cloud providers such as Ayla Networks, Arrayent, GreenWave Systems, Helium, Kitu Systems, SmartThings (Samsung) and Wink (Quirky) that have recently raised $500 million in venture or equity investments.

By 2020, this new study projects that over 80% of IEEE 802.15.4 annual shipments will use a ZigBee standard. However, ZigBee is facing intensifying competition from low power variants of WiFi and Bluetooth Smart that are gaining tremendous momentum currently from the mobile, IT and consumer electronics industries. Within the next five years, the study projects that annual wireless sensor network chipset shipments will exceed 2 billion.

This report analyzes the evolving market forces, technology advances and competitive dynamics for 22 unique ZigBee markets and provides 5-year forecasts for 802.15.4/ZigBee and competing alternatives including WiFi, Bluetooth, Z-Wave, EnOcean and others. It also includes key findings from a recently completed survey with 1,000+ consumers and an extensive analysis of hundreds of ZigBee/802.15.4 products and services.

ZigBee Lights Up the Internet of Things

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: “ZigBee Lights Up the Internet of Things: A Market Dynamics Report“.

 

ZigBee Standards Will Be Used in Over 80% of 802.15.4 Chipset Shipments in 2020

Global Printed Circuit Boards Market Data 2015

Electronics.ca Publications unearths interesting findings that may reveal golden opportunities for electronics manufacturers. Here are some of the latest discoveries of interest to PCB fabricators:

According to “Monthly IPC North American PCB Market Report” Flexible circuit orders in North America are booming this year and the forecast for the next year is for double-digit sales growth. The North American flex market has grown over the past 3 years while the rigid PCB market has shrunk. Globally, the flex market is now estimated at over $10.2 billion. Yet, U.S. production accounts for only 3.4 percent of the world’s flexible circuits.

The monthly North American PCB Market Report provides timely data on PCB market size, sales and order growth, book-to-bill ratios and near-term forecasts. Data are reported for rigid PCBs and flexible circuits separately. The rigid PCB data are further segmented by company size tiers, and flex data includes trends in bare circuit versus assembly revenue sources. Trends in sales of boards to the military and medical markets are reported for both rigid and flex, as well as trends in prototype sales.

According to Global and China FPCB (Flexible Printed Circuit Board) Industry Report, 2014 was a bumper year for most FPCB companies, and the output value of the entire PCB industry reached USD12.5 billion, rising by 10.5% from the previous year. In 2015, the prices of bulk commodities (particularly the copper price) plummet, which will greatly reduce the raw material costs of PCB companies and help raise their profitability. Larger screen size of mobile phone requires larger FPCB. The FPCB market is expected to grow 8.6% in 2015 as the smartphone market can not continue its rapid growth and the tablet PC is in recession.

In 2014, the euro, the NTD and the yen significantly devalued, while the South Korean won appreciated, which not only hit a serious blow to the competitiveness of South Korean FPCB enterprises, but minified the profit of South Korean PCB enterprises. The revenue and profit margin of all South Korean PCB companies declined, for example, Flexcom’s revenue slumped by more than 50%, the giant Interflex’s revenue dropped 33% and its operating margin turned to be the negative 14.2%, which showed the power of the currency war.

Benefiting from the currency depreciation, Taiwanese and European companies witnessed soaring profit margins. More than half of Japanese companies did not benefit from the depreciation of the yen because they set up production bases overseas, but still better than South Korean companies.

In the downstream market, the biggest change in 2014 lied in: HDD saw the first growth after three consecutive years of decline. The global HDD shipment amounted to 564 million units, an increase of 2.4% from 2013. Previously, insiders were optimistic about the prospect of SSD instead of HDD; but actually, the SSD price remained high, the tablet PC market decayed, while the laptop computer market recovered to growth after three consecutive years of downturn. At the same time, the development of SSD did not restrict HDD; the new network economy and the big data era stimulated the demand for servers and HDD. HDD will still be the mainstream in the next three to five years, and the HDD shipment is expected to reach 621 million units in 2019. Japanese companies focusing on HDD-use FPCB performed exceedingly well in 2014, for example, the leader NOK (Mektron) achieved the revenue growth rate of 28% and the operating margin of 8.7% (rising from the negative 10.6%), Nitto’s revenue surged by 31%.

The competitiveness of South Korean and American companies weakened significantly. The strong USD made MFLEX’s revenue fall dramatically. The depreciation of NTD facilitated Taiwanese companies to grow by leaps and bounds; meanwhile, Apple greatly reduced orders from South Korean companies, while placed more orders with Japanese and Taiwanese companies in accordance with the principle of the nearest supply. The revenue of ZDT under Foxconn soared 60% in 2014.

 

Global Printed Circuit Boards Market Data 2015

Can "Make in India" become sustainable for Indian Semiconductor manufacturing sector with coming macroeconomic changes in 2015?

The semiconductor manufacturing is most capital intensive business and it is very important to make these investments sustainable in short term in order to ensure profitability in long term. Sustainability of the semiconductor wafer fabs involves being able to keep the fabs in operation 24×7 to reduce the tool idle time and manufacturing semiconductor wafers that meet the growing demand for consumer electronics and military needs.

My recently released book “Mass Capitalism: A Blueprint for Economic Revival”, takes you through the journey of semiconductor manufacturing in U.S. semiconductor industry. The high cost of manufacturing and keeping track with the International Technology Roadmap for Semiconductors (ITRS) to keep up with progress of Moore’s law forced offshoring of IC packing industry, design engineering services and eventually even the manufacture of semiconductor wafers from United States to Asia. These policies of globalization have resulted in rising trade deficits for the U.S. The replacement of manufacturing sector with relatively low paying service sector jobs has resulted in falling incomes and depreciating middle class in the U.S.

In this way globalization of semiconductor manufacturing resulted into a loss of dominance of the U.S. semiconductor industry and started to make this capital intensive as well as knowledge intensive business unsustainable leading to an early demise of Moore’s law (due to economic limits because of huge capital investments) because of poor return on investments due to poor domestic consumer demand. Since the 2008 financial crisis, the U.S. has been trying to revive its economy by lowering its bench mark interest rates close to 0% and following Quantitative Easing (QE) policies to stimulate its economy. Instead of reviving the economy by boosting domestic consumer demand, the QE policies have instead resulted into growing income disparity as the wages of the middle class haven’t been growing to boost consumer demand.

The growth in domestic demand from increased consumer borrowing due to low interest rates is unsustainable as interest rates cannot remain low forever. Additionally, the low interest rates have not increased domestic investments in the U.S. and instead investors have preferred to get better returns on their investments by investing in countries with higher interest rates like India. Hence, Low bench mark interest rates in developed economies like U.S. and Europe have primarily benefited the wealthy individuals in helping them get cheaper loans on mortgage properties and helping them earn higher incomes through renting these properties. These monetary policies haven’t encouraged the easy money from QE to get invested in domestic economy as investors have preferred to invest for higher yields in countries like India. Hence, QE policies have not been able to solve the problem of unemployment in the U.S. and has mostly created low paying and part time jobs in U.S.

Now that the QE has come to an end and the Fed is on track to raise its rates in mid 2015, the following macroeconomic changes are certain. First, the rising bench mark interest rates will not be able to lure U.S. residents into increased borrowing for mortgaging cars and houses. Additionally, When interest rates rise, the investors who have invested for short term gains in countries like India will move their investments for higher yields to the U.S.. This would put a sudden strain on the Indian rupee (INR). Hence, the net result of rising rates in the US with present monetary policy would be a poor domestic consumer demand in U.S. from decreased borrowing and strain on economies of developing countries like India through rising inflation. These changes would cause a rise in value of USD and depreciation of INR.

The net result would be a rising inflation in India as investors looking for better gains would rush to U.S. for higher returns. The largest withholders of U.S. FOREX viz. China has signed currency swap deals with its major trading partners and performs transactions in Yuan instead of USD. Hence, although USD will rise from foreign investments, U.S. will not be able to reduce its trade deficits through exports as US manufactured goods would become expensive in international markets. As there will be no major buyers for US debt due to bypassing of USD by major withholders of US Forex like China and Russia, the only way ahead forward for the Fed is to reform its current monetary policy so that wages keep track with employee productivity which would reduce US budget deficits. The U.S. has also recently imposed huge tariffs on solar goods from China and Taiwan to boost its domestic manufacturing. Eventually, U.S. will also have to impose tariffs on all foreign goods entering the U.S. to eliminate its trade deficits for revival of domestic manufacturing industry. Without reforming its trade and monetary policies to reduce its trade and budget deficits, any rise in value of USD with rise in Fed’s bench mark interest rates would result into an increase in US twin deficits which would also cause an increase in supply of goods into the an economy, which is suffering from a poor economic demand. This would cause a crash in profits of those corporations when their manufactured goods remain unsold and thereby also crashing the US stock market.

Taking these macroeconomic changes into consideration, India has following things to worry about its “Make in India” plan. The plan to lure foreign investors into India to make India a global semiconductor manufacturing hub like China could fail, if any of these investors are looking for short term gains, as semiconductor investments are long term strategic investments. These investments pay off for any country over a long term and not a short term investments that yield a quick return on investments like financial sector of today’s economy. Hence, Just like TSMC Inc. gets its financial backing from government of Taiwan, Samsung Inc. gets its financial backing from government of South Korea and Globalfoundries Inc. gets backing from government of Abu Dhabi, the upcoming Indian semiconductor fabs should also be sponsored with backing of government of India to make these capital intensive investments sustainable. This approach would minimize any chances of these capital intensive investments becoming unsustainable when investors move their investments out of India for their short term gains due to rise in US interest rates.

These huge capital investments into semiconductor wafer fabs can become sustainable only if there is a solid economic demand for these semiconductor wafers in Indian electronics industry because the economic demand is presently slowing in developing economies. However, If Indian government policies do not encourage consumption of domestic manufactured products and hence if import of foreign manufactured goods continue due to India’s Free trade policies, the trade deficits of India will continue to soar. The government recently passed some strict guidelines to all ministries asking them to give preference to domestically manufactured electronic products. This is a positive step forward aimed at boosting electronics production as part of Prime Minister Narendra Modi’s “Make in India” drive. If trade deficits are allowed to soar, these deficits will put a further strain on already troubled INR. Additionally, the products manufactured by Indian fabs will get consumed domestically only if the wages of Indian citizens keep track with their productivity. This free market monetary policy would also ensure a robust consumer demand for electronic goods in order to keep the fabs in operation 24×7 thereby reducing the idle time of tools. The potential of fabless semiconductor ecosystem in its ability to grow small businesses should be adopted by “Make in India” movement. In this process several macroeconomic reforms should also be advocated because an absence of these macroeconomic reforms have made the fabless semiconductor ecosystem unsustainable for the U.S. contributing to its twin (trade and budget) deficits.

To ensure a good return on its investments by being able to create domestic jobs and to minimize the job loses in economic downturns, a three tier fabless semiconductor business model with decentralized supply chains as proposed in “Mass Capitalism: A Blueprint for Economic Revival” should be adopted by Indian semiconductor industry. This would usher in a competitive free market balanced economy and help Indian economy transition from a developing economy to a developed economy. The trade and budget deficits would be eliminated and ever increasing huge capital investments would make this highly capital intensive business not just sustainable but also very profitable. This is a free market approach to make the investments in semiconductor fabs a success so that India can keep its 2020 projected $400 billion account deficits under control and ensure that its semiconductor manufacturing sector is able to keep track with progress of Moore’s law.

Economy also moves in a systaltic fashion and never in a straight line. Due to this systaltic motion, internal clash and cohesion take places giving rise of economic cycles. The ups and downs of socio-economic life in different phases are sure to take place due to this systaltic principle. Having a balanced economic model will also eliminate the problem of unemployment in economic downturns. In this way excess government spending in economic downturns can be eliminated achieving a true free market economic model for semiconductor industry.

About Apek Mulay

Apek Mulay is CEO of Mulay’s Consultancy Services, a senior analyst and macroeconomist in the United States semiconductor industry and author of the new book, “Mass Capitalism: A Blueprint for Economic Revival.” He attended the University of Mumbai in India and later completed his master’s degree in electronics engineering at Texas Tech University. Mulay is the author of the patent “Surface Imaging with Materials Identified by Colors” during his employment at Texas Instruments Inc., and he has chaired technical sessions at International Symposium for Testing and Failure Analysis (ISTFA) for consecutive years. The U.S. government approved his permanent residency under the category of foreign nationals with extraordinary abilities in science and technologies. www.ApekMulay.com

Can "Make in India" become sustainable for Indian Semiconductor manufacturing sector with coming macroeconomic changes in 2015?

Global Market for Optical Network Semiconductor Components to Reach $7.6 Billion in 2019

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Optical Network Components: Global Markets”.  This study reveals that the ongoing migration from lower speed to higher speed connections is providing optical network component suppliers with a recurring revenue stream. Optical network semiconductors will witness an increase from $6.4 billion in 2014 to $7.6 billion in 2019, registering a 3.2% rise in compound annual growth rate (CAGR). The result is that optic components will continue to be an area of prime interest to silicon suppliers.

Advances in wafer and silicon technology have enabled chip manufacturers to squeeze complex functions onto much smaller spaces. They have also been able to put increased functionality into these chips. As a result, optical components continue to be an area of prime interest for semiconductor suppliers. These new semiconductors offer users a number of benefits— more functionality, simpler deployment, and support for higher speed.

Businesses and individuals have developed new applications to take advantage of high-speed, multimedia-friendly transmissions. In the healthcare industry, high-speed optical connections are dramatically improving patient care. Medical imaging is becoming more granular and new applications are emerging. In the data center, optic connections are altering the design of IT systems. Consolidated systems are becoming more common and cloud computing will gain demand.

GLOBAL OPTICAL MARKET SEGMENT REVENUES, 2013-2019 ($ MILLIONS)

Optical Network Components: Global Markets analyzes and forecasts market trends in each segment of the optical semiconductor market, delineates technology trends, and identifies market leaders. Forecasts are presented for user requirements, current buying patterns, and expenditure trends from 2014 through the year 2019.

 

 

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: Optical Network Components: Global Markets.

Optical Network Semiconductor Components Market – Partial List of Tables

Table 1 : IP TRAFFIC PER MONTH, THROUGH 2018

Table 2 : IP TRAFFIC BY MARKET SEGMENT PER MONTH, THROUGH 2018

Table 3 : PER PORT WLAN PRICING TRENDS, THROUGH 2019

Table 4 : FORECAST FOR MARKET SHARE OF OPTICAL COMPONENTS BY CATEGORY, 2014 AND 2019

Table 5 : FORECAST FOR GLOBAL MARKET FOR OPTICAL COMPONENTS BY PRICE AND REVENUE, THROUGH 2019

Table 6 : TOP FIVE OPTICAL COMPONENT SUPPLIERS, 2019

Table 7 : NUMBER OF INTERNET USERS WORLDWIDE, 1993 TO 2014

Table 8 : GLOBAL INTERNET BACKBONE TRAFFIC PATTERNS, 1990-2014

Table 9 : INTERNET USAGE STATISTICS BY WORLD REGION, 2012

Table 10 : WIRELESS USAGE PATTERNS BY TYPE, 2014

Table 11 : CELLULAR NETWORK SUBSCRIBER GROWTH, 2010-2014

Table 12 : TOP TEN WIRELESS CARRIERS BY NUMBER OF SUBSCRIBERS, 2014

Table 13 : SONET/SDH DATA RATES AND LINE SPEEDS

Table 14 : STRUCTURE OF AN ATM CELL

Table 15 : GLOBAL MARKET FORECAST FOR TELECOMMUNICATIONS OPTICAL COMPONENTS, THROUGH 2019

Table 16 : TOP FIVE TELECOMMUNICATIONS OPTICAL COMPONENTS SUPPLIERS, 2014

Table 17 : GLOBAL MARKET FORECAST FOR 100G TELECOMMUNICATIONS OPTICAL COMPONENTS, THROUGH 2019

Global Market for Optical Network Semiconductor Components to Reach $7.6 Billion in 2019

World PCB Production in 2014 Estimated at $60.2 Billion

The world market for printed circuit boards (PCBs) reached an estimated $60.2 billion in value in 2014, growing just 0.7 percent in real terms, according to IPC’s World PCB Production Report for the Year 2014. Production growth in China, Thailand and Vietnam compensated for declining PCB production in most other regions. Developed by a team of the world’s leading PCB industry analysts, the annual study is the definitive source of PCB production data, indicating the volumes and types of PCBs being made in the world’s major producing countries.

The report contains estimates of 2014 PCB production value by nine product categories and by 30 countries or sub-regions. Four categories of rigid PCBs, three categories of flexible circuits, and IC substrates are covered. The standard multilayer rigid PCB values are further segmented by those having microvia structures and those with non-microvia structures. The report also includes updates on metal-core PCBs, as well as regional trends and historical data on regional shifts in PCB production.

The data show that the worldwide rigid PCB market grew modestly in 2014, while flexible circuit growth was flat. Regional trends are also examined, including China’s slowing production growth and the spectacular growth in the PCB industries of Thailand and Vietnam.

“PCB production is an international business and the landscape continues to change,” says Sharon Starr, IPC director of market research. “Companies based in Taiwan, Japan and South Korea, are responsible for more than two-thirds of world PCB production. These and other companies around the world are powering the impressive growth of PCB production in southeast Asia.”

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View Report Contents: World Printed Circuit Borads Production Report for the Year 2014.

 

 

 

World PCB Production in 2014 Estimated at $60.2 Billion

Electronics Assembly IPC Standards Collection

It takes a lot to be successful in electronics assembly. Get the reference documents you need on all aspects of the job from solder materials, component characteristics, manufacturing and quality requirements, and acceptability of the final assembly. Includes 41 key documents for SMT and through-hole assembly, including the widely used IPC-A-610, J-STD-001 and IPC-A-620.  Get the complete IPC standards collection and save 55% on individual document prices. Users can also purchase and download IPC standards from Electronics.ca Publications by following IPC specs below.

Electronics Assembly IPC Standards Collection Includes

IPC 2611 Generic Requirements for Electronic Product Documentation
IPC 2612-2 Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descript
IPC 2612-1 Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC 3406 Guidelines for Electrically Conductive Surface Mount Adhesives
IPC 3408 General Requirements for Anisotropically Conductive Adhesives Films
IPC 7095C Design and Assembly Process Implementation for BGAs
IPC 7351B Generic Requirements for Surface Mount Design and Land Pattern Standard
IPC 9202 Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemic
IPC 9203 Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC 9701A Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
IPC 9702 IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects
IPC 9703 IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
IPC 9704A Printed Circuit Assembly Strain Gage Test Guideline
IPC 9706 Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder
IPC 9707 Spherical Bend Test Method for Characterization of Board Level Interconnects
IPC 9708 Test Methods for Characterization of Printed Board Assembly Pad Cratering
IPC 9709 Test Guidelines for Acoustic Emission Measurement during Mechanical Testing
IPC A-610F Acceptability of Electronics Assembly
IPC A-620B IPC/WHMA-A-620B Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC C-406 Design & Application Guidelines for Surface Mount Connectors
IPC CA-821 General Requirements for Thermally Conductive Adhesives
IPC CC-830B Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
IPC CM-770E Component Mounting Guidelines for Printed Boards
IPC D-326A Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies
IPC FC-234A Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards
IPC HDBK-001E Handbook and Guide to Supplement J-STD-001
IPC HDBK-005 Guide to Solder Paste Assessment
IPC JP002 JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies
IPC J-STD-002D EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
IPC J-STD-003C-WAM1 Solderability Tests for Printed Boards
IPC J-STD-004B Requirements for Soldering Fluxes
IPC J-STD-005A Requirements for Soldering Pastes
IPC J-STD-006C Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders
IPC J-STD-020D-1 IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surf
IPC J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size Configurations
IPC J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps
IPC J-STD-030A Selection and Application of Board Level Underfill Materials
IPC J-STD-033C-1 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Device
IPC J-STD-075 Classification of Non-IC Electronic Components for Assembly Processes
IPC MC-790 Guidelines for Multichip Module Technology Utilization
IPC S-816 SMT Process Guideline & Checklist
IPC SM-780 Component Packaging & Interconnecting with Emphasis on Surface Mounting
IPC SM-784 Guidelines for Chip-on-Board Technology Implementation
IPC SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Attachments
IPC SM-817 General Requirements for Dielectric Surface Mounting Adhesives
IPC SM-817A General Requirements for Dielectric Surface Mount Adhesives
IPC T-50K Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC TR-001 An Introduction to Tape Automated Bonding Fine Pitch Technology

Electronics Assembly IPC Standards Collection