5G Wireless Ecosystem Research and Trial Investments to Reach $5 Billion by 2020

While LTE and LTE-Advanced deployments are still underway, wireless carriers and vendors have already embarked on R&D initiatives to develop so-called “5G” technology, with a vision of commercialization by 2020.

5G is essentially a revolutionary paradigm shift in wireless networking to support the throughput, latency, and scalability requirements of future use cases such as extreme bandwidth augmented reality applications and connectivity management for billions of M2M (Machine to Machine) devices.

Although 5G is yet to be standardized, some of the collectively accepted attributes of the technology include new air interface transmission schemes, new spectrum bands, spectrum aggregation, Massive MIMO, beamforming, D2D (Device to Device) communications and self-backhauling, among others.

Key findings:

• Driven by regional, national government, wireless carrier and vendor initiatives, we expect 5G Wireless Ecosystem R&D and trial investments will account for nearly $5 Billion by 2020, following a CAGR of nearly 40% over the next 5 years


• Nearly 70% of these investments will target large scale commercial trial networks in Japan, South Korea and other early pioneering countries


• Despite a lack of standardization, vendors are aggressively investing in 5G development efforts with a principal focus on new transmission schemes, antenna technologies, and higher frequency bands


• 5G networks are expected to utilize a variety of spectrum bands, ranging from established cellular bands to millimeter wave frequencies


• 5G standardization activities are expected to commence between 2015 and 2016

5G Wireless ecosystem research report covers the following topics:

• 5G requirements, use cases & vertical market applications


• 5G market drivers and barriers


• Air interface & antenna technologies: Massive MIMO, waveforms, phased array antennas & beamforming


• Spectrum technologies: Cognitive radio, spectrum sensing, aggregation & LSA (Licensed Shared Access)


• D2D communications & self-backhauling networks


• Complimentary technologies for 5G: NFV (Network Functions Virtualization), SDN (Software Defined Networking), HetNet (Heterogeneous Networking), C-RAN (Cloud RAN), drones & satellites


• Spectrum options for 5G


• Standardization & research initiatives


• Competitive assessment of vendor strategies & commitments to 5G


• 5G investment and subscription forecasts from 2015 till 2025

The “5G Wireless Ecosystem: 2015 – 2025 – Technologies, Applications, Verticals, Strategies & Forecasts” report presents an in-depth assessment of the emerging 5G ecosystem including key market drivers, challenges, enabling technologies, use cases, vertical market applications, spectrum bands, wireless carrier deployment commitments and vendor strategies. The report also presents forecasts for both 5G investments and subscriptions.

The report comes with an associated Excel datasheet suite covering quantitative data from all numeric forecasts presented in the report. Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: “5G Wireless Ecosystem: 2015 – 2025 – Technologies, Applications, Verticals, Strategies & Forecasts”.

 

 

5G Wireless Ecosystem Research and Trial Investments to Reach $5 Billion by 2020

North American Electronics Sales Growth Flat but Outlook is Positive

As of November 2014, sales growth was flat in the bare printed circuit board (PCB) and electronics manufacturing services (EMS) segments of the electronics industry, in sharp contrast to semiconductor sales that continued to skyrocket. U.S. new orders for electronics products, which tend to lead sales by about one month, continued to sag.

IPC’s PCB book-to-bill ratio, which normally leads PCB sales by three to six months, climbed further to 1.06 in November after hovering around 1.00 during most of 2014. Ratios above parity (1.00) indicate greater demand than supply, which may be a precursor of strengthening sales growth in the PCB industry in 2015.

All data cited in this report are based on rolling averages of the past three months, which smooths out some of the volatility in monthly data to show clearer trends.

Electronics Sales Growth

Note on the graph:  All indices are based on the same baseline of the average month in 2000=100, and reflect a three-month rolling average.

Sources: IPC statistical programs for the EMS and PCB industries; SIA for semiconductor data; U.S. Census Bureau for U.S. new orders for computer and electronic products.

Learn more about Electronic Contract Manufacturing Services market and publications that provide informed perspective and relevant analysis of emergent technologies.

“Electronic Contract Manufacturing Services – Global Strategic Business Report” analyzes the worldwide markets for Electronic Contract Manufacturing Services in US$ Million by the following Product Segments: Consumer Electronics, Computers & Peripherals, Telecommunications, Industrial Electronics, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2013 through 2020. Also, a seven-year historic analysis is provided for these markets. Market data and analytics are derived from primary and secondary research. The report profiles 308 companies including many key and niche players such as –

Altadox, Inc.

Benchmark Electronics, Inc.

Celestica, Inc.

Compal Electronics, Inc.

Creation Technologies LP

 

North American Electronics Sales Growth Flat but Outlook is Positive

HDD & SSD Industry Market Analysis And Processing Trends

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “The Hard Disk Drive (HDD) and Solid State Drive (SSD) Industry: Market Analysis And Processing Trends“.

Hard-disk drives have been the default storage component in desktop and laptop PCs for decades. As a result, the term “hard drive” is now the common descriptor for all storage hardware. Although modern hard-disk drives are far more advanced and higher-performing than their counterparts from yesteryear, on many levels their basic underlying technology remains unchanged. All hard-disk drives consist of quickly rotating magnetic platters paired with read/write heads that travel over the platters’ surfaces to retrieve or record data.

On many levels, solid-state drives are similar to hard drives. They usually connect to a system by way of the SATA interface (though PCI Express-based drives are also available for ultrahigh-performance applications), and they store files just as any other drive does. SSDs, however, eschew the magnetic platters and read/write heads of hard-disk drives in favor of nonvolatile NAND flash memory, so no mechanical parts or magnetic bits are involved.

Key criteria that differentiate HDDs and SSDs are:

Form factor

Without any moving parts, SSD products are the thinnest of the available storage options. They’re especially good for thin and light PCs and complex, industrial designs. For standard notebooks, SSDs are available in 5mm and 7mm heights. By comparison, HDDs are available in standard 7mm and 9.5mm designs. SSHDs debuted at 9mm, will ship at 7mm soon, and 5mm designs have been announced for shipment in 2013.

Capacity

HDDs are the workhorses when it comes to sheer capacity and how much data can be stored. SSHD technology also offers maximum capacity points at affordable price points while SSDs are only affordable at lower capacities. High-capacity SSDs are extremely expensive.

Speed

SSDs provide peak performance for booting and high read/write performance to supporting computing that requires enhanced multitasking capabilities. On the other hand, an SSHD can provide near SSD performance for booting, launching, and loading data. HDDs usually provide ample performance for the majority of PC platforms shipping today.

Price

At a system level, low-capacity SSDs can be affordable in the 32GB to 64GB range. But high-capacity SSDs are very expensive, especially when measured by cost per gigabyte. HDDs provide the lowest cost per gigabyte. SSHDs provide a cost per gigabyte that’s just slightly higher than HDDs.

Battery life

In general, storage will not impact battery life in a laptop computer by more than about 10%. Processor power and LCD really run down the battery. However, SSD is the most power-efficient, and SSHD is a close second because it can spin down more frequently than an HDD.

Reliability

Failure rates on SSD, HDD, and SSHD technologies have very similar ratings. SSHD has benefits because it uses both the SSD and HDD portions more efficiently than if they were separate.

Durability

SSDs are viewed as more durable simply because of their solid state design. Without moving parts, they can withstand higher extremes of shock, drop, and temperature.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: The Hard Disk Drive (HDD) and Solid State Drive (SSD) Industry: Market Analysis And Processing Trends.

SSD Industry Market Analysis  

TABLE OF CONTENTS

Chapter 1 The Disk Drive Market Infrastructure

Chapter 2 The Hard Disk Drive Industry

2.1 Hard Disk Drive Trends 2-1

2.2 Hard Disk Form Factors 2-10

2.3 Hard Disk Drive Market Analysis 2-14

2.3.1 Desktop PCs 2-23

2.3.2 Portable PCs 2-23

2.3.3 Enterprise 2-26

2.3.4 Consumer Electronics 2-26

2.4 Competitive Structure 2-34

2.4.1 HDD Market Share 2-34

Chapter 3 The Solid State Drive Industry

3.1 Solid-State Drives (SSD) Trends 3-1

3.2 Solid-State Drives Market Analysis 3-2

3.2.1 Client SSD Trends and Forecast 3-8

3.2.2 Enterprise SSD Trends and Forecast 3-15

3.2.3 Hybrid Hard Drives (HHD) Forecast 3-20

3.3 3D NAND Forecast 3-23

3.3.1 Comparison of 3D-NAND Structures 3-25

3.4 SSD Capacity Forecast 3-29

Chapter 4 Recording Heads

4.1 Thin Film Read/Write Heads 4-1

4.1.1 Thin Film (TF) Heads 4-2

4.1.2 Magnetoresistive (MR/AMR) Heads 4-2

4.1.3 Giant Magnetoresistive (GMR) Heads 4-4

4.1.4 Colossal Magnetoresistive (CMR) Heads 4-7

4.1.5 Current-Perpendicular-To-Place (CPP) Heads 4-8

4.1.6 Ballistic Magnetoresistance (BMR) Heads 4-8

4.2 Trends 4-10

4.3 Recording Head Market Forecast 4-18

Chapter 5 Processing Trends And Markets

5.1 Head Processing 5-1

5.1.1 Head Fabrication – CMP, Deposition, Lithography 5-6

5.1.1.1 CMP Challenges 5-11

–  Ceria Slurry For Glass Disk Market 5-17

– Oxide Slurry For Metal Disk Market 5-22

– Oxide Slurry For Thin Film Head Market 5-25

5.1.1.2 Lithography Challenges 5-28

5.2 Patterned Magnetic Media 5-31

5.2.1 Conventional Media 5-32

5.2.2 Patterned Media 5-34

5.3 Market Analysis Of Discrete Track Media 5-44

5.3.1 The Perpendicular Recording Movement 5-44

5.3.2 Cost of Ownership (CoO) Analysis 5-59

5.4 NAND Processing 5-65

5.4.1 2D NAND Processing 5-67

5.4.2 3D NAND Processing 5-73

5.4.2.1 Etch Challenges and Market Forecast 5-80

5.4.2.2 Deposition Challenges and Market Forecast 5-81

5.5 3D ReRAM Challenges 5-82

Chapter 3 The Media Market

3.1 Industry Trends 3-1

3.2 Media Profiles 3-5

3.3 Media Market Supplier Shares 3-7

Chapter 4 The Substrate Market

4.1 Platter Substrate Materials 4-1

4.1.1 Aluminum Disks 4-4

4.1.2 Glass Disks 4-6

4.2 Substrate Market 4-11

4.3 Substrate Suppliers 4-16

4.4 Glass Substrate Supplier Shares 4-21

 

HDD & SSD Industry Market Analysis And Processing Trends

Microfluidics Market worth $3.5 Billion by 2018

The “Microfluidics Market Materials (Polymers, Silicon, Glass), Pharmaceuticals (Microreactors, Toxicity Screening, Lab on Chip, Proteomic & Genomic Analysis) Drug Delivery Devices (Microneedles, Micropumps), IVD (POC) – Global Trends & Forecast to 2018” analyzes and studies the major market drivers, restraints, and opportunities in North America, Europe, Asia, and Rest of the World.

This report studies the global microfluidics market over the forecast period of 2013 to 2018. The global microfluidics market is valued at $1.59 billion in 2013 and is poised to reach $3.57 billion by 2018, at a CAGR of 17.6%.

The microfluidics market is categorized based on materials, products, and applications. The polymers market (in the materials segment) and in-vitro diagnostics market (in the products segment) are considered as potential market segments. The rising demand for POC diagnostic devices, quick return on investments provided by microfluidic devices which helps in cost reduction, and miniaturization of microfluidic chips are the major drivers for this market. The polymers market commands the largest share of the microfluidics materials market in 2013 and is expected to grow at a healthy CAGR of more than 20% during the study period. The growth in the adoption rate of polymers by manufacturers, which is driven by favorable properties of polymers such as enhanced mechanical strength, optical transparency, chemical stability, biocompatibility, reduced costs, enhanced profit margins, and extended applications, is the major driver for this market.

The in-vitro diagnostics segment of the microfluidic products market commands the largest share and is expected to grow at a healthy CAGR in the next five years. The large share of this segment can be attributed to the increased adoption of microfluidics in IVD by major diagnostic companies such as Roche Diagnostics (Switzerland), Becton Dickinson and Company (U.S.), Abbott Laboratories (U.S.), and Cepheid (U.S.). The various advantages offered by microfluidics are reduced reagent consumption, quick analysis, and enhanced accuracy of test results. The microfluidics clinical diagnostics market within the IVD segment is estimated to witness the strongest growth from 2013 to 2018. Enhanced applications in diagnostics such as microfluidic flow cytometry and cell surface markers are driving the growth of this market.

The drug delivery devices market is expected to grow at the highest CAGR during the study period. The increasing use of microneedles and micropumps driven by the enhanced efficacy of drug delivery are the significant drivers of the market growth. Micro pumps offer various advantages such as low sample consumption, which leads to cost reduction. This is one of the major factors driving the growth of this market. The micropumps market within the drug delivery devices segment is estimated to grow at the highest CAGR from 2013 to 2018.

The Point-of-Care diagnostics applications segment accounts for the largest share of the microfluidics applications market in 2013 and is expected to grow at a CAGR of more than 20% during the study period. A number of factors such as the growing demand for carrying out medical tests at or near the site of patient care in hospitals or at home, low consumption of samples and reagents, miniaturization of devices, and faster time of analysis are driving the growth of the POC diagnostics market.

North America accounts for the largest share of the global microfluidics market in 2013. However, the Asian region is expected to grow at a higher CAGR in the forecast period. A number of factors such as lower labor and raw material costs, and growth in investments due to favorable economic conditions (especially in China and India) are responsible for the high growth of the microfluidics market in Asia.

Major players in the microfluidics market include Abbott Laboratories (U.S.), Agilent Technologies (U.S.), Caliper Life Sciences (PerkinElmer) (U.S.), Cepheid (U.S.), Danaher Corporation (U.S.), Life Technologies Corporation (U.S.), and Roche Diagnostics (Germany). A majority of companies in the microfluidics market are from the U.S.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report:  Microfluidics Market By Materials, Pharmaceuticals, Drug Delivery Devices, IVD – Global Trends & Forecast to 2018.

Microfluidics Market worth $3.5 Billion by 2018

New IPC Standards For Printed Circuit Boards

NEW IPC-A-610F Acceptability of Electronic Assemblies

IPC-A-610 is the most widely used standard for circuit board production in the world. IPC-A-610F illustrates acceptability requirements for electronic assemblies with over 814 colour images and illustrations. Topics include flex attachment, board in board, part on part, lead free, component orientation and soldering criteria for through-hole, SMT (new termination styles) and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements. This revision F includes two new SMT termination styles, and changes in plated-through hole fill and BGA void criteria. Major topics include flex attachment, board-in-board, part-on-part, both lead-free and tin-lead criteria, component orientation and soldering criteria for through hole, SMT, cleaning, marking, coating and laminate requirements. IPC Standards for printed circuit boards: order and download IPC A-610F

IPC-A-610 is invaluable for all inspectors, operators and trainers. Revision F has 814 photos and illustrations of acceptability criteria — 86 of them new or updated. The document is most often used with the material and process standard IPC J-STD-001.

NEW J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies

J-STD-001F is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for both traditional solder alloys and for lead-free manufacturing. Revision to plated-through hole, PTH, minimum fill requirements; criteria for two new SMT termination types; and expanded conformal coating criteria. Clarification of criteria descriptions for easier understanding. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity. This standard fully complements IPC-A-610F and is supported by IPC-HDBK-001. Order and  download IPC J-STD-001F

IPC-7527 Requirements for Solder Paste Printing

IPC-7527 covers the many aspects of solder paste application, from initial placement on the board through production and testing. To equipment operators, the new standard serves as a reference guide with more than 50 photos packed into the 15-page standard.  IPC-7527 provides the operators with a standard that will help them make the right decisions when they face issues in production, and no professionals or specialists are present.

While there are standards that detail what a completed assembly should look like, IPC-7527 is the first one to provide requirements for what the printed solder paste should look like and how far off centers can be before they’re considered defects. It covers everything from basic squeegees to jet dispensers and needle dispensers to closed print heads. In addition, IPC-7527 provides information on automated paste inspection using either cameras or lasers. Order and download IPC-7527.

IPC-7093 Design and Assembly Process Implementation for Bottom Termination components

This standard describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body. The BTCs in this document include all types and forms of bottom-only termination components intended for surface mounting. This includes such industry descriptive nomenclature as QFN, DFN, SON, LGA, MLP and MLF. The focus of the information is on critical design, assembly, inspection, repair, and reliability issues associated with BTCs.

The target audiences for this document are managers, design and process engineers, and operators and technicians who deal with the electronic design, assembly, inspection and repair processes. The intent is to provide useful and practical information to those companies who are using or considering tin/lead, lead free, adhesives or other forms of interconnection processes for assembly of BTC type components. Although not a complete recipe, the document identifies many of the characteristics that influence the successful implementation of robust and reliable assembly processes and provides guidance information to component suppliers regarding the issues being faced in the assembly process. Order and  download IPC-7093

IPC-7095C Design and Assembly Process Implementation for BGAs

Implementing ball grid array (BGA) and fine-pitch ball grid array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095C delivers useful and practical information to anyone currently using BGAs or FBGAs. Many issues have become especially important due to the change in the alloys of the ball, the ball shape, and the attachment procedures. The major emphasis of Revision C is to provide information on some of the new mechanical failure issues such as cratering or laminate defects caused after assembly.

In addition to providing guidelines for BGA inspection and repair, IPC-7095C addresses reliability issues and the use of lead-free joint criteria associated with BGAs. There are many photographs of X-ray and endoscope illustrations to identify some of the conditions that the industry is experiencing in the implementation of BGA assembly processes. Order and download IPC-7095C

IPC-7711/7721B Rework, Modification and Repair of Electronic Assemblies

This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. Order and download IPC-7711/7721B.

Purchase and Download IPC Standards For Printed Circuit Boards from Electronics.ca Publications today!

Effective January 1, 2015, a price increase of 4 percent will be implemented on all standards.

 

New IPC Standards For Printed Circuit Boards

The U.S. UAV Market Will Grow to $15 Billion in 2020

“UAV Market Research Study” will assess the size and growth of the total Unmanned Aerial Vehicle market from large DOD UAVs to Do-it-Yourself (DIY) UAVs for amateurs. The study covers the following major market sectors: DOD, Civil, Commercial, Small Unmanned Aircraft Systems (SUAS) , DIY Amateur, and Radio Control. According to this report, the U.S. market will grow from $5 billion in 2013 to $15 billion in 2020. This market will be driven by growth in the commercial and Do-it-Yourself markets.

Major commercial UAV applications are agriculture, real estate, film-making, oil and pipeline, electric utility, and specialized package delivery. There will be a significant growth in 2015 after the FAA decision on UAV Access to the National Airspace.

This UAV market research report is also a marketing guide for subsystem, components, and other companies unfamiliar with the UAV market. It has been written for the companies in the field and those thinking of entering the field.

UAV Market Research Study – 2014 Edition

Unmanned Aerial Vehicle – UAV Market Research Study

Order the “UAV Market Research Study” by the end of July 31st, 2014 to receive 20% discount.  Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report:  UAV Market Research Study – 2014 Edition.

 

 

 

 

 

Table of Contents:

• Introduction


• Historical Developments of UAVs


• Market Description
  
  • Defense
  
  
  • Civil (NASA, Agriculture, NOAA, Homeland Security, Border Control, etc.)
  
  
  • Commercial
  
  
  • SUAS
  
  
  • Do-it-Yourself (DIY) Amateur
  
  
  • Radio Control
  
  


• Market Data


• Market Forecasts


• Regulations
  
  • FAA UAS Roadmap
  
  
  • FAA Test Facilities
  
  
  • Centers of Excellence
  
  
  • Foreign Civil Air Authorities
  
  


• Technology
  
  • Sense and Avoid (SAA)
  
  
  • ISR
  
  
  • Structural Sensing
  
  
  • Propulsion
  
  
  • Autonomy
  
  
  • Ground Stations
  
  
  • Radio Spectrum
  
  


• Standards


• Applications
  
  • Agriculture
  
  
  • Law Enforcement
  
  
  • Real Estate
  
  
  • Filmmaking
  
  
  • Oil and Pipeline
  
  
  • Electric Utilities
  
  
  • Package Delivery
  
  
  • Search and Rescue
  
  
  • Fire Detection and Monitoring
  
  
  • Environmental Monitoring
  
  


• Associations
  
  • AUVSI
  
  
  • AMA
  
  
  • HMA
  
  


• Test Facilities


• Systems Supplier Profiles


• Major Unmanned Vehicle Road Maps


• Acronyms

The U.S. UAV Market Will Grow to $15 Billion in 2020

Global Market for Optical Network Semiconductor Components to Reach $7.6 Billion in 2019

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Optical Network Components: Global Markets”.  This study reveals that the ongoing migration from lower speed to higher speed connections is providing optical network component suppliers with a recurring revenue stream. Optical network semiconductors will witness an increase from $6.4 billion in 2014 to $7.6 billion in 2019, registering a 3.2% rise in compound annual growth rate (CAGR). The result is that optic components will continue to be an area of prime interest to silicon suppliers.

Advances in wafer and silicon technology have enabled chip manufacturers to squeeze complex functions onto much smaller spaces. They have also been able to put increased functionality into these chips. As a result, optical components continue to be an area of prime interest for semiconductor suppliers. These new semiconductors offer users a number of benefits— more functionality, simpler deployment, and support for higher speed.

Businesses and individuals have developed new applications to take advantage of high-speed, multimedia-friendly transmissions. In the healthcare industry, high-speed optical connections are dramatically improving patient care. Medical imaging is becoming more granular and new applications are emerging. In the data center, optic connections are altering the design of IT systems. Consolidated systems are becoming more common and cloud computing will gain demand.

GLOBAL OPTICAL MARKET SEGMENT REVENUES, 2013-2019 ($ MILLIONS)

Optical Network Components: Global Markets analyzes and forecasts market trends in each segment of the optical semiconductor market, delineates technology trends, and identifies market leaders. Forecasts are presented for user requirements, current buying patterns, and expenditure trends from 2014 through the year 2019.

 

 

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: Optical Network Components: Global Markets.

Optical Network Semiconductor Components Market – Partial List of Tables

Table 1 : IP TRAFFIC PER MONTH, THROUGH 2018

Table 2 : IP TRAFFIC BY MARKET SEGMENT PER MONTH, THROUGH 2018

Table 3 : PER PORT WLAN PRICING TRENDS, THROUGH 2019

Table 4 : FORECAST FOR MARKET SHARE OF OPTICAL COMPONENTS BY CATEGORY, 2014 AND 2019

Table 5 : FORECAST FOR GLOBAL MARKET FOR OPTICAL COMPONENTS BY PRICE AND REVENUE, THROUGH 2019

Table 6 : TOP FIVE OPTICAL COMPONENT SUPPLIERS, 2019

Table 7 : NUMBER OF INTERNET USERS WORLDWIDE, 1993 TO 2014

Table 8 : GLOBAL INTERNET BACKBONE TRAFFIC PATTERNS, 1990-2014

Table 9 : INTERNET USAGE STATISTICS BY WORLD REGION, 2012

Table 10 : WIRELESS USAGE PATTERNS BY TYPE, 2014

Table 11 : CELLULAR NETWORK SUBSCRIBER GROWTH, 2010-2014

Table 12 : TOP TEN WIRELESS CARRIERS BY NUMBER OF SUBSCRIBERS, 2014

Table 13 : SONET/SDH DATA RATES AND LINE SPEEDS

Table 14 : STRUCTURE OF AN ATM CELL

Table 15 : GLOBAL MARKET FORECAST FOR TELECOMMUNICATIONS OPTICAL COMPONENTS, THROUGH 2019

Table 16 : TOP FIVE TELECOMMUNICATIONS OPTICAL COMPONENTS SUPPLIERS, 2014

Table 17 : GLOBAL MARKET FORECAST FOR 100G TELECOMMUNICATIONS OPTICAL COMPONENTS, THROUGH 2019

Global Market for Optical Network Semiconductor Components to Reach $7.6 Billion in 2019