Friday, June 5, 2015

Flexible, Organic and Printed Electronics Market Forecast

New market research report, entitled Printed, Organic & Flexible Electronics: Forecasts, Players & Opportunities, provides the most comprehensive view of the topic, giving detailed ten year forecasts by device type. The market is analyzed by territory, printed vs non printed, rigid vs flexible, inorganic vs organic, cost of materials vs process cost and much more, with over 160 tables and figures. Activities of over 1,000 leading companies are given, as is assessment of the winners and losers to come.


The total market for Flexible, Organic and printed electronics will be worth over $70 billion by 2024. The majority of that is OLEDs (organic but not printed) and conductive ink used for a wide range of applications. On the other hand, stretchable electronics, logic and memory, thin film sensors are much smaller segments but with huge growth potential as they emerge from R&D.


Flexible, organic and printed electronics market forecast by component type in US$ billions*



Source: IDTechEx * For the full forecast data please purchase this report


The following components are assessed, and for each one ten year forecasts are given, along with companies and their activities, case studies, impediments to commercialization and timescales:


  • Logic and memory

  • OLED displays

  • OLED lighting

  • Electrophoretic and other bistable displays

  • Electrochromic displays

  • Electroluminescent displays

  • Other displays

  • Thin film batteries

  • Photovoltaics

  • Sensors

  • Conductors

  • Other



If you are looking to understand the big picture, the opportunity, the problems you can address, or how you can start to use these technologies and the implications involved, this report is a must.  Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site: Printed, Organic & Flexible Electronics: Forecasts, Players & Opportunities





Partial list of tables:


 1. Description and analysis of the main technology components of printed and potentially printed electronics

1.2. Current opportunity, market size and profitability

1.3. Market forecast by component type for 2015-2025 in US $ billions, for printed and potentially printed electronics including organic, inorganic and composites

1.4. The different states of readiness of organic and inorganic electronic technologies (semiconductors and conductors)

1.5. Spend on organic versus inorganic materials 2015-2025 US$ billion

1.6. Split of material types by component

1.7. Market value $ billions of only printed electronics 2015-2025

1.8. Total market value of printed versus non-printed electronics 2015-2025 US$ billion

1.9. Market value $ billions of only flexible/conformal electronics 2015-2025

1.10. Total market value of flexible/conformal versus rigid electronics 2015-2025 in US$ billion

1.11. The market for printed and potentially printed electronics by territory in $ billion 2015-2025

1.12. Possible breakdown of the market for printed and potentially printed electronics in 2035 by numbers and value

1.13. Success and failures

2.1. Market forecasts for 2035 in US$ billion

2.2. End user markets relevant to printed electronics

2.3. Leading market drivers 2025

2.4. Some potential benefits of printed and partly printed organic and inorganic electronics and electrics over conventional devices and non-electronic printing in various applications

2.5. Types of printed/thin film photovoltaics beyond silicon compared, with examples of suppliers

2.6. Primary assumptions of organic electronics in full production 2013-2035

3.1. Global market for printed electronics logic and memory 2015-2025 in billions of dollars, with % printed and % flexible



Flexible, Organic and Printed Electronics Market Forecast

Distributed Fiber Optic Sensor Market

The distributed fiber optic sensor market stood at $585 million in 2013. The market is projected to be $1.458 billion in 2018 with 70% associated with the oil and gas segments, according to a recent market survey report conducted by the Photonic Sensor Consortium.


The Photonics Sensor Consortium in conjunction with Light Wave Venture was started in 2003 as an independent organization to assist in the market development and commercialization of photonic sensor technology. The primary focus has been on distributed fiber optic sensors. Over the last 11years, the Consortium has tracked the market and provided overall projections and market analysis for active participants. This report is the first to be available to the general photonics industry.


Photonic Sensor Consortium Market Report


Why is there such a strong interest in this technology? Fiber optic sensors represent a technology base that can be applied to a multitude of sensing applications. There are several characteristic advantages of fiber optics that make their use especially attractive for sensors:


  • Nonelectrical

  • Explosion-proof

  • Small size and weight

  • Allow access into normally inaccessible areas and harsh environments

  • Immune to radio frequency interference (RFI) and electro-magnetic interference (EMI)

  • Solid-state reliability

  • High accuracy

  • Can facilitate distributed sensing

Most physical properties can be sensed optically with fibers. Light intensity, displacement (position), temperature, pressure, rotation, sound, strain, magnetic field, electric field, radiation, flow, liquid level, chemical analysis, and vibration are just some of the phenomena that can be sensed.


Fiber optic sensors have been used successfully for many years in military gyroscopes and hydrophones. However, their use in smart oil wells has been the key to enabling North America to be on a path to energy independence.


Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report2014 Photonic Sensor Consortium Market Survey Report.


 



Distributed Fiber Optic Sensor Market

Wednesday, June 3, 2015

Wireless M2M & IoT Market Opportunities Report

Global spending on wireless M2M technology is expected to reach nearly $200 Billion by the end of 2014. Despite its low ARPU, the wireless M2M market has become a key focus of many mobile network operators as their traditional voice and data markets become saturated. Likewise, government and regulatory initiatives such as the EU initiatives to have a smart meter penetration level of 80% by 2020 and the mandatory inclusion of automotive safety systems such as eCall in all new car models, have also helped to drive overall wireless M2M connections and revenue.


By enabling network connectivity among physical objects, M2M has initiated the vision of the Internet of Things (IoT) – a global network of sensors, equipment, appliances, computing devices, and other objects that can communicate in real time. This gives rise of a multitude of application possibilities including but not limited to location tracking, diagnostics, process automation, remote monitoring/control and even entertainment. Given the vast array of M2M and IoT applications, the industry has attracted attention from a multitude of vertical market segments.


Consequently we expect the wireless M2M market to account for $196 Billion in revenue by the end of 2020, following a CAGR of 21% during the six year period between 2014 and 2020. Eyeing this lucrative opportunity, vendors and service providers across the highly fragmented M2M value chain have become increasing innovative in their strategies and technology offerings which have given rise to a number of submarkets such as M2M network security, Connected Device Platforms (CDP) and M2M application platforms.


The “The Wireless M2M & IoT Bible: 2014 – 2020″ report presents an in-depth assessment of the global wireless M2M market.  In addition to covering the business case, the challenges, the industry’€™s roadmap, value chain analysis, deployment case studies, and the vertical market ecosystem, vendor service/product strategies and strategic recommendations, the report also presents comprehensive forecasts for the wireless M2M market from 2014 till 2020, including an individual assessment of the following submarkets: Network Connectivity, Application Services, Embedded Cellular M2M Modules, Network Security, Connected Device Platforms (CDP), Application Platforms (Application Enablement Platforms, AEP and Application Development Platforms, ADP), Integration Services and Enabling Technologies. The forecasts and historical revenue figures are individually segmented for eight vertical markets, Eight air interface technologies, six geographical regions and 53 countries.


Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: The Wireless M2M & IoT Bible: 2014-2020 – Opportunities, Challenges, Strategies, Industry Verticals and Forecasts.


 



Wireless M2M & IoT Market Opportunities Report

Electronic Adhesives Market Analysis

The global electronic adhesives market demand, in terms of volume, is estimated to reach 1,800 KT by 2019. The electronic adhesives are used in the manufacture and assembly of electronic components and products. They are mostly used in bonding the surface-mount components, wire tacking, and encapsulating components. The printed circuit boards (PCB) also use adhesive materials as conformal coatings. The most popular chemistries used in electronic adhesives are epoxies, silicones, polyurethanes, polysulfides, and cyanoacrylates.


The electronic adhesives market is anticipated to show high growth rate in the coming years. The market is technology-driven and there will be investments for the development of new technology and products. The electronic adhesives market is a part of electronic chemicals and materials industry, which is moving towards consolidation as the major electronic chemicals and materials companies are acquiring other local and foreign players.


Currently, the electronic adhesives market is mainly concentrated in the Asia-Pacific region, followed by North America and Europe. The market in Asia-Pacific is estimated to grow at a high rate in the future.


The companies offering electronic adhesives are mainly involved in acquisitions. They rigorously follow the acquisition strategy to strengthen their position in the electronic adhesives market. The acquired player is sometimes a small player in a new market or a player with high technical expertise. In some cases, the companies have also acquired a relevant product line from another company.


Expansion and new product development were the next preferred growth strategies that accounted for 20% each of the total share of development activities undertaken by electronic adhesives participants. Expansion is preferred mostly by the first tier companies.


Electronic Adhesives Market SharesThe report analyzes the market on the basis of material types, penetration of electronic adhesives in important regions, and every important end-user market. It also covers the market behaviour of leading producers, key developments, and strategies implemented to sustain and increase the market shares of the companies.


Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report:  Electronic Adhesives Market by Type, Form, Application and Geography – Regional Trends & Forecast to 2019.


 



Electronic Adhesives Market Analysis

Monday, June 1, 2015

Radio Chip for the “Internet of things”

Circuit that reduces power leakage when transmitters are idle could greatly extend battery life


At this year’s Consumer Electronics Show in Las Vegas, the big theme was the “Internet of things” — the idea that everything in the human environment, from kitchen appliances to industrial equipment, could be equipped with sensors and processors that can exchange data, helping with maintenance and the coordination of tasks.


Realizing that vision, however, requires transmitters that are powerful enough to broadcast to devices dozens of yards away but energy-efficient enough to last for months — or even to harvest energy from heat or mechanical vibrations.


“A key challenge is designing these circuits with extremely low standby power, because most of these devices are just sitting idling, waiting for some event to trigger a communication,” explains Anantha Chandrakasan, the Joseph F. and Nancy P. Keithley Professor in Electrical Engineering at MIT. “When it’s on, you want to be as efficient as possible, and when it’s off, you want to really cut off the off-state power, the leakage power.”


This week, at the Institute of Electrical and Electronics Engineers’ International Solid-State Circuits Conference, Chandrakasan’s group will present a new transmitter design that reduces off-state leakage 100-fold. At the same time, it provides adequate power for Bluetooth transmission, or for the even longer-range 802.15.4 wireless-communication protocol.


“The trick is that we borrow techniques that we use to reduce the leakage power in digital circuits,” Chandrakasan explains. The basic element of a digital circuit is a transistor, in which two electrical leads are connected by a semiconducting material, such as silicon. In their native states, semiconductors are not particularly good conductors. But in a transistor, the semiconductor has a second wire sitting on top of it, which runs perpendicularly to the electrical leads. Sending a positive charge through this wire — known as the gate — draws electrons toward it. The concentration of electrons creates a bridge that current can cross between the leads.


But while semiconductors are not naturally very good conductors, neither are they perfect insulators. Even when no charge is applied to the gate, some current still leaks across the transistor. It’s not much, but over time, it can make a big difference in the battery life of a device that spends most of its time sitting idle.


Going negative


Chandrakasan — along with Arun Paidimarri, an MIT graduate student in electrical engineering and computer science and first author on the paper, and Nathan Ickes, a research scientist in Chandrakasan’s lab — reduces the leakage by applying a negative charge to the gate when the transmitter is idle. That drives electrons away from the electrical leads, making the semiconductor a much better insulator.


Of course, that strategy works only if generating the negative charge consumes less energy than the circuit would otherwise lose to leakage. In tests conducted on a prototype chip fabricated through the Taiwan Semiconductor Manufacturing Company’s research program, the MIT researchers found that their circuit spent only 20 picowatts of power to save 10,000 picowatts in leakage.


To generate the negative charge efficiently, the MIT researchers use a circuit known as a charge pump, which is a small network of capacitors — electronic components that can store charge — and switches. When the charge pump is exposed to the voltage that drives the chip, charge builds up in one of the capacitors. Throwing one of the switches connects the positive end of the capacitor to the ground, causing a current to flow out the other end. This process is repeated over and over. The only real power drain comes from throwing the switch, which happens about 15 times a second.


Turned on


To make the transmitter more efficient when it’s active, the researchers adopted techniques that have long been a feature of work in Chandrakasan’s group. Ordinarily, the frequency at which a transmitter can broadcast is a function of its voltage. But the MIT researchers decomposed the problem of generating an electromagnetic signal into discrete steps, only some of which require higher voltages. For those steps, the circuit uses capacitors and inductors to increase voltage locally. That keeps the overall voltage of the circuit down, while still enabling high-frequency transmissions.


What those efficiencies mean for battery life depends on how frequently the transmitter is operational. But if it can get away with broadcasting only every hour or so, the researchers’ circuit can reduce power consumption 100-fold.


This research was funded by Shell and Texas Instruments.


###


Written by Larry Hardesty, MIT News Office


Related links


Wireless Charging Technology: Receiver and Transmitter ICs Worldwide Forecasts




Radio Chip for the “Internet of things”

IPC-CH-65B Electronics Assembly & PCB Cleaning Guidelines

It’s well-known that residues on printed board assemblies can lead to serious reliability problems. Over the past several years the migration from the use of lead-bearing materials to lead-free materials has resulted in many changes in electronics manufacturing operations. Some of the residual materials that remain on the circuit card assembly are becoming increasingly more problematic to clean. Component densities and component under-clearances are creating new cleaning challenges. To help the process engineering community deal with these difficulties, IPC has released the B revision of IPC-CH-65, Guidelines for Cleaning of Printed Boards & Assemblies. 


With guidance from industry experts, the cleaning guidelines have been completely rewritten and address all facets of cleaning, including material selection, process considerations, equipment selection as well as the environmental impact of cleaning. The 200-page document not only brings cleaning requirements up to date, it also combines multiple documents into a single, comprehensive guideline. IPC-CH-65B explains the interactions between materials and processes and outlines the sources and types of contamination found on today’s circuit card assemblies.


The cleaning of printed boards and assemblies has undergone a significant transformation in two decades, due in large part to environmental regulations which are cross-referenced in the document. No-clean fluxes and lead-free solder are among the technical mainstays. “Years ago a large portion of the electronics industry moved from solvent-based cleaning to water-based cleaning. Over the past few years we have seen another shift to the use of lead-free materials and processes. The combination of these events led to the development of the new guideline,” explains Dave Torp, vice president of standards and technology at IPC. He adds that, with the shift to lead-free solder, “reflow temperatures increased, which has impacted the character of residues that remain on the assemblies.”


The update of IPC CH-65B was a huge undertaking that could not have been done without the help and expertise from a great many volunteers, IPC-CH-65B’s developers are continuing their work to expand the document’s focus to address cleaning for rework and repair.


IPC-CH-65B Electronics Assembly & PCB Cleaning Guidelines

IPC-CH-65B


Details of the IPC-CH-65B, table of contents and ordering information can be found on Electronics.ca Publications’ web site. Purchase and download  IPC-CH-65B PDF today.


 


 



IPC-CH-65B Electronics Assembly & PCB Cleaning Guidelines

Global G.fast Chips Market Shares, Strategies, and Forecasts

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “G-fast Chips: Market Shares, Strategies, and Forecasts, Worldwide, 2014 to 2020″. This 2014 g.fast chips market report has 256 pages, is supported with 109 tables & figures. Worldwide G.fast Chip markets are increasingly diversified, poised to achieve significant growth as broadband is used in every industry segment. G.fast is able to make the benefits of broadband available to consumers and support network flexibility for consumers, data centers, and cell tower backbone communications.


G.fast networks are flexible and support broadband that is able to reach. According to the lead author of the team that prepared this research, “The opportunity to participate in G.fast Chips markets is compelling. G.fast provides the ability to leverage outdated copper infrastructure to breathe new life into existing investment. This market is evolving as new G.fast technology and vectoring are implemented. Growth in this market based on technical breakthroughs and innovation. Technology platforms are rapidly evolving.”


End to end broadband networks leverage a combination of optical infrastructure in the long haul and copper infrastructure in the last few meters from the distribution box to the home. Fiber has had rapid advance but does not work in the end, it is too expensive to the home. FTTH is too expensive and DSL continues to be a viable alternative, with DSL set to be replaced at the high end initially by G.fast. Copper based broadband technologies promise to last for a long long time. Though for many years FTTH has threatened to make xDSL obsolete, this has not proven to be the case.


Broadband Internet is used in all corners of the world. It is set to be used by everyone by 2025. There is a lot left to be done. Networking Services Company Akamai says the second quarter of 2014 marks the first time the global average broadband speed jumped over the 4-megabit mark. South Korea occupies the top broadband user category in both average bandwidth (24.6 megabits) and proportion of the population on a broadband connection (95 percent, tied with Bulgaria). Smaller islands, the Philippines, countries with lots of rural areas, like India, are struggling to deliver useful speeds.


The U.S. falls behind East Asia, ranking somewhere in the middle, with the Nordic countries, in terms of broadband speed and penetration. Inside the U.S., Delaware appears well equipped with broadband – the Mid-Atlantic state ranked first in every category: average speed, peak speed, connectivity and even “4K readiness,” referring to the 15 megabit speed that can handle ultra-high-def broadcasts. The slowest US state is Arkansas.


Companies discussed in the 2014-2020 g fast chips market report include Analog Devices, Arris, Broadcom, BroadLight, Cavium, Freescale Semiconductor, Ikanos, Infineon Technologies, IXYS Integrated Circuits Division, Lantiq, Marvell, MediaTek / Ralink Technology, PMC-Sierra, Pulse, Sckipio, Shantou New Tideshine Electron, Shenzhen Chaoyue Electronics Co., Ltd., Shenzhen Sky Foundation, Shenzhen Tianxiaowei Electronics Co., Ltd. and ZTE.


Copper represents an installed infrastructure worth trillions and too expensive to just replace. Fiber is too expensive to use it to replace all the copper. FTTH DSL and G.fast, the copper works in many cases and does not need to be re3placed. xDSL markets will be strong for some long time to come as copper remains a transport line.


G.fast leverages copper infrastructure that is everywhere in the telecommunications network. Copper provide connectivity to all residences. Copper is still the primary wireless backbone transport means, meaning it continues to be vital as new wireless systems continue to expand their markets. It predominates in the local loop, creating demand for systems that are able to support high speed signal transport over copper wire.


Copper based broadband is and will remain for the foreseeable future, the dominant broadband access technology across the globe. Broadband service providers who rely on copper loops for broadband access have to improve broadband performance and extend its life. Choices between DSL technologies and G.fast are based on cost. Fiber technologies are used to come to the curb. DSL and G.fast represent a hybrid rooted in a network planning.


G.fast Chips Market

G.fast Chips Market Shares


Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: G.fast Chips Market Shares, Strategies, and Forecasts, Worldwide, 2014 to 2020.






 


 



 


Partial List of Tables and Figures provided in G.fast Chips Market Shares, Strategies, and Forecasts, Worldwide, 2014 to 2020 research report include:


Table ES-1 25 G.Fast Chip Market Driving Forces 25


Table ES-2 26 Vendor G.Fast Competitive Positioning Factors 26


Figure 2-17 87 DSL and G.fast Copper Infrastructure Subscriber Forecasts, Number, Worldwide, 2014-2020 87


Figure 2-18 88 G.fast Copper Infrastructure Subscriber Forecasts, Number, Worldwide, 2014-2020 88


Table 2-19 90 Broadband G.fast, DSL, Cable Modem, Wireless Device, and Fiber to the Home Subscribers Worldwide, 2014-2020 90


Table 2-20 95 Ethernet Market Aspects 95


Figure 2-21 96 Explosion of Protocols 96


Figure 2-22 98 Broadband Services Typical Speed in Mbps 98


Table 2-23 99 Broadband Fiber Cost Per Household to Build Out 99


Table 2-24 100 DSL Chip Applications 100


Figure 2-25 102 DSL Regional Market Segments, 2013 102


Table 2-26 103 DSL Regional Market Segments, 2013 103


Table 2-27 107 DSL Component Shipments by Vendor by Region Dollars, Worldwide, 2013 107


Figure 3-1 110 FTTH vs. G.Fast Costs for Services Providers 110


Figure 3-2 113 Lantiq G.fast 113


Table 3- 114 Key Features of the Lantiq EASY330 G.Fast Reference Board 114


Table 3- 119 Broadcom BCM65200/900 Family Key Features 119


Figure 3- 122 Simulation of G.fast Rates Over 100-Meter Lines Gives 1.3 Gbit/s by Controlling Ccrosstalk 122


Figure 3-12 127 Ikanos 496pix_Velocity_Chipset2 127


Table 3-33 132 Google Addresses DSL Vectoring 132


Figure 4-1 136 Network Configurations 136


Figure 4-2 137 Innovation In Copper Supports Fiber to Curb Rollout Leveraging Endpoints Using G.fast 137


Figure 4-3 139 G.fast Vectoring 139


Figure 4-4 141 Fiber to the Distribution Point Architecture 141


Figure 4-5 144 Typical DSL Downstream Broadband Capability 144


Figure 4-6 150 G.fast Copper Network Solution 150


Figure 4-7 153 Broadband Services Typical Speed in Mbps 153


Table 4-8 158 Ikanos NodeScale Vectoring Product Key Features 158


Table 4-9 159 Ikanos Quality Video (iQV) technology Key Features 159


Table 5-9 189 Analog Devices Consumer Segment Products 189


Table 5-10 190 Analog Devices Communications Segment Systems 190


Table 5-11 191 Analog Devices Revenue by Regiion 191


Table 5-12 197 Broadcom Broadband Communications Solutions 197


Figure 5- 198 Broadcom Communications Positioning 198


Table 5-13 200 Broadcom Customers and Strategic Relationships 200


Table 5-14 215 Ikanos Product Lines 215


Table 5-15 220 Ikanos Works Directly With Various Major Service Providers 220


Figure 5-16 233 MediaTek Revenue 233


Table 5-17 235 MediaTek Industry Leadership 235


Figure 5-18 236 MediaTek Product Portfolio 236


 



Global G.fast Chips Market Shares, Strategies, and Forecasts