Silicon Photonics Market Analysis by Products, Applications & Geography - Analysis & Forecast

Silicon Photonics is a relatively new technology which uses optical rays in order to transfer data between different computer chips and peripherals. This report covers particularly the markets for final products, devices and equipment that function on Silicon Photonics technology for six major application verticals namely: Telecommunications, Data communication, displays and consumer electronics, sensing, metrology, high performance computing and medicines. Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: Silicon Photonics Market Analysis by Products, Applications  & Geography – Analysis & Forecast.

In the last decade, the average cost of traditional microelectronics based optical has almost continuously increased. This has led to the gradual rise of Silicon Photonics as a solution to counter these operating cost and performance problems. Silicon Photonics technology will significantly reduce the costs associated with the components such as optical modulators, optical waveguides, attenuators and others. Silicon Photonics components substantially improve the data transfer speed in optical communication applications. Silicon Photonics based optical components consume lower power than the modulators, switches and others used in the existing optical communication networks.

A silicon Photonics wavelength division multiplexer filters t are expected to use extensively in coming future, as these devices are one of the major components used in ever growing telecom and Datacom application sectors. These products will be followed by silicon modulators and interconnects due their potential use in long haul optical networks

The Datacom application sector is expected to grow as big as the telecom sector because silicon Photonics has potential to satisfy needs of high performance computing and higher data transfer rates required for Datacom applications. Market penetration of silicon Photonics products in telecom and Datacom application sector will be high in the coming seven years.

This report describes the market trends, drivers, and challenges of the hardware encryption market and forecasts the market till 2018, based on applications, verticals, products, and geography. It covers geographies like the North America, Europe, APAC, and ROW (Rest of the World).

The figure below shows the life-cycle analysis of the various silicon Photonics application sectors based on factors like the time-to-market and the key features of the products in the different application sectors.

Silicon Photonics Application Life-Cycle Analysis

Silicon Photonics Market Analysis

The figure above shows in detail the short-term, medium-term and long-term applications for silicon photonics products, against the different features of the products for each applications. Datacom application revenue will dwarf all the other sectors in the coming future. The low-power consuming feature and the high data transfer rate capabilities achieved using silicon photonics are the main reason for the growth in the Datacom sector in the near future.

In applications like Telecom (Long-haul and Metro/LAN applications), Bio-medical sensors, Fiber-to-the-home (FTTH) and others, the major advantage of using silicon photonics will be the durability of the products as compared to the current conventional substitutes. Thus these applications will emerge in the medium-term (5-7 years).

In the long-term (beyond 10 years), silicon photonics is expected to become a default component of digital communication at the chip-level and board-level. These will open up doors to high volume of production and sales in the future.  To purchase this report please visit: http://www.electronics.ca/store/silicon-photonics-market-report.html

Silicon Photonics Market Analysis by Products, Applications & Geography - Analysis & Forecast

Quantum Dots Market worth $3,414.54 Million by 2020

ELECTRONICS.CA PUBLICATIONS, the electronics industry market research  and knowledge network, announces the availability of a new report entitled “Quantum Dots Market by Product, Application, Material, and Geography – Forecast & Analysis 2013-2020″,  which focuses on advanced technology, current trends, & opportunities.  The total market for Quantum dots is expected to reach $3,414.54 million in 2020, at a CAGR of 71.13% from 2014 to 2020.

Quantum Dots (QD) is the most advanced area of “semiconductor nanoparticles”, Wherein a host of massive research activities are being undertaken, currently. QDs are semiconductor nanoparticles, and, as the name suggests, come in sizes ranging from 2 nm to 10 nm. Due to their miniature property; they are highly versatile and flexible. The uniqueness of QD material lays in the fact that its power intensity depends on the input source and size of QD. There are several ways to confine excitons in semiconductors, resulting in different methods to produce quantum dots. In general, quantum wires, wells, and dots are grown by advanced epitaxial techniques in nanocrystals produced by chemical methods or by ion implantation, or in nanodevices created from state-of-the-art lithographic techniques.

The QD market is expected to grow from $108.41 million that it accounts for, currently, in 2013 to $3,414.54 million in 2020, at a CAGR of 71.13% from 2014 to 2020. Optoelectronics application is expected to be the major market share holder with an expected revenue generation of $2,458.47 million in 2020.

Healthcare industry is one of the key areas of QD technology. There are numerous applications in the biomedical and biotechnology field that are already being exposed to QD technology and; hence, it accounts for the largest percentage of the QD market, on the whole. Applications in biomedical and biotechnology fields are expected to increase as and when the technology progresses.

Healthcare industry is one of the key areas of QD technology. There are numerous applications in the biomedical and biotechnology field that are already being exposed to QD technology and; hence, it accounts for the largest percentage of the QD market, on the whole. Applications in biomedical and biotechnology fields are expected to increase as and when the technology progresses.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: “Quantum Dots Market by Product, Application, Material, and Geography – Forecast & Analysis 2013-2020“.

Quantum Dots Market worth $3,414.54 Million by 2020

Global Semiconductor Market Continues To Revive In 2014

In the wake of softening market demand in 2012, the global semiconductor market demand resumed in 2013. Despite the still-lukewarm macroeconomic conditions and noticeable declines in the demand for personal PCs, the worldwide semiconductor market still witnessed 3.3% year-on-year growth in 2013, bolstered mainly by the increasing demand for smart handheld devices such as smartphones and tablets.

From a macroeconomic perspective, the global economy is expected to see a slow comeback in 2014. According to statistics by IMF (International Monetary Fund), the global economy is estimated to see a 3.7% year-on-year growth in 2014, compared to just 3% in 2013. This is mainly attributed to growing economy witnessed in some major markets in 2014 such as the United States and Japan, even the euro zone. Emerging markets, though experiencing a slowdown, is expected to see 5.1% year-on-year growth in 2014, in particular China and India, where economic performance in 2014 is expected to outpace that in 2013.

Looking at the downstream demand for ICT products, the decline in personal PC shipments is expected to slow down in 2014 compared to 2013. Smart handheld devices, despite a slowdown in demand, are still expected to see positive shipment growth. Therefore, amid the global economic recovery, sales of smart handheld devices will buoy the global semiconductor market, to see a 4.4% growth in 2014 compared to 2013.

The Global Semiconductor Market Volume, 2009 – 2015

Source: WSTS, compiled by MIC, March 2014

To see more about this report, please visit: The Worldwide and Taiwanese Semiconductor Industry, 2013 Recap and 2014 Forecast.

 

Global Semiconductor Market Continues To Revive In 2014

Semiconductor Automated Test Equipment Business Report

Electronics.ca Publications announces the release of a comprehensive global report on Semiconductor Automated Test Equipment (ATE) markets. Global market for Semiconductor ATE is forecast to reach US$4.3 billion by 2020, spurred by strong chip fabrication activity against a backdrop of growing demand for electronic chips in consumer, industrial, automotive and medical electronics.

Demand for semiconductor ATE is intrinsically linked to the level of semiconductor fabrication activity, which in turn is largely influenced by the health of the global electronics industry. After a major setback during the 2007-2009 recession period, the global semiconductor ATE market made a strong rebound in the year 2010. The recovery soon after was however marred by weak financial climate in Europe and natural calamities in Japan, which disrupted the global supply chain. Rising cost of production, price sensitive end-use markets and the resulting shrinking profit margins accelerated the consolidation trend among semiconductor ATE vendors. Steadily recovering global economic growth, strong gains in manufacturing and PMI performance, are however expected to drive growth in the coming years. Need for additional capacity, as a result of increased outsourcing of fabrication activity, is resulting in increased investments in new fab constructions in Asia, which in turn is expected to drive demand for semiconductor ATE.

Fabrication companies are under constant pressure to employ latest technology to design and manufacture advanced ICs to meet the complexity challenges of silicon chips as they grow in performance in parallel with the Moore’s Law. Semiconductor ATE, under this scenario is assuming increasing importance. The software centric approach to automated testing is expected to emerge as a game changer in the ATE industry, with vendors increasingly using software as a tool for differentiating product offerings. Miniaturization, digitalization and high-speed computing represent trends in the electronics industry which are benefiting the market for semiconductor ATE. Increase in demand for ASICs and NAND flash memory devices as a result of growing adoption of tablet PCs and smartphones, increase in DRAM sales in line with resurgence in demand for PCs also continues to induce strong demand for semiconductors and semiconductor production equipment including ATE.

Boundary Scan (BS) ATE, also known as BS controllers, and functional ATEs are driving growth in the PCB ATE market. The telecom industry is currently a hotbed for innovation, with demand for testing instruments anticipated to rise supported by increased R&D spending on wireless technologies for next-gen solutions. Robust demand for SoCs for use in portable communication devices is additionally anticipated to continue to spur growth in the global semiconductor ATE market. FPGA based DSPs is fast becoming a mainstay for advanced RF Test equipment with user programmable measurement algorithms on FPGA expected to take T&M instruments to the next level. PLX and other on-chip testing technologies are gaining popularity among fabricators across the globe.

As stated by the new market research report on Semiconductor Automated Test Equipment (ATE), Taiwan represents the single largest regional market worldwide. The country also represents one of the fastest growing markets with a CAGR of 7.2% over the analysis period.

Major players covered in the report include Advantest Corporation, Aeroflex Inc., AMC Technology LLC, Astronics Test Systems Inc., Chroma ATE Inc., CREA (Collaudi Elettronici Automatizzati S.r.l.), LTX-Credence Corporation, Marvin Test Solutions Inc., National Instruments Corporation , Roos Instruments Inc., STAr Technologies Inc., and Teradyne Inc.

The research report titled “Semiconductor Automated Test Equipment (ATE): A Global Strategic Business Report” provides a comprehensive review of market trends, growth drivers, technological trends, major challenges, mergers, acquisitions and other strategic industry activities. The report provides market estimates and projections for major geographic markets including the US, Japan, Europe, China, South Korea, Taiwan, and Rest of World.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: “Semiconductor Automated Test Equipment (ATE): A Global Strategic Business Report”.

 

Semiconductor Automated Test Equipment Business Report

Global Market for Transformers to Reach $48.3 Billion in 2019

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Global Markets for Transformers“.  The global transformers market is expected to grow to $48.3 billion by 2019, with a five-year compound annual growth rate (CAGR) of 7.3%.  The Asia-Pacific market, the fastest-growing region of the overall market, is moving at a significant 8.1% CAGR.

Tasked with the regulation of voltage output, transformers are critical to the electricity supply chain. Globally, the demand for this technology is driven by the increasing demand for electricity, replacement of older transformers, and environmental concerns, particularly in India and China.

Indeed, the Asia-Pacific region is the largest and fastest growing segment of the global market. Valued at just $13.2 billion in 2013, the Asia-Pacific market is expected to surge to $21.1 billion by 2019. Such rapid growth is attributed to improving economic conditions and the increasing use of the region as a hub for Western markets to outsource the manufacture of their transformers.

Meanwhile, the European and North American markets are projected to grow at a healthy CAGR of 7.2% and 5%, respectively.

The upgrading of existing networks and replacement of older transformers in Western regions offer a huge growth opportunity for the transformer market. This is especially the case for power and traction transformers, which have high performance properties to increase energy efficiency and reduce electricity losses. However, in the longer-term, the developing regions, including China, Brazil, India and others, will create huge opportunities for the transformer market with the increasing demand for electricity and increasing electricity production.

Increasing raw material prices and stricter environmental regulations on carbon emission levels have forced companies to focus on the development of advanced transmission technologies that will comply with current and future environmental regulations. The pressure to develop environmentally friendly transformers is increasing even in the Asia-Pacific and other developing regions.

GLOBAL MARKETS FOR TRANSFORMERS provides an overview of the global markets for transformers and related technologies. It includes analyses of global market trends, with data from 2013, estimates for 2014, and projections of CAGRs through 2019.

 

SAMPLE FIGURE

GLOBAL TRENDS OF THE HYDRAULIC PUMP MARKET BY REGION, THROUGH 2019

($ MILLIONS)

Global Markets for Transformers

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: Global Markets for Transformers.

 

Global Market for Transformers to Reach $48.3 Billion in 2019

IPC-8701 - First Manufacturing Acceptability Standard for Photovoltaic (Solar) Module Assemblies Debuts

IPC-8701 Acceptability specs will help provide infrastructure for solar panel assembly

Solar panels have been in volume production for quite some time, but there are still just a limited number of standards to help original equipment manufacturers (OEMs) and electronics manufacturing service (EMS) companies determine whether completed modules meet design and assembly requirements. IPC recently published the first document to set common acceptance criteria for finished assemblies.

IPC-8701, Final Acceptance Criteria Standard for PV Modules-Final Module Assembly, was written as a first step toward providing an infrastructure that will help companies increase volumes, hold costs down and obtain common acceptance requirements between customers and manufacturers. Like IPC standards for printed boards and other products, it eliminates the inconsistency that comes when companies all use different criteria for determining acceptability requirements.

“EMS companies are getting different criterion from each customer,” said Jasbir Bath, senior director, Standards at IPC. “It’s challenging to work with these different acceptance criterion, in terms of training of manufacturing personnel on the line and manufacturing quality inspections.”

In 60 pages, IPC-8701 describes best practices for inspecting photovoltaic assemblies, providing more than 120 photos to clarify the differences between acceptable and unacceptable elements. It focuses on the housing and support electronics used by both crystalline silicon cells, which dominate shipments today, as well as thin film cells in photovoltaic (PV) module production.

“This covers things like ensuring that the frame is square, the junction box is connected properly and that the label is in place and readable,” Bath said. “It even includes packaging in the shipping box, describing the protective packaging that keeps panels from getting cracked or undergoing too much stress during transit.”

One section focuses on the frames that enclose and support the solar cells. These are critical for product quality and they help shape the perception of quality.

“IPC-8701 sets parameters for both incoming frames and acceptable quality after manufacturing,” Bath said. “It describes what’s acceptable in terms of scratches, sharp edges, burrs, etc. There are specifications on how large scratches can be.”

The document also sets acceptance requirements for the junction boxes of the module.  Parameters for determining whether the plug-in terminals in the junction box pass or fail are also detailed.

 also looks at the sealant, tapes and potting compounds used in the module. The bus bars that connect solar cells in the module are also described. One of the final production steps, creating labels, is also included. The legibility of serial numbers and manufacturing date codes are described along with information on where these labels should be placed.

IPC-8701

For additional information or to purchase the standard, visit IPC-8701.

By Terry Costlow, IPC online editor

IPC-8701 - First Manufacturing Acceptability Standard for Photovoltaic (Solar) Module Assemblies Debuts

IPC-8701 - First Manufacturing Acceptability Standard for Photovoltaic (Solar) Module Assemblies Debuts

IPC-8701 Acceptability specs will help provide infrastructure for solar panel assembly

Solar panels have been in volume production for quite some time, but there are still just a limited number of standards to help original equipment manufacturers (OEMs) and electronics manufacturing service (EMS) companies determine whether completed modules meet design and assembly requirements. IPC recently published the first document to set common acceptance criteria for finished assemblies.

IPC-8701, Final Acceptance Criteria Standard for PV Modules-Final Module Assembly, was written as a first step toward providing an infrastructure that will help companies increase volumes, hold costs down and obtain common acceptance requirements between customers and manufacturers. Like IPC standards for printed boards and other products, it eliminates the inconsistency that comes when companies all use different criteria for determining acceptability requirements.

“EMS companies are getting different criterion from each customer,” said Jasbir Bath, senior director, Standards at IPC. “It’s challenging to work with these different acceptance criterion, in terms of training of manufacturing personnel on the line and manufacturing quality inspections.”

In 60 pages, IPC-8701 describes best practices for inspecting photovoltaic assemblies, providing more than 120 photos to clarify the differences between acceptable and unacceptable elements. It focuses on the housing and support electronics used by both crystalline silicon cells, which dominate shipments today, as well as thin film cells in photovoltaic (PV) module production.

“This covers things like ensuring that the frame is square, the junction box is connected properly and that the label is in place and readable,” Bath said. “It even includes packaging in the shipping box, describing the protective packaging that keeps panels from getting cracked or undergoing too much stress during transit.”

One section focuses on the frames that enclose and support the solar cells. These are critical for product quality and they help shape the perception of quality.

“IPC-8701 sets parameters for both incoming frames and acceptable quality after manufacturing,” Bath said. “It describes what’s acceptable in terms of scratches, sharp edges, burrs, etc. There are specifications on how large scratches can be.”

The document also sets acceptance requirements for the junction boxes of the module.  Parameters for determining whether the plug-in terminals in the junction box pass or fail are also detailed.

 also looks at the sealant, tapes and potting compounds used in the module. The bus bars that connect solar cells in the module are also described. One of the final production steps, creating labels, is also included. The legibility of serial numbers and manufacturing date codes are described along with information on where these labels should be placed.

IPC-8701

For additional information or to purchase the standard, visit IPC-8701.

By Terry Costlow, IPC online editor

IPC-8701 - First Manufacturing Acceptability Standard for Photovoltaic (Solar) Module Assemblies Debuts