Download IPC Standards - Everything You Need From Start To Finish

To achieve a high quality end product and maintain a competitive position in the marketplace, you need to infuse quality throughout the manufacturing process.

Did you know there is an IPC standard associated with nearly every step of printed circuit board production and assembly?  From design and purchasing to assembly and acceptance, Electronics.ca Publications offers IPC Standards to help you assure superior quality, reliability and consistency in the electronic assemblies that go into your product. Download IPC Standards Spec Tree – PDF file.

As with the manufacturing process — which uses a step-by-step approach – IPC standards also build upon one another. To achieve your desired results, it’s important to implement the appropriate IPC standards associated with each step of production.

Download IPC Standards Spec Tree – PDF File

Why Use IPC Standards in Your Manufacturing Process?

• Gain Control Over End Product Quality and Reliability — Quality and reliability are the cornerstones of competing in the marketplace and critical to your company’s reputation and profitability. By implementing IPC standards throughout the manufacturing process, you help ensure better performance, longer life and compliance with lead-free regulations.


• Improve Communication with Suppliers and Employees — IPC standards are the standards that your competitors, suppliers and EMS providers use. Working from an established IPC standard helps all of you to “speak the same language” — the language of the global electronic industry. In addition, using IPC standards eliminates confusion for employees, because they know they need to perform to an established industry standard.


• Help Contain Costs — Ensuring that your design and the bare boards you purchase comply with IPC standards allows you to produce electronic assemblies that meet stringent quality tests down the line, minimizing costly delays, rework and scrap.

The Most Popular IPC Documents are available from Electronics.ca Publications in PDF Format

Download IPC Standards

IPC A-610F – Acceptability of Electronic Assemblies
IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments.

IPC J-STD-001F – Requirements for Soldered Electrical and Electronic Assemblies
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies has emerged as the preeminent authority for electronics assembly manufacturing. The standard describes materials, methods and verification criteria for producing high quality soldered interconnections. The standard emphasizes process control and sets industry-consensus requirements for a broad range of electronic products. This revision now includes support for lead free manufacturing.

IPC A-620B – Requirements and Acceptance for Cable and Wire Harness Assemblies
Revision B is now available for the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies.

IPC-DRM-PTH-E
Now updated to Revision D of the latest IPC-A-610E and J-STD-001E – our Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections.

IPC-DRM-SMT-E
Useful as a training aid in the classroom or on the shop floor, DRM-SMT-E contains computer generated color illustrations of Chip component, Gull Wing and J-Lead solder joints.

IPC-J-STD-033C
J-STD-033 Provides Surface Mount Device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs.

IPC-J-STD-020D-1
IPC-J-STD-020D-1 standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress.

J-STD-075

J-STD-075 provides test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing.

IPC Collections:

IPC-C-103 – Electronics Assembly Standards Collection

IPC-C-1000 Essential Document Collection for Board Design, Assembly and Manufacture

IPC-C-108 Cleaning Guides and Handbooks Collection

Through Electronics.ca you can order IPC standards for printed circuit board design and manufacturing and electronics assembly, including handbooks, guidelines and IPC training videos.

Download IPC Standards - Everything You Need From Start To Finish

Global G.fast Chips Market Shares, Strategies, and Forecasts

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “G-fast Chips: Market Shares, Strategies, and Forecasts, Worldwide, 2014 to 2020″. This 2014 g.fast chips market report has 256 pages, is supported with 109 tables & figures. Worldwide G.fast Chip markets are increasingly diversified, poised to achieve significant growth as broadband is used in every industry segment. G.fast is able to make the benefits of broadband available to consumers and support network flexibility for consumers, data centers, and cell tower backbone communications.

G.fast networks are flexible and support broadband that is able to reach. According to the lead author of the team that prepared this research, “The opportunity to participate in G.fast Chips markets is compelling. G.fast provides the ability to leverage outdated copper infrastructure to breathe new life into existing investment. This market is evolving as new G.fast technology and vectoring are implemented. Growth in this market based on technical breakthroughs and innovation. Technology platforms are rapidly evolving.”

End to end broadband networks leverage a combination of optical infrastructure in the long haul and copper infrastructure in the last few meters from the distribution box to the home. Fiber has had rapid advance but does not work in the end, it is too expensive to the home. FTTH is too expensive and DSL continues to be a viable alternative, with DSL set to be replaced at the high end initially by G.fast. Copper based broadband technologies promise to last for a long long time. Though for many years FTTH has threatened to make xDSL obsolete, this has not proven to be the case.

Broadband Internet is used in all corners of the world. It is set to be used by everyone by 2025. There is a lot left to be done. Networking Services Company Akamai says the second quarter of 2014 marks the first time the global average broadband speed jumped over the 4-megabit mark. South Korea occupies the top broadband user category in both average bandwidth (24.6 megabits) and proportion of the population on a broadband connection (95 percent, tied with Bulgaria). Smaller islands, the Philippines, countries with lots of rural areas, like India, are struggling to deliver useful speeds.

The U.S. falls behind East Asia, ranking somewhere in the middle, with the Nordic countries, in terms of broadband speed and penetration. Inside the U.S., Delaware appears well equipped with broadband – the Mid-Atlantic state ranked first in every category: average speed, peak speed, connectivity and even “4K readiness,” referring to the 15 megabit speed that can handle ultra-high-def broadcasts. The slowest US state is Arkansas.

Companies discussed in the 2014-2020 g fast chips market report include Analog Devices, Arris, Broadcom, BroadLight, Cavium, Freescale Semiconductor, Ikanos, Infineon Technologies, IXYS Integrated Circuits Division, Lantiq, Marvell, MediaTek / Ralink Technology, PMC-Sierra, Pulse, Sckipio, Shantou New Tideshine Electron, Shenzhen Chaoyue Electronics Co., Ltd., Shenzhen Sky Foundation, Shenzhen Tianxiaowei Electronics Co., Ltd. and ZTE.

Copper represents an installed infrastructure worth trillions and too expensive to just replace. Fiber is too expensive to use it to replace all the copper. FTTH DSL and G.fast, the copper works in many cases and does not need to be re3placed. xDSL markets will be strong for some long time to come as copper remains a transport line.

G.fast leverages copper infrastructure that is everywhere in the telecommunications network. Copper provide connectivity to all residences. Copper is still the primary wireless backbone transport means, meaning it continues to be vital as new wireless systems continue to expand their markets. It predominates in the local loop, creating demand for systems that are able to support high speed signal transport over copper wire.

Copper based broadband is and will remain for the foreseeable future, the dominant broadband access technology across the globe. Broadband service providers who rely on copper loops for broadband access have to improve broadband performance and extend its life. Choices between DSL technologies and G.fast are based on cost. Fiber technologies are used to come to the curb. DSL and G.fast represent a hybrid rooted in a network planning.

G.fast Chips Market Shares

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: G.fast Chips Market Shares, Strategies, and Forecasts, Worldwide, 2014 to 2020.

 

 

 

Partial List of Tables and Figures provided in G.fast Chips Market Shares, Strategies, and Forecasts, Worldwide, 2014 to 2020 research report include:

Table ES-1 25 G.Fast Chip Market Driving Forces 25

Table ES-2 26 Vendor G.Fast Competitive Positioning Factors 26

Figure 2-17 87 DSL and G.fast Copper Infrastructure Subscriber Forecasts, Number, Worldwide, 2014-2020 87

Figure 2-18 88 G.fast Copper Infrastructure Subscriber Forecasts, Number, Worldwide, 2014-2020 88

Table 2-19 90 Broadband G.fast, DSL, Cable Modem, Wireless Device, and Fiber to the Home Subscribers Worldwide, 2014-2020 90

Table 2-20 95 Ethernet Market Aspects 95

Figure 2-21 96 Explosion of Protocols 96

Figure 2-22 98 Broadband Services Typical Speed in Mbps 98

Table 2-23 99 Broadband Fiber Cost Per Household to Build Out 99

Table 2-24 100 DSL Chip Applications 100

Figure 2-25 102 DSL Regional Market Segments, 2013 102

Table 2-26 103 DSL Regional Market Segments, 2013 103

Table 2-27 107 DSL Component Shipments by Vendor by Region Dollars, Worldwide, 2013 107

Figure 3-1 110 FTTH vs. G.Fast Costs for Services Providers 110

Figure 3-2 113 Lantiq G.fast 113

Table 3- 114 Key Features of the Lantiq EASY330 G.Fast Reference Board 114

Table 3- 119 Broadcom BCM65200/900 Family Key Features 119

Figure 3- 122 Simulation of G.fast Rates Over 100-Meter Lines Gives 1.3 Gbit/s by Controlling Ccrosstalk 122

Figure 3-12 127 Ikanos 496pix_Velocity_Chipset2 127

Table 3-33 132 Google Addresses DSL Vectoring 132

Figure 4-1 136 Network Configurations 136

Figure 4-2 137 Innovation In Copper Supports Fiber to Curb Rollout Leveraging Endpoints Using G.fast 137

Figure 4-3 139 G.fast Vectoring 139

Figure 4-4 141 Fiber to the Distribution Point Architecture 141

Figure 4-5 144 Typical DSL Downstream Broadband Capability 144

Figure 4-6 150 G.fast Copper Network Solution 150

Figure 4-7 153 Broadband Services Typical Speed in Mbps 153

Table 4-8 158 Ikanos NodeScale Vectoring Product Key Features 158

Table 4-9 159 Ikanos Quality Video (iQV) technology Key Features 159

Table 5-9 189 Analog Devices Consumer Segment Products 189

Table 5-10 190 Analog Devices Communications Segment Systems 190

Table 5-11 191 Analog Devices Revenue by Regiion 191

Table 5-12 197 Broadcom Broadband Communications Solutions 197

Figure 5- 198 Broadcom Communications Positioning 198

Table 5-13 200 Broadcom Customers and Strategic Relationships 200

Table 5-14 215 Ikanos Product Lines 215

Table 5-15 220 Ikanos Works Directly With Various Major Service Providers 220

Figure 5-16 233 MediaTek Revenue 233

Table 5-17 235 MediaTek Industry Leadership 235

Figure 5-18 236 MediaTek Product Portfolio 236

 

Global G.fast Chips Market Shares, Strategies, and Forecasts

DSL and G.fast Chips Markets To Reach $4.7 Billion By 2020

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “DSL and G.fast Chips: Market Shares, Strategy, and Forecasts, Worldwide, 2014 to 2020″. The 2014 study has 319 pages, 109 tables and figures. Worldwide DSL and G.fast Chips markets are increasingly diversified, poised to achieve significant growth as broadband is used in every industry segment.

End to end broadband networks leverage a combination of optical infrastructure in the long haul and copper infrastructure in the last few meters from the distribution box to the home. Fiber has had rapid advance but does not work in the end, it is too expensive to the home. FTTH is too expensive and DSL continues to be a viable alternative, with DSL set to be replaced at the high end initially by G.fast. Copper based broadband technologies promise to last for a long long time. Though for many years FTTH has threatened to make xDSL obsolete, this has not proven to be the case.

Copper represents an installed infrastructure worth trillions and too expensive to just replace. Fiber is too expensive to use it to replace all the copper. FTTH DSL and G.fast, the copper works in many cases and does not need to be repplaced. xDSL markets will be strong for some long time to come as copper remains a transport line.

Copper is everywhere in the telecommunications network. It is still the primary wireless backbone transport means, meaning it continues to be vital as new wireless systems continue to expand their markets. It predominates in the local loop, creating demand for systems that are able to support high speed signal transport over copper wire.

Copper based broadband is and will remain for the foreseeable future, the dominant broadband access technology across the globe. Broadband service providers who rely on copper loops for broadband access have to improve broadband performance and extend its life.

Choices between DSL technologies and G.fast are based on cost. Fiber technologies are used to come to the curb. DSL and G.fast represent a hybrid rooted in a network planning.

Copper based broadband continues to be the dominant broadband access technology across the globe. Broadband service providers who rely on copper loops for broadband access have options to improve broadband performance and extend their life. Despite its throughput limitations, considerable research and development is taking place to improve DSL performance.

Cable boasts faster speed than DSL Internet i. However, cable does not always deliver on the promise in everyday practical use. Cable technology supports 30 Mbps of bandwidth, whereas most forms of DSL cannot reach 10 Mbps.

One type of DSL technology, VDSL, can match cable’s performance, also supporting 30 Mbps. However, Internet service providers generally do not offer VDSL, but rather the cheaper and slower ADSL or SDSL services. Cable modem services can slow down significantly if many people in your neighborhood access the Internet simultaneously.

The opportunity to participate in DSL and G.fast Chips markets is compelling illustration of the ability to leverage seemingly outdated copper infrastructure to breathe new life into existing investment. This market is evolving as new technology and vectoring are implemented, based on breakthroughs and innovation. Technology platforms are rapidly evolving.

Consideration of DSL and G.fast chips market forecasts indicates that markets at $939 million will reach $4.7 billion by 2020. Growth comes as every industry achieves leveraging broadband to make social media and smart phones work to grow the business. DSL and G.fast are able to make the benefits of broadband available to consumers and support network flexibility for the modern enterprise. DSL and G.fast networks are flexible and able to reach customers on the go. Broadband is used for video and entertainment delivery.

DSL and G.fast Chips Markets

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: “DSL and G-fast Chips: Market Shares, Strategies, and Forecasts, Worldwide, 2014 to 2020“.

 

G.fast, G.fast vectoring, DSL, Digital Subscriber Line, DSL Chips, G.fast, DSL Vectoring, Access Providers, G.fast Vectoring, Broadband, Telecom, Copper plant, Fiber to the Neighborhood, DSLAM, End to End Optical, Broadband Networks, Data And Video Traffic, Mixed Signal Integrated Circuits, ADSL, VDSL, DSL, xDSL, Digital, Subscriber Line (DSL), Data And Video Traffic, Flexible Network Interfaces, FTTH, Advanced Bonding

DSL and G.fast Chips Markets To Reach $4.7 Billion By 2020

Semiconductor Revenue from the Automotive Application Market

Due to the increase in demand for electronics in cars and light trucks today, the automotive semiconductor market has been one of the industry segments that has outperformed the overall market. Semiconductor revenue from the automotive application market is forecast to grow again in 2014 with an increase of 8 percent. Long term, this market is growing at about the same rate as in 2014. Semiconductors used in automotive applications are covered in this tracker. Forecasts are provided by subsegment including infotainment, powertrain, safety systems, and the aftermarket. Forecasts are provided for all semiconductor product families and product breakouts for each family. Market share is included for overall semiconductor players in the automotive market as well as OEM market share and estimates for how much each OEM is spending on semiconductors. Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications" web site. View the report: 2014 Automotive Market Tracker.

Light-Emitting Diodes, LEDs for Lighting Applications

Global shipments of high-brightness LEDs were worth an estimated $38.2 billion in 2013. The market is projected to reach nearly $46.4 billion in 2014 and $105.5 billion in 2019, a compound annual growth rate (CAGR) of 17.9% between 2014 and 2019. This study encompasses technologies and materials for fabricating colored and white LEDs. the report assesses each technology and then focuses on where it is used. The five major industries using HB-LEDs are analyzed to evaluate their current market statuses and to develop future projections. Forecasts of unit shipments and their values are made for 2013, 2014 and 2019. Various technical issues are discussed. In addition, a thorough economic analysis is presented. This study analyzes the high-brightness LED industry on a global basis, including manufacturing capability and consumption by various regional markets. It examines global government funding and support, industry involvement, standards, and other pertinent factors related to the success of solid-state lighting. We also review the various materials and material systems that create different colored LEDs and their potential technologies for the future. Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications" web site. View the report: Light-Emitting Diodes, LEDs for Lighting Applications.

Communications Clock Market Forecast

Communications infrastructure continues to be the most attractive segment in clocking. It has the highest margins, and the longest revenue lifetime. It has the associated challenges to meet spec that go along with high value added solutions.  According to a new market research report “Clock and Timing Opportunities in Communications Infrastructure“, the total available market (TAM) for timing products in communications infrastructure was $1.4B in 2010. The market will grow at a compound annual growth rate (CAGR) of 7.2% to reach $1.86B in 2014. While proliferation has slowed in 2012 and going into 2013, as of the time of this report (March 2013), the trend is moving forward in a positive manner with new base stations and infrastructure implementations picking up by about 2%. China is looking to see the highest level of proliferation, followed by South America, APAC, Eurmea¸ and NAM. 

Communications infrastructure is a completely different world than the rest of clock market. Compared to consumer and computer applications, communications infrastructure serves different customers in different markets and products must achieve a high technical bar to succeed in these applications. This is a key obstacle for entry, let alone consistency in delivery of precision and ultra-precision class timing solutions that truly add high value.

Communications end products are not as well known as consumer products and computers. You can’t go to BestBuy or Yodobashi Camera store to examine and/or purchase your customer’s end product. Block diagrams are also harder to come by. It takes deep applications knowledge to understand what timing products to make and extensive market experience to understand where to invest.

New trends in 2013 include more integration of timing functions BY the suppliers ­ this means integration of the fanout/distribution buffer and potentially the resonator, oscillator, frequency generator(s) and a mix of I/O types from a single packaged solution. An example is VoIP clock tree’s which are typically implemented with an oscillator or synthesizer (using and external xtal) at 125MHz with better than 100ppm, with low phase noise of <1ps RMS (integrated from 1.875MHz to 20 MHz), followed by a fanout/distribution buffer with anywhere from 4 to 22 outputs in LVCMOS… this can become a fully integrated solution IF the supplier uses the fanout buffer package thus enabling the customer without a change in the current pcb a very attractive proposition.

Selected List of Tables 

Table 1: Common Ethernet Clock Frequencies 33

Table 2: 2011-2014 Communications Clock Market Forecast ($M), by market 94

Table 3: 2011-2014 Communications Clock Market Forecast ($M), by market segment 95

Table 4: 2011-2014 Communications Clock Market Forecast ($M), by function 96

Table 5: 2011-2014 Communications Clock Forecast ($M), by product type 97

Table 6: 2011-2014 Communications Clock Crystal and Oscillator Forecast ($M) 98

Table 7: 2011-2014 Communications Clock IC Forecast ($M), by product type 99

Table 8: 2011-2014 Communications Clock PLL IC Forecast ($M), by type 100

Table 9: 2010 and 2009 System Vendor Revenues ($M) 104

Table 10: Financial Performance of Top 5 System Vendors 107

Table 11: Key Facts: Cisco Systems 110

Table 12: Key Facts: L M Ericsson 112

Table 13: Key Facts: Huawei 113

Table 14: Key Facts: Alcatel-Lucent 115

Table 15: Key Facts: Nokia-Siemens Networks 116

Table 16: Integrated Phase Jitter vs Integration Bandwidth 122

Table 17: Comparison of RiseTime Specifications 127

Table 18: Example Crystal Specifications for an Ethernet Clock Generator IC 137

Table 19: Example Crystal Specifications for a VCXO Jitter Cleaner IC 137

Table 20: OCXO and TCXO Specifications for SONET and Synchronous Ethernet 140

Table 21: Competitive Positioning between Crystal and Oscillator Module Companies 161

Table 22: Competitive Positioning between IC Clock and Timing Companies 162

Communications Clock Market Forecast

Competition for Graphene: Researchers Demonstrate Ultrafast Charge Transfer in New Family of 2-D Semiconductors

A new argument has just been added to the growing case for graphene being bumped off its pedestal as the next big thing in the high-tech world by the two-dimensional semiconductors known as MX2 materials.Illustration of a MoS2/WS2 heterostructure with a MoS2 monolayer lying on top of a WS2 monolayer. Electrons and holes created by light are shown to separate into different layers. (Image courtesy of Feng Wang group)

Illustration of a MoS2/WS2 heterostructure with a MoS2 monolayer lying on top of a WS2 monolayer. Electrons and holes created by light are shown to separate into different layers. (Image courtesy of Feng Wang group)

An international collaboration of researchers led by a scientist with the U.S. Department of Energy (DOE)’s Lawrence Berkeley National Laboratory (Berkeley Lab) has reported the first experimental observation of ultrafast charge transfer in photo-excited MX2 materials. The recorded charge transfer time clocked in at under 50 femtoseconds, comparable to the fastest times recorded for organic photovoltaics.

“We’ve demonstrated, for the first time, efficient charge transfer in MX2 heterostructures through combined photoluminescence mapping and transient absorption measurements,” says Feng Wang, a condensed matter physicist with Berkeley Lab’s Materials Sciences Division and the University of California (UC) Berkeley’s Physics Department. “Having quantitatively determined charge transfer time to be less than 50 femtoseconds, our study suggests that MX2 heterostructures, with their remarkable electrical and optical properties and the rapid development of large-area synthesis, hold great promise for future photonic and optoelectronic applications.”

Wang is the corresponding author of a paper in Nature Nanotechnology describing this research. The paper is titled “Ultrafast charge transfer in atomically thin MoS2/WS2 heterostructures.” Co-authors are Xiaoping Hong, Jonghwan Kim, Su-Fei Shi, Yu Zhang, Chenhao Jin, Yinghui Sun, Sefaattin Tongay, Junqiao Wu and Yanfeng Zhang.

MX2 monolayers consist of a single layer of transition metal atoms, such as molybdenum (Mo) or tungsten (W), sandwiched between two layers of chalcogen atoms, such as sulfur (S). The resulting heterostructure is bound by the relatively weak intermolecular attraction known as the van der Waals force. These 2D semiconductors feature the same hexagonal “honeycombed” structure as graphene and superfast electrical conductance, but, unlike graphene, they have natural energy band-gaps. This facilitates their application in transistors and other electronic devices because, unlike graphene, their electrical conductance can be switched off.

“Combining different MX2 layers together allows one to control their physical properties,” says Wang, who is also an investigator with the Kavli Energy NanoSciences Institute (Kavli-ENSI). “For example, the combination of MoS2 and WS2 forms a type-II semiconductor that enables fast charge separation. The separation of photoexcited electrons and holes is essential for driving an electrical current in a photodetector or solar cell.”

In demonstrating the ultrafast charge separation capabilities of atomically thin samples of MoS2/WS2 heterostructures, Wang and his collaborators have opened up potentially rich new avenues, not only for photonics and optoelectronics, but also for photovoltaics.

“MX2 semiconductors have extremely strong optical absorption properties and compared with organic photovoltaic materials, have a crystalline structure and better electrical transport properties,” Wang says. “Factor in a femtosecond charge transfer rate and MX2 semiconductors provide an ideal way to spatially separate electrons and holes for electrical collection and utilization.”

Wang and his colleagues are studying the microscopic origins of charge transfer in MX2 heterostructures and the variation in charge transfer rates between different MX2 materials.

“We’re also interested in controlling the charge transfer process with external electrical fields as a means of utilizing MX2 heterostructures in photovoltaic devices,” Wang says.

Image: Illustration of a MoS2/WS2 heterostructure with a MoS2 monolayer lying on top of a WS2 monolayer. Electrons and holes created by light are shown to separate into different layers. (Image courtesy of Feng Wang group)

Additional Information

Lawrence Berkeley National Laboratory addresses the world’s most urgent scientific challenges by advancing sustainable energy, protecting human health, creating new materials, and revealing the origin and fate of the universe. Founded in 1931, Berkeley Lab’s scientific expertise has been recognized with 13 Nobel prizes. The University of California manages Berkeley Lab for the U.S. Department of Energy’s Office of Science.  For more, visit www.lbl.gov. – See more at: http://newscenter.lbl.gov/2014/08/26/competition-for-graphene/#sthash.BDDE2o1L.dpuf

Learn more about semiconductor market and publications that provide informed perspective and relevant analysis of emergent technologies.

 

Competition for Graphene: Researchers Demonstrate Ultrafast Charge Transfer in New Family of 2-D Semiconductors