Micro Server IC Market Report

Micro servers, also known as low powered servers or energy efficient servers or high dense servers, are those which contain a large number of nodes, low powered processors, and shared infrastructure. The micro server architecture provides improvement in power efficiency and system cooling compared to traditional servers by sharing common components, such as fans and power supply. Micro servers thus, use less power, need less cooling, and require less space than conventional servers. They are mainly used for low intensive tasks such as web hosting, video steaming, downloads, web 2.0 activities such as social networking, web serving, or possibly handling corporate logins. Micro servers market has penetrated nearly 2.3% of the total servers market in 2012. However, it is forecasted that by 2018, nearly 28% of the servers market will be shared by micro servers. The market is expected to take a magnanimous leap from 2014 when 64 bit ARM processor, having a high processing speed, will be launched. Market is segmented according to component, processor type, application, and geography.

Micro Server IC market is segmented based on the processor type into Intel, ARM, and AMD. Intel processor based micro servers are further segmented into Atom and Xeon. The report also forecasts the market by component which includes hardware, software, and operation systems. Application areas of micro servers are categorized into Media Storage, Internet Data Centers, Analytics, Cloud Computing, and other applications. This report describes the market dynamics which includes drivers, restraints, and opportunities along with their impact analysis matrix. Impact analysis matrix depicts the impact of a particular driver or restraint on the market at present and the future impact on the market. This report also highlights the huge opportunities for the market.

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Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site:  Micro Server IC Market by Processor (Intel, ARM, AMD), IC’s (Analog, Digital), Applications (Media Storage, Data Center, Cloud Computing, Analytics) & by Geography (N.America, Europe, APAC, ROW) – Global Forecasts and Analysis to 2013 – 2018.

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Partial List of Tables:

Table 15 Comparison Between Atom and Xeon Based Micro Servers

Table 16 Global Intel Based Micro Servers Market Revenue, By Types, 2012 – 2018 ($Million)

Table 17 Intel Processor Based Micro Servers Market Revenue, By Application, 2012 – 2018 ($Million)

Table 18 Intel Processor Based Micro Servers Market Revenue, By Geography, 2012 – 2018 ($Million)

Table 19 Atom Based Micro Servers Market Revenue, By Geography 2012 – 2018 ($Million)

Table 20 Xeon Based Micro Servers Market Revenue, By Geography, 2012 – 2018 ($Million)

Table 21 ARM Processor Based Micro Servers Market, By Application, 2012 – 2018 ($Million)

Table 22 ARM-Based Micro Servers Market Revenue, By Geography, 2012 – 2018 ($Million)

Table 23 AMD Processor-Based Micro Servers Market Revenue, By Applications, 2012 – 2018 ($Million)

Table 24 AMD-Based Micro Servers Market Revenue, By Geography, 2012 – 2018 ($Million)

Table 25 Global Micro Servers Market, By Components, 2012 – 2018 ($Million)

Table 26 Micro Server Hardware Market Revenues, By Device, 2012 – 2018 ($Million)

Table 27 Micro Server Hardware Market Revenue, By Geography, 2012 – 2018 ($Million)

 

 

Micro Server IC Market Report

Internet of Things Spending by Vertical Market

ELECTRONICS.CA PUBLICATIONS, the electronics industry market research and knowledge network, announces the availability of a new IDC report entitled “Worldwide Internet of Things Spending by Vertical Market 2014-2017 Forecast“, which defines the IT opportunity for  all vertical markets that comprise  the burgeoning Internet of Things market. The new report segments the IoT market as well as provides a forecast that illustrates which vertical industries show the greatest market opportunity over the next several years.

As the Internet of Things IoT market starts to coalesce in both concept and solution offering, IDC recommends vendors take the next step and look at this huge IT opportunity in a more realistic and valuable framework. As exciting as the overall opportunity for the IoT market currently exists, understanding the vertical ramifications is paramount. All of the greatest IoT IT opportunities — from the connected home, smart meters, the connected car, and smart grid to personal wellness and connected health — are driven from a vertical market perspective.

The Internet of Things market must be understood in terms of vertical markets because the value of IoT is based on individual use cases across all markets. Successful sales and marketing efforts by vendors will be based on understanding the most lucrative verticals that offer current growth and future potential and then creating solutions for specific use cases that address industry-specific business processes.

IDC defines the Internet of Things concept as a wired or wireless network connecting devices, or “things,” that is characterized by autonomous provisioning, management, and monitoring. IoT already impacts our everyday life down to the smallest processes. The vertical opportunity that arises from IoT is already in play, but only if the need for vertical expertise is recognized and offered. Realizing the existence of vertical opportunity is the first step to understanding the impact — and therefore market opportunity that exists — for IT vendors. In addition:

• IDC has looked at the components, processes, and IT support for IoT and expects the technology and services revenue to expand from $4.8 trillion in 2012 to $7.3 trillion by 2017 at an 8.8% CAGR, with the greatest opportunity initially in the consumer, discrete manufacturing, and government vertical industries.


• The IoT/M2M market is growing quickly, but the development of this market will not be consistent across all vertical markets. Industries that already “understand” IoT will see the most immediate growth, such as industrial production/automotive, transportation, and energy/utilities. However, all verticals will reflect great opportunity.


• IoT is a derivative market containing many elements, including horizontal IT components as well as vertical and industry-specific IT elements. It is these vertical components where IT vendors will have to distinguish themselves to address industry-specific IoT needs.


• IoT opens up many IT vendors to the consumer market, providing B2B2C services to connect and run homes and automobiles — all the places that electronic devices will have a networking capability.

According to the report, the first step to understand how vendors can position themselves will be to understand the components of the IoT/M2M IT ecosphere. Because this is a derivative market, there are many opportunities for vendors to offer parts or product suites that cover the needed IoT IT set. And vendors will have incentive to do so due to rapid growth which will occur as industries see the convenience, productivity, and efficiency that IoT brings to business processes. Accordingly, while horizontal-focused IT vendors will look to offer IoT solutions that appeal to many industries, there will also be impetus to offer vertical-focused solutions that make IoT tangible for both industries applications (M2M) and consumer needs (B2B2C).

The IoT market will greatly impact and offer the potential for vertical-aligned businesses to improve both performance and profitability. The IoT solutions space will expand exponentially and will offer every business endless IoT-focused solutions. The initial strategy of businesses should be to avoid choosing IoT-based solutions that will solve only immediate concerns and lack ‘staying power.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: “Worldwide Internet of Things Spending by Vertical Market 2014-2017 Forecast“

Internet of Things Spending by Vertical Market

2014 Medical Semiconductors Report

Medical electronics continue to drive demand for high performance semiconductors. We predict that this application market for circuits will grow from $4.1 billion to over $6 billion in the next five years. This report covers demand for semiconductors in the home medical electronics market, imaging market, and clinical electronics market. Market share for semiconductor suppliers is provided along with market share and estimated semiconductor spend by the diverse medical manufacturing industry. Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications" web site. View the report: 2014 Medical Semiconductors Report.

Optical Transceivers Markets to Reach $9.9 Billion by 2020

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Optical Transceivers: Market Shares, Strategy, and Forecasts, Worldwide, 2014 to 2020″. The global optical transceivers markets at $3.2 billion in 2013 is anticipated to grow to $9.9 billion by 2020 driven by the availability and cost effectiveness of 40 Gbps, 100 Gbps, and 400 Gbps devices. Next generation devices use less power, are less expensive, and are smaller. The adoption of widespread use of the 100 Gbps devices, and the vast increases in Internet traffic are core to change in the communications infrastructure markets. The vendors in the optical transceivers industry have to invest in high-quality technology and processes. The development of innovative products is essential to keeping and growing market share.

High-speed serial transceivers form the backbone of networks. Communications, servers and many other electronic systems depend on high-speed serial transceivers. Global adoption of the Internet is driving rapid growth of the mega datacenter. Data centers support online commerce, streaming video, social networking, and cloud services. Software as a Service (SaaS) is a primary offering.

Leading vendors offer a broad product selection. They are positioned with innovative technology. Optical module manufacturers address the needs of all major networking equipment vendors worldwide. Leading vendors have taken a leading role in transforming the data communications and tele-communications equipment market.

The shift has been away from utilizing discrete optical components to leveraging the design and pay-as-you-grow flexibility offered by pluggable modules. Optical transceiver products are compliant with Ethernet, Fibre Channel, SONET/SDH/OTN and PON standards. They generally operate at data rates of 10 Gb/s, 40 Gb/s and 100 Gb/s.

Transmitter / Transceivers are capable of distances ranging from very short reach within a datacenter to campus, access, metro, and long-haul reaches. They feature outstanding performance. Units work over extended voltage and temperature ranges. They are positioned to minimize jitter, electromagnetic interference (EMI) and power dissipation.

Optical transceiver components are an innovation engine for the network. Optical transceiver components support and enable low-cost transport throughout the network. Optical transceivers are needed for high speed network infrastructure build-outs. These are both for carriers and data centers. Network infrastructure build-out depends on the availability of consultants who are knowledgeable.

Consultants with extensive experience are needed to bring optical component network design, installation, upgrade and maintenance into development. Optical components are being used to equip data centers, FTTx, metro access or core networks. They are used for long-haul and WAN.

A palette of pluggable optical transceivers includes GBIC, SFP, XFP, SFP+, X2, CFP form factors. These are able to accommodate a wide range of link spans. Vendors work closely with network planners and infrastructure managers to design high speed optical transport systems.

According to Susan Eustis, lead author of the WinterGreen Research team that prepared the study, “The DP-QPSK is the industry-backed modulation scheme for 100Gbps. Commonality between 40Gbps and 100Gbps coherent designs bring a design choice to the issue is relative costs. The economics of 40 Gbps versus 100 Gbps coherent are matters of comparison. If users buy 40 Gbps and an economical 100 Gbps coherent design appears, 40 Gbps coherent get the required market traction to create economies of scale that market the 40Gbps devices viable in the market.”

Designers are shrinking existing 40Gbps modules, boosting 40Gbps system capacity. The 300-pin LFF transponder, at 7×5 inch, requires its own line card. Two system line cards are needed for a 40Gbps link: one for the short-reach, client-side interface and one for the line-side transponder.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report:  “Optical Transceivers: Market Shares, Strategy, and Forecasts, Worldwide, 2014 to 2020“.

 

Optical Transceivers Markets to Reach $9.9 Billion by 2020

The Worldwide IC Packaging Market

While the integrated circuit (IC) market tends to be cyclical in nature, the general trend is for more ICs to be integrated into more products over time. The market is being driven by demand for handheld consumer devices as well as advanced computing products. All product segments (transportation, medical/industrial, communications and computers) are expanding rapidly with advances in semiconductor packaging technology leading innovation. Following an unexpectedly robust year of growth (7.9%), in 2013, the semiconductor industry appears to have recovered its former strength after the devastating economic downturn at the end of the last decade. While the rate of growth for both semiconductors shipped and worldwide revenues will decline somewhat, the market is expected to post a respectable compounded growth of more than 4% over the next five years. This report analyzes the semiconductor industry and uses this analysis to forecast the future of the global IC packaging market. The report begins with an economic and industry overview, then examines the historic and future unit and revenue IC growth. Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications" web site. View the report: The Worldwide IC Packaging Market.

Machine Vision Technologies Global Markets

The scope of this report is the market for MV hardware and software, including smart cameras and smart sensors, compact vision systems, personal computer-based MV systems, MV lighting and cameras, and frame grabbers. A variety of factors were considered in making the market forecast, including plant construction and upgrades, the rate at which new MV technology is being applied in new areas, the underlying economic growth of the overall market, and the growth rates reported by manufacturers and users of MV products. The report will look at the global market for the various components that comprise an MV system. These components have been undergoing constant upgrades in terms of sophistication, but providing easier operation. The global market for machine vision (MV) system components totalled $14.4 billion in 2013 and $15.7 billion in 2014. The market should reach $17.1 billion in 2015 and about $26.9 billion in 2020, registering a compound annual growth (CAGR) of 9.4% over the next five years. Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications" web site. View the report: Machine Vision Technologies Global Markets.

DRAM, China, and Leading-Edge Foundry Driving IC Industry in 2014

The McClean Report offers a broad look at the integrated circuit industry. The original 490-page study (monthly updates provide approximately 500 more pages of information) is separated into 16 sections. About 400 tables, graphs, and illustrations in the original report clearly describe various market dynamics (another 400 tables, graphs, and illustrations are included in the monthly updates).

Besides covering worldwide IC market conditions and economic issues, there are chapters dedicated to each of the major IC product segments. Likewise, trends pertaining to capital spending and fab capacity, as well as technology developments and packaging, can be found in other sections of the report.

Links to summaries of each section in the report are provided below.

1. Executive Summary

2. Global IC Industry Outlook and Cycles

3. Leading IC Suppliers and Foundries

4. Capital Spending and Capacity Trends

5. Market Summary by Device Type

6. Memory Market Overview

7. Flash and Other Non-Volatile Memory

8. DRAMs and SRAMs

9. Microcomponent Market Overview

10. Microcontrollers and DSPs

11. Microprocessors

12. ASIC Market Overview

13. Analog Market Overview

14. Technology Trends

15. Packaging Trends

16. IC Economic Issues

Section 1. Executive Summary

The executive summary serves as an introduction to The McClean Report. It highlights the major issues that are detailed in the report to give the reader an idea for what to expect in the sections that follow.

Section 2. Global IC Industry Outlook and Cycles

Electronic Industry Interdependence. This section starts by examining the relationship between the electronic systems market and the IC market, as well as how the IC market depends on the health of two smaller but important segments—the semiconductor equipment market and the semiconductor materials market.

Global IC Industry Outlook and Cycles

Global Economics. The world and regional GDP environments are discussed and compared to the semiconductor market environment. In addition, regional electronic systems production statistics are provided and the effects of currency exchange rates on the electronic systems and semiconductor markets are covered.

Global Semiconductor Market Review and Forecast. An extensive historical review and five-year forecast through 2018 of the worldwide semiconductor market is provided. The forecasts are presented in terms of dollars, unit shipments, and average selling price, as well as by region and electronic system type. Forecast assumptions are also presented.

 

Section 3. Leading IC Suppliers and Foundries

Who and where are the world’s leading suppliers of ICs? Find the answers in this section. The top 50 IC suppliers, top 50 semiconductor suppliers, and top 50 fabless IC suppliers are shown for 2012 and 2013.

Leading IC Suppliers and Foundries

In addition, a significant amount of coverage is included on IC foundries and the increasingly important role they play in the IC industry.

 

Section 4. Capital Spending and Capacity Trends

Capital spending and fab capacity levels are an important indicator of health in the semiconductor industry. As in many business situations, overspending leads to overcapacity, which leads to an imbalance in supply and demand. Therefore, it is useful to track spending (or production) and capacity trends in the industry.

Worldwide Capital Spending. In addition to a review and forecast of worldwide spending, rankings of the world’s biggest spenders are provided. Spending levels within each of the world’s geographic regions are compared to show which areas are most aggressive in advancing production capabilities and adding capacity. Spending by IC product type is also covered.

Capital Spending and Capacity Trends

Capital Spending Cycles. While the pronounced cycles of the semiconductor market are well documented, this section shows that capital spending trends are even more volatile. Also shown is how closely changes in capital spending and IC average selling price have tracked over the past two decades.

Worldwide IC Capacity and Production. Capacity and production statistics include die-per-wafer trends, wafer start trends, capacity utilization rates, and revenue-per-wafer trends.

Worldwide IC Capacity and Production

 

Section 5. Market Summary by Device Type

This section includes a detailed review and forecast (2011-2018) of each IC product category (e.g., data conversion ICs, standard cell ASICs, MPUs, DRAMs, etc.). The details include dollar volumes, unit shipments, and average selling prices. In addition, the average annual growth rates for each category are listed.

Section 6. Memory Market Overview

This section provides a brief summary of the MOS memory IC market and the various volatile and non-volatile memory products that make up the category. Trace the MOS memory market’s best and worst times over the past few years and note any cyclical patterns through 2018.

Memory Market Overview

 

Section 7. Flash and Other Non-Volatile Memory

Flash and Other Non-Volatile Memory

Non-volatile memory ICs include ROM, EPROM, EEPROM, and flash memory devices. The unifying characteristic is that they retain their stored information even after system power is removed. ROM and EPROM devices were once the backbone of the non-volatile memory market, but now take a back seat to more versatile flash memory devices. This section examines trends, reviews market, unit shipment, and average selling price data, and highlights technical advances.

 

Section 8. DRAMs and SRAMs

The DRAM market continues to be one of the most closely watched of all IC categories. Whether in discrete package form or embedded with other technology, these devices are a critical component in PCs and are found in a growing number of wireless and portable applications. This section examines the historical and forecasted markets, unit shipments, and the all-important average selling prices for both DRAM and SRAM products. DRAM price-per-bit information and DRAM architectures are reviewed.

 

Section 9. Microcomponent Market Overview

This section features a high-level review of microprocessors, microcontrollers, and digital signal processors, all which fall under the banner of the microcomponent market. See how each of these segments contributes to the total microcomponent market.

Microcomponent Market Overview

 

Section 10. Microcontrollers and Digital Signal Processors

Microcontrollers are among the most ubiquitous of all integrated circuits. From 4-bit to 32-bit devices, microcontrollers are used to control and monitor both simple and extremely complex functions in the home, automobile, and office. This section reviews market, unit shipment, and pricing data and provides a review of the different segments of the MCU market.

The DSP market is suffering from a loss of identity as digital signal processing functions move into application-specific standard products (ASSPs) and field-programmable gate arrays (FPGAs) fill potential DSP sockets.  IC Insights reviews the market, unit shipments, and average selling price for the DSP market.

 

Section 11. Microprocessors

From humble beginnings in 1971, microprocessors have emerged to be among the most closely followed of all IC products. Nearly everyone recognizes Intel’s dominance in the microprocessor business, but what about processors for mobile devices such as smartphones and tablet PCs?  What does Intel’s processor roadmap hold in store?  Can Intel achieve processor dominance in the market for portable handheld devices or will ARM-based processors continue to gain market momentum?  Learn IC Insights’ take on the MPU market and review our forecast of market size, unit shipments, and average selling price.

Section 12. ASIC Market Overview

The application-specific IC (ASIC) and system-on-chip (SOC) market is an important segment of the IC industry. This section offers extensive coverage of ASIC/SOC market trends. Dollar, unit shipment, and average selling price information is provided for the total ASIC market, as well as for the standard cell, gate array, and PLD sub-segments.

ASIC Market Overview

 

Section 13. Analog Market Overview

Analog Market Overview

Analog signals can be thought of as those that represent elements and conditions experienced in the “real” world. These include factors such as light, sound, temperature, and pressure. Analog signals are a continuous representation of phenomena in terms of points along a scale. Hype and hoopla surrounding advances in the world of digital ICs often overshadows developments in the analog IC business, but as noted in this section, the analog market continues to play a steady role in the IC industry. Important market, unit shipment, and pricing data for the overall analog market and for individual segments within this market (e.g., amplifiers, interface, comparators, etc.) are provided.

 

Section 14. Technology Trends

The success and proliferation of the integrated circuit since its discovery in the late 1950s has been due to the ability of manufacturers to continue offering more for the money. This ability to reduce the cost of ICs per performance has been driven by the continuous and rapid development of new and improved process technologies. Section 14 covers a variety of process technology related trends, such as the advanced lithography methods needed to continue shrinking chip geometries, new interconnect schemes, strain engineering for improved performance and lower power consumption, 3D integration, novel transistor structures, and the migration to larger wafers.

Technology Trends

 

Section 15. Packaging Trends

IC Packaging Trends

The assembly and packaging of ICs no longer takes a back seat to front-end processing. For most new IC products, packaging is an integral part of the chip design and production process; it is no longer just a simple, final step in the chip supply chain. As a result, accelerating demand for smaller, faster, yet less expensive products is pressing the packaging industry to keep pace with advancements in IC process technology.

This section provides an IC unit shipment forecast by package type (e.g., SO, FP/CC, BGA, wafer-level, bare die, etc.) and data showing how packages have evolved from simple cookie-cutter type packages to highly sophisticated and customized solutions. Details are provided on the ball-grid array, chip-scale package (CSP), bare die or direct-chip attach (DCA), wafer-level packaging, and multichip package (MCP) technologies, including stacked-chip packages.

 

Section 16. IC Economic Issues

Minimizing costs is the primary driving force in the IC manufacturing industry. Advances in technology are needed to satisfy the requirements of leading-edge electronic systems. However, when an IC producer is confronted with the choice of using the most advanced technology or keeping costs under control, the decision almost always leans toward minimizing costs. This section covers several trends relating to the cost of designing and manufacturing ICs, such as R&D costs, IC fabrication facility costs, wafer costs, defect density and yield, and packaging costs.

IC Economic Issues

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site: The McClean Report.

 

 

DRAM, China, and Leading-Edge Foundry Driving IC Industry in 2014