Friday, July 31, 2015

Trending Terms Covering the Newest Emerging Technologies

What’s relevant for today’s OEM, EMS or ODM Company?


Each year, a new slew of terms and definitions become common place in the manufacturing process. To meet these needs, T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.


PURCHASE IPC T-50M NOW


IPC-T-50M

Terms and Definitions for Interconnecting and Packaging Electronic Circuits


 


IPC T-50M brings over 150 new terms, while eliminating out-of-date terminology in order to provide a streamlined standard that focuses on the trending language of the electronics industry. This revision includes terms often cited in other standards, such as:


  • Conformal coating

  • Statistical Process Control

  • Stencil Design

Stay up to date with the trending terms covering the newest emerging technologies. Prepare for tomorrow’s discussions by purchasing T-50M today.


 


 



Trending Terms Covering the Newest Emerging Technologies

What Benefit Do IPC Standards Have For The Electronic Hardware Supply Chain?

For more than 50 years, IPC has developed industry standards for the production of electronic hardware. After having been long considered North American standards, IPC standards over the past two decades have spread globally. The question now is: what benefit do IPC standards have for the electronic hardware supply chain?


Providing answers to that question, several companies in Europe representing electronic design, CAD, bare board production, assembly and soldering explain how they use IPC standards in their daily business routines.


This first article covers electronic design/CAD company, GED GmbH, located 30 km southeast of Cologne in Germany.


First experience with IPC standards


GED offers PCB design and engineering and, through the assistance of external subcontractors, bare board, assembly and test services. Currently the company has 14 employees and CAD systems from six different layout vendors. With these resources, the company produces 160 new PCBs and 80 updates per year for rigid, flex, flex-rigid and HDI boards for customers in Germany, Italy, Sweden, the Netherlands, France and the Czech Republic.


From its establishment in 1986 to the middle of the 1990s, the company used its customers’ internal standards from companies such as Siemens, Philips, Rheinmetall and Thyssen. This meant that a different standard was used for every customer. An example of this frustrating situation, says Hanno Platz, owner and managing director, “was when we received an inquiry from Hewlett Packard in Germany with an attachment of 100 pages of requirements for the PCB in question.” At that time, the staff did not know about IPC and its standards. In 1995, the company had a U.S. customer that demanded that the assembly and soldering of a back plane, developed and produced in Germany, be conducted at their U.S. premises according to IPC-A-610, Acceptability of Electronic Assemblies, Class 3 acceptance criteria.


Technology focused on standards


GED found IPC standards through FED, a local German organization with a long-time relationship with IPC, and bought first set of IPC standards. The back plane could now be designed and produced according to IPC standards. Having standards from different areas of the production chain that linked together was a new and positive experience for the company. The staff now regularly discusses how to use IPC standards in their own designs as well as in the purchasing process of bare boards plus assembling and soldering.


Currently, all employees have passed CID (Certified Interconnect Designer) and CID+ (Advanced Certified Interconnect Designer) and are familiar with nearly all IPC standards for electronic design and CAD. All of their order acknowledgments for designing a complete PCB include the following statement, “If nothing else has been agreed upon, PCBs will be manufactured according to IPC standards and its Class 2 acceptance criteria.”


At GED, designers also create PCB layouts. Today, most new PCBs are HDI (high density interconnected) with a high SI (signal integrity) level including high EMC (electromagnetic compatibility). IPC standards have an important influence on these complex boards. The company uses the following IPC standards in their design work:


  • The IPC-2220 PCB design series for mechanical properties of track, isolation and PTH (plated-through holes)

  • IPC-2223B, Sectional Design Standard for Flexible Printed Boards for flex-rigid PCBs and questions like adhesive type, placement of a flex layer into the rigid part and coverlay dimensions

  • IPC-7351A, Generic Requirements for Surface Mount Design and Land Pattern Standard for footprint (land) design, which is even more important than before because of lead-free processes, especially when components like CSPs (chip scale packages) and QFNs (quad flat no leads) are specified in the BOM list.

  • IPC-A-610F, Acceptability of Electronic Assemblies for acceptability of solder joints and assemblies

  • IPC-2251, Design Guide for the Packaging of High Speed Electronic Circuits and IPC-2141A, Design Guide for High-Speed Controlled Impedance Circuit Boards.With the need to comply with EU Directive 2004/108/EC, and its requirements for high EMC on all PCBs placed in the EU market, SI has become more critical. These standards assist GED designers in selecting microstrip or stripline build up for impedance.

Tool with benefit


The company’s ISO 9002 certification states that Deutsches Institut für Normung e.V. (DIN) and IPC standards serve as the foundation for quality work. IPC standards are required as a tool when the company uses external vendors for bare boards and assembly. For all potential suppliers in Europe, the staff conducts company visits that include an audit of the bare board supplier and their use of IPC standards, especially the IPC-6010 board manufacturing series and IPC-A-600H, Acceptability of Printed Boards. According to Platz, “After visiting hundreds of bare board suppliers, we’ve concluded that the majority of suppliers understand IPC standards but very few can make boards according to IPC Class 3 acceptance criteria. This is absolutely something that needs to improve.”


According to GED, IPC standards are the basis of electronic product quality and reliability. In the design process, technical parameters like choice of base material, pad sizes, spaces/traces and isolation distances between layer and component pitches are constant considerations. The use of IPC standards makes it much easier to find solutions. Without IPC standards, the alternative can involve high repair/touch up costs and lots of scrap but also an imperfect electronic product from a quality and reliability point of view. In some cases, this has been a very costly experience for the company’s customers that have not used IPC standards. Platz gives two examples:


Example 1: Working to improve EMC capabilities on a PCB, a designer placed via holes directly in surface mount pads. The result was years of solder and wetting problems with only an 80 to 90 percent yield and difficult repairs. The designer, by not following the standard, placed vias in a pad that was too tight. The profit loss over several years was estimated to be 50,000 to 60,000 Euros. The company was ultimately able to solve the problem by redesigning via hole placement that improved EMC properties.


Example 2: A complex 12-layer HDI board with BGA components on both sides needed to be manufactured using a lead-free process. After the transfer, yield went down to 50 percent. The reason: wrong design parameters and bad layer configurations were used and pads too small for via holes were created. With a higher lead-free solder temperature, many irreparable barrel cracks were created in via holes. The total loss due to the 50% yield in the lead-free process was more than 100,000 Euros.


For GED, IPC standards have been an invaluable tool over the past two decades. IPC standards not only save money, they also make it easier to communicate with bare board suppliers and assembly companies across the world. IPC standards can significantly reduce mistakes and improve end-product quality and reliability.



What Benefit Do IPC Standards Have For The Electronic Hardware Supply Chain?

Wednesday, July 29, 2015

The Global Printed Electronics Market Sector Witness Miniaturization

The miniaturization of electronic devices is an upcoming trend in the global electronics market, specifically in the category of printed electronics. The technological advancements which are the primary key drivers of miniaturization of electronic devices have led the market with their efficient developments resulting in more compact and flexible electronic devices.


In that case, printed electronics solutions are considered as the perfect solution for miniaturization in the industry. With the help of this technology, giant companies in the electronics industry can now develop multifarious devices varying in different sizes and materials. Printed devices are robust, efficient in performance – consuming low power, and moderately priced. As a result, worldwide manufacturers have been increasingly approving of printed electronics technology for their particular industrial products.


There are many companies that act as the major key players in the Global Printed Electronics industry, and they are namely NTERA Inc., T-Ink Inc., Novacentrix., and Conductive Inkjet Technology. Speaking of the major drivers in the industry, the increasing need for eco-friendly electronic products is another key driver in the domain of electronics. As printed electronic products use non-hazardous raw materials for producing different electronic devices, it becomes more suitable for the technology to get incorporated with other eco-friendly electronic products.


The Global Printed Electronics market is expected to revolutionize the industry by introducing innovative and low cost products that can be manufactured with traditional silicon-based electronics techniques. The drivers for global printed electronics market are low manufacturing cost and its applicability in variety of substrates. The global printed electronics market is expected to grow at an estimated CAGR of 38% from 2012 to 2018. In Printed electronics industry, screen printing captures maximum share owing to its wise deployment whereas most applications are available in printed photovoltaic (PV) due to the rising demand for alternative energy sources globally.


Learn more about printed electronics market and publications that provide informed perspective and relevant analysis of emergent technologies.



The Global Printed Electronics Market Sector Witness Miniaturization

Global Market for Optical Network Semiconductor Components to Reach $7.6 Billion in 2019

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Optical Network Components: Global Markets”.  This study reveals that the ongoing migration from lower speed to higher speed connections is providing optical network component suppliers with a recurring revenue stream. Optical network semiconductors will witness an increase from $6.4 billion in 2014 to $7.6 billion in 2019, registering a 3.2% rise in compound annual growth rate (CAGR). The result is that optic components will continue to be an area of prime interest to silicon suppliers.


Advances in wafer and silicon technology have enabled chip manufacturers to squeeze complex functions onto much smaller spaces. They have also been able to put increased functionality into these chips. As a result, optical components continue to be an area of prime interest for semiconductor suppliers. These new semiconductors offer users a number of benefits— more functionality, simpler deployment, and support for higher speed.


Businesses and individuals have developed new applications to take advantage of high-speed, multimedia-friendly transmissions. In the healthcare industry, high-speed optical connections are dramatically improving patient care. Medical imaging is becoming more granular and new applications are emerging. In the data center, optic connections are altering the design of IT systems. Consolidated systems are becoming more common and cloud computing will gain demand.


Optical Network Semiconductor Components: Global Markets

GLOBAL OPTICAL MARKET SEGMENT REVENUES, 2013-2019 ($ MILLIONS)


Optical Network Components: Global Markets analyzes and forecasts market trends in each segment of the optical semiconductor market, delineates technology trends, and identifies market leaders. Forecasts are presented for user requirements, current buying patterns, and expenditure trends from 2014 through the year 2019.


 


 


Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: Optical Network Components: Global Markets.


Optical Network Semiconductor Components Market – Partial List of Tables


Table 1 : IP TRAFFIC PER MONTH, THROUGH 2018


Table 2 : IP TRAFFIC BY MARKET SEGMENT PER MONTH, THROUGH 2018

Table 3 : PER PORT WLAN PRICING TRENDS, THROUGH 2019

Table 4 : FORECAST FOR MARKET SHARE OF OPTICAL COMPONENTS BY CATEGORY, 2014 AND 2019

Table 5 : FORECAST FOR GLOBAL MARKET FOR OPTICAL COMPONENTS BY PRICE AND REVENUE, THROUGH 2019

Table 6 : TOP FIVE OPTICAL COMPONENT SUPPLIERS, 2019

Table 7 : NUMBER OF INTERNET USERS WORLDWIDE, 1993 TO 2014

Table 8 : GLOBAL INTERNET BACKBONE TRAFFIC PATTERNS, 1990-2014

Table 9 : INTERNET USAGE STATISTICS BY WORLD REGION, 2012

Table 10 : WIRELESS USAGE PATTERNS BY TYPE, 2014

Table 11 : CELLULAR NETWORK SUBSCRIBER GROWTH, 2010-2014

Table 12 : TOP TEN WIRELESS CARRIERS BY NUMBER OF SUBSCRIBERS, 2014

Table 13 : SONET/SDH DATA RATES AND LINE SPEEDS

Table 14 : STRUCTURE OF AN ATM CELL

Table 15 : GLOBAL MARKET FORECAST FOR TELECOMMUNICATIONS OPTICAL COMPONENTS, THROUGH 2019

Table 16 : TOP FIVE TELECOMMUNICATIONS OPTICAL COMPONENTS SUPPLIERS, 2014

Table 17 : GLOBAL MARKET FORECAST FOR 100G TELECOMMUNICATIONS OPTICAL COMPONENTS, THROUGH 2019



Global Market for Optical Network Semiconductor Components to Reach $7.6 Billion in 2019

Monday, July 27, 2015

Can "Make in India" become sustainable for Indian Semiconductor manufacturing sector with coming macroeconomic changes in 2015?

The semiconductor manufacturing is most capital intensive business and it is very important to make these investments sustainable in short term in order to ensure profitability in long term. Sustainability of the semiconductor wafer fabs involves being able to keep the fabs in operation 24×7 to reduce the tool idle time and manufacturing semiconductor wafers that meet the growing demand for consumer electronics and military needs.


My recently released book “Mass Capitalism: A Blueprint for Economic Revival”, takes you through the journey of semiconductor manufacturing in U.S. semiconductor industry. The high cost of manufacturing and keeping track with the International Technology Roadmap for Semiconductors (ITRS) to keep up with progress of Moore’s law forced offshoring of IC packing industry, design engineering services and eventually even the manufacture of semiconductor wafers from United States to Asia. These policies of globalization have resulted in rising trade deficits for the U.S. The replacement of manufacturing sector with relatively low paying service sector jobs has resulted in falling incomes and depreciating middle class in the U.S.


In this way globalization of semiconductor manufacturing resulted into a loss of dominance of the U.S. semiconductor industry and started to make this capital intensive as well as knowledge intensive business unsustainable leading to an early demise of Moore’s law (due to economic limits because of huge capital investments) because of poor return on investments due to poor domestic consumer demand. Since the 2008 financial crisis, the U.S. has been trying to revive its economy by lowering its bench mark interest rates close to 0% and following Quantitative Easing (QE) policies to stimulate its economy. Instead of reviving the economy by boosting domestic consumer demand, the QE policies have instead resulted into growing income disparity as the wages of the middle class haven’t been growing to boost consumer demand.


The growth in domestic demand from increased consumer borrowing due to low interest rates is unsustainable as interest rates cannot remain low forever. Additionally, the low interest rates have not increased domestic investments in the U.S. and instead investors have preferred to get better returns on their investments by investing in countries with higher interest rates like India. Hence, Low bench mark interest rates in developed economies like U.S. and Europe have primarily benefited the wealthy individuals in helping them get cheaper loans on mortgage properties and helping them earn higher incomes through renting these properties. These monetary policies haven’t encouraged the easy money from QE to get invested in domestic economy as investors have preferred to invest for higher yields in countries like India. Hence, QE policies have not been able to solve the problem of unemployment in the U.S. and has mostly created low paying and part time jobs in U.S.


Now that the QE has come to an end and the Fed is on track to raise its rates in mid 2015, the following macroeconomic changes are certain. First, the rising bench mark interest rates will not be able to lure U.S. residents into increased borrowing for mortgaging cars and houses. Additionally, When interest rates rise, the investors who have invested for short term gains in countries like India will move their investments for higher yields to the U.S.. This would put a sudden strain on the Indian rupee (INR). Hence, the net result of rising rates in the US with present monetary policy would be a poor domestic consumer demand in U.S. from decreased borrowing and strain on economies of developing countries like India through rising inflation. These changes would cause a rise in value of USD and depreciation of INR.


The net result would be a rising inflation in India as investors looking for better gains would rush to U.S. for higher returns. The largest withholders of U.S. FOREX viz. China has signed currency swap deals with its major trading partners and performs transactions in Yuan instead of USD. Hence, although USD will rise from foreign investments, U.S. will not be able to reduce its trade deficits through exports as US manufactured goods would become expensive in international markets. As there will be no major buyers for US debt due to bypassing of USD by major withholders of US Forex like China and Russia, the only way ahead forward for the Fed is to reform its current monetary policy so that wages keep track with employee productivity which would reduce US budget deficits. The U.S. has also recently imposed huge tariffs on solar goods from China and Taiwan to boost its domestic manufacturing. Eventually, U.S. will also have to impose tariffs on all foreign goods entering the U.S. to eliminate its trade deficits for revival of domestic manufacturing industry. Without reforming its trade and monetary policies to reduce its trade and budget deficits, any rise in value of USD with rise in Fed’s bench mark interest rates would result into an increase in US twin deficits which would also cause an increase in supply of goods into the an economy, which is suffering from a poor economic demand. This would cause a crash in profits of those corporations when their manufactured goods remain unsold and thereby also crashing the US stock market.


Taking these macroeconomic changes into consideration, India has following things to worry about its “Make in India” plan. The plan to lure foreign investors into India to make India a global semiconductor manufacturing hub like China could fail, if any of these investors are looking for short term gains, as semiconductor investments are long term strategic investments. These investments pay off for any country over a long term and not a short term investments that yield a quick return on investments like financial sector of today’s economy. Hence, Just like TSMC Inc. gets its financial backing from government of Taiwan, Samsung Inc. gets its financial backing from government of South Korea and Globalfoundries Inc. gets backing from government of Abu Dhabi, the upcoming Indian semiconductor fabs should also be sponsored with backing of government of India to make these capital intensive investments sustainable. This approach would minimize any chances of these capital intensive investments becoming unsustainable when investors move their investments out of India for their short term gains due to rise in US interest rates.


These huge capital investments into semiconductor wafer fabs can become sustainable only if there is a solid economic demand for these semiconductor wafers in Indian electronics industry because the economic demand is presently slowing in developing economies. However, If Indian government policies do not encourage consumption of domestic manufactured products and hence if import of foreign manufactured goods continue due to India’s Free trade policies, the trade deficits of India will continue to soar. The government recently passed some strict guidelines to all ministries asking them to give preference to domestically manufactured electronic products. This is a positive step forward aimed at boosting electronics production as part of Prime Minister Narendra Modi’s “Make in India” drive. If trade deficits are allowed to soar, these deficits will put a further strain on already troubled INR. Additionally, the products manufactured by Indian fabs will get consumed domestically only if the wages of Indian citizens keep track with their productivity. This free market monetary policy would also ensure a robust consumer demand for electronic goods in order to keep the fabs in operation 24×7 thereby reducing the idle time of tools. The potential of fabless semiconductor ecosystem in its ability to grow small businesses should be adopted by “Make in India” movement. In this process several macroeconomic reforms should also be advocated because an absence of these macroeconomic reforms have made the fabless semiconductor ecosystem unsustainable for the U.S. contributing to its twin (trade and budget) deficits.


To ensure a good return on its investments by being able to create domestic jobs and to minimize the job loses in economic downturns, a three tier fabless semiconductor business model with decentralized supply chains as proposed in “Mass Capitalism: A Blueprint for Economic Revival” should be adopted by Indian semiconductor industry. This would usher in a competitive free market balanced economy and help Indian economy transition from a developing economy to a developed economy. The trade and budget deficits would be eliminated and ever increasing huge capital investments would make this highly capital intensive business not just sustainable but also very profitable. This is a free market approach to make the investments in semiconductor fabs a success so that India can keep its 2020 projected $400 billion account deficits under control and ensure that its semiconductor manufacturing sector is able to keep track with progress of Moore’s law.


Economy also moves in a systaltic fashion and never in a straight line. Due to this systaltic motion, internal clash and cohesion take places giving rise of economic cycles. The ups and downs of socio-economic life in different phases are sure to take place due to this systaltic principle. Having a balanced economic model will also eliminate the problem of unemployment in economic downturns. In this way excess government spending in economic downturns can be eliminated achieving a true free market economic model for semiconductor industry.


About Apek Mulay


Apek Mulay is CEO of Mulay’s Consultancy Services, a senior analyst and macroeconomist in the United States semiconductor industry and author of the new book, “Mass Capitalism: A Blueprint for Economic Revival.” He attended the University of Mumbai in India and later completed his master’s degree in electronics engineering at Texas Tech University. Mulay is the author of the patent “Surface Imaging with Materials Identified by Colors” during his employment at Texas Instruments Inc., and he has chaired technical sessions at International Symposium for Testing and Failure Analysis (ISTFA) for consecutive years. The U.S. government approved his permanent residency under the category of foreign nationals with extraordinary abilities in science and technologies. www.ApekMulay.com



Can "Make in India" become sustainable for Indian Semiconductor manufacturing sector with coming macroeconomic changes in 2015?

Finding Success in the New IoT Ecosystem: Market to Reach $3.04 Trillion and 30 Billion Connected "Things" in 2020

A newly released IoT ecosystem forecast provides much needed clarity, defining the hardware, software, services, connectivity, and security that make up the evolving IoT ecosystem. The worldwide IoT market is forecast to grow from $1.3 trillion in 2013 to $3.04 trillion in 2020 with a compound annual growth rate (CAGR) of 13%.


While most everyone agrees that the Internet of Things (IoT) is poised for explosive growth and represents boundless opportunities – billions of connected things driving trillions in revenue – understanding where the revenue opportunities lie across different technology layers has remained elusive.


The Internet of Things is defined as a network of networks of uniquely identifiable endpoints (or “things”) that communicate without human interaction using IP connectivity – be it “locally” or globally. IDC’s view of the IoT ecosystem includes intelligent systems, network equipment, connectivity services, data integration, and often other types of software, applications, services and security. As IoT moves beyond the hype and promise, a variety of vendor strategies and key players will emerge to find success in meeting customers’ needs as well as growing new revenue streams from this net new market opportunity.


“The opportunities presented by IoT are driving widespread attention among both traditional and non-traditional ICT vendors looking to take advantage of emerging revenue opportunities,” said Vernon Turner, Senior Vice President, Enterprise Infrastructure, Consumer, Network, Telecom and IoT Research. “We’re still in the early stages of maturation and IoT represents unparalleled opportunity in government, consumer, and enterprise environments.”


The homogeneity of connectivity needs has allowed the North American market to sidestep border-driven IoT adoption challenges and set the groundwork for IoT market growth. In addition, government mandates and more openly eco-conscious cultures will drive Western Europe and Asia/Pacific to outpace North America in terms of IoT revenues and installed base through 2020.


“There will be no one leader in this market,” said Carrie MacGillivray, Vice President, IoT and Mobile Service & Infrastructure. “The market will rely on partnerships, federation, and innovative services to create truly valuable IoT solutions.”


Additional findings from new IoT ecosystem market forecast include the following:


  • In the IoT market, a collection of vendors, service providers and systems integrators must co-exist and integrate products and solutions to realize success.

  • The installed and connected base of IoT units will reach approximately 30 billion in 2020.

  • Startup vendors are working feverishly to carve out their strategies to attack this market and will drive the innovation pace of larger vendors.

The new study, Worldwide Internet of Things 2014-2020 Forecast: Forecast Update and Revenue by Technology Split, analyzes the Internet of Things (IoT) market at a worldwide level and provides forecasts for IoT installed base and revenue opportunity by technology segment as well as by region. It provides an update to the worldwide IoT market outlook published in Worldwide and Regional Internet of Things (IoT) 2014-2020 Forecast: A Virtuous Circle of Proven Value and Demand (May 2014). It updates the worldwide IoT units installed and revenues. The full breadth of the IoT ecosystem revenue is put forth in the revenue forecast, encompassing revenue from the IoT system shipments themselves as well as revenue from connectivity, infrastructure, purpose-built IoT platforms, applications, security, analytics, storage, servers and services attributable to the base of installed IoT systems. The study discusses the key themes contributing to and characterizing the worldwide and regional growth of the IoT.


 



Finding Success in the New IoT Ecosystem: Market to Reach $3.04 Trillion and 30 Billion Connected "Things" in 2020

Friday, July 24, 2015

IPC A-610 PDF Download - Acceptability of Electronic Assemblies

IPC-A-610F is the latest revision of the most widely used electronics assembly standard in the world.


IPC A-610F  is now available from Electronics.ca Publications.  A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through full-color photographs and illustrations. Topics include flex attachment, board in board, part on part, lead free, component orientation and soldering criteria for through-hole, SMT (new termination styles) and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements.


IPC-A-610F is invaluable for all inspectors, operators and trainers. Revision E has 809 photos and illustrations of acceptability criteria-165 of them new or updated. This revision has been critically reviewed for clarity and accuracy. The document synchronizes to the requirements expressed in other industry consensus documents and is used with the material and process standard IPC J-STD-001.  For a more complete understanding of this document’s recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001, IPC-AJ-820, and IPC J-STD-001.


When IPC-A-610 is cited or required by contract as a standalone document for inspection and/or acceptance, the requirements of IPC J-STD-001 ‘‘Requirements for Soldered Electrical and Electronic Assemblies’’ do not apply unless separately and specifically required. In the event of conflict, the following order of precedence applies:


1. Procurement as agreed and documented between customer and supplier.

2. Master drawing or master assembly drawing reflecting the customer’s detailed requirements.

3. When invoked by the customer or per contractual agreement, IPC-A-610.


When documents other than IPC-A-610 are cited, the order of precedence shall be defined in the procurement documents. Criteria are given for each class in four levels of acceptance: Target Condition, Acceptable Condition, and either Defect Condition or Process Indicator Condition.


IPC-A-610 PDF Download

IPC-A-610F PDF Download


Details of the IPC A-610F PDF, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  Download  IPC A-610 Acceptability of Electronic Assemblies now.


 


 



IPC A-610 PDF Download - Acceptability of Electronic Assemblies

Worldwide ROADM Market Will Grow From $5.4 billion in 2015 to $8.8 Billion in 2020

Network Transmission Market Report and Analysis of Proposed Nokia / Alcatel-Lucent Merger


Nokia has recently announced that it is buying French telecom equipment maker Alcatel-Lucent for $16.6 billion. The merger of Nokia and Alcatel-Lucent will no doubt change the competitive landscape of the optical networking industry. A new report provides a quantitative forecast of a major part of the optical networking market that Nokia is buying into from its proposed purchase of Alcatel-Lucent.


According to a new market report “Network Transmission Market Analysis and Equipment Forecast: ROADMS, DWDM, Routers and Switches and the Impact of Net Neutrality”, the worldwide ROADM market will grow from $5.4 billion in 2015 to $8.8 billion in 2020. In addition to the ROADMs market, the report provides detailed analysis and forecasts for DWDM, Routers, and switches in North America and Worldwide.


This report is focused on forecasting demand for specific types of carrier-class network transmission equipment: ROADMS, DWDM, Routers and Switches.


To make that forecast it will investigate the demand parameters of this situation, which are primarily traffic forecasts. After reviewing the regulatory climate (Net Neutrality), and the market demand, the Report will look at capital expenditure forecasts as a surrogate for Supply. Then it will provide forecasts for various classes (ROADMs, DWDM, Routers and Switches) of optical network equipment in this environment.


Network Transmission Market Analysis Provides:


  • Equipment descriptions and sales forecasts for ROADMS, DWDM, Routers, and Switches through 2020.

  • A discussion of Net Neutrality, the players, the issues, and its impact on equipment sales.

  • Traffic forecasts for the North American Internet through 2020

  • N.A. and World forecasts for Mobile Traffic, Advanced Access Architecture lines(FiOS, U-Verse, Google), High-Speed lines (XDSL and cable modems) and International Traffic (North America only) through 2020.

  • Capital Expenditure forecasts for the major telecom companies through 2020.

  • Listing of Major Vendors in the Transmission Equipment space.

This report covers the very current topic of Network Neutrality, which is much in the headlines as this is being written, and its forecasted impact on network equipment sales.


Network Transmission ReportThe study also examines the network traffic and, through analysis, shows that traffic from four major sources (AAA lines, H-H lines, Mobile lines and International) is responsible for the vast preponderance of traffic and traffic growth. Forecasts are provided (through 2020) for these classes of traffic and for the Internet as a whole. Based on the information from the traffic forecasts, the uncertainty from regulation (Net Neutrality) and the capital investment plans and forecasts, the Report will then provide equipment sales forecasts (units and dollars) for ROADMs, DWDM, Routers, and Switches (all carrier class) through 2020 for North America and for the World. Detailed descriptions of each type of equipment being forecast is also provided.


 


 


 



Worldwide ROADM Market Will Grow From $5.4 billion in 2015 to $8.8 Billion in 2020

Wednesday, July 22, 2015

Worldwide ROADM Market Will Grow From $5.4 billion in 2015 to $8.8 Billion in 2020

Network Transmission Market Report and Analysis of Proposed Nokia / Alcatel-Lucent Merger


Nokia has recently announced that it is buying French telecom equipment maker Alcatel-Lucent for $16.6 billion. The merger of Nokia and Alcatel-Lucent will no doubt change the competitive landscape of the optical networking industry. A new report provides a quantitative forecast of a major part of the optical networking market that Nokia is buying into from its proposed purchase of Alcatel-Lucent.


According to a new market report “Network Transmission Market Analysis and Equipment Forecast: ROADMS, DWDM, Routers and Switches and the Impact of Net Neutrality”, the worldwide ROADM market will grow from $5.4 billion in 2015 to $8.8 billion in 2020. In addition to the ROADMs market, the report provides detailed analysis and forecasts for DWDM, Routers, and switches in North America and Worldwide.


This report is focused on forecasting demand for specific types of carrier-class network transmission equipment: ROADMS, DWDM, Routers and Switches.


To make that forecast it will investigate the demand parameters of this situation, which are primarily traffic forecasts. After reviewing the regulatory climate (Net Neutrality), and the market demand, the Report will look at capital expenditure forecasts as a surrogate for Supply. Then it will provide forecasts for various classes (ROADMs, DWDM, Routers and Switches) of optical network equipment in this environment.


Network Transmission Market Analysis Provides:


  • Equipment descriptions and sales forecasts for ROADMS, DWDM, Routers, and Switches through 2020.

  • A discussion of Net Neutrality, the players, the issues, and its impact on equipment sales.

  • Traffic forecasts for the North American Internet through 2020

  • N.A. and World forecasts for Mobile Traffic, Advanced Access Architecture lines(FiOS, U-Verse, Google), High-Speed lines (XDSL and cable modems) and International Traffic (North America only) through 2020.

  • Capital Expenditure forecasts for the major telecom companies through 2020.

  • Listing of Major Vendors in the Transmission Equipment space.

This report covers the very current topic of Network Neutrality, which is much in the headlines as this is being written, and its forecasted impact on network equipment sales.


Network Transmission ReportThe study also examines the network traffic and, through analysis, shows that traffic from four major sources (AAA lines, H-H lines, Mobile lines and International) is responsible for the vast preponderance of traffic and traffic growth. Forecasts are provided (through 2020) for these classes of traffic and for the Internet as a whole. Based on the information from the traffic forecasts, the uncertainty from regulation (Net Neutrality) and the capital investment plans and forecasts, the Report will then provide equipment sales forecasts (units and dollars) for ROADMs, DWDM, Routers, and Switches (all carrier class) through 2020 for North America and for the World. Detailed descriptions of each type of equipment being forecast is also provided.


 


 


 



Worldwide ROADM Market Will Grow From $5.4 billion in 2015 to $8.8 Billion in 2020

Market Demand for Surge Protection Devices

Electronics.ca Publications announces the release of a comprehensive global report on surge protection devices market. The global market for Surge Protection Devices (SPDs) is forecast to reach US$2.4 billion by 2020, driven by the growing need to protect sensitive electronic equipment from power fluctuations.


Global Surge Protection Devices Market Report


Surge protection devices such as transient voltage surge suppressors and surge arrestors are growing in importance, given the billions of dollars of losses caused by voltage fluctuations and power line abnormalities. Widespread use of sophisticated electrical, electronic communication and data equipment is driving the importance of power management solutions including SPDs, in both developed and developing economies. Proliferation of home appliances, personal computers, heating and air conditioning equipment in residential homes, and installation of high-end industrial electronic equipment in manufacturing plants are driving growth in the market. Future growth in the market will continue to benefit from the increasing use of electronics in the rapidly growing world telecommunication industry.


The commercial end-use sector is expected to witness strong growth in the coming years. With nationwide alternate energy programs gaining popularity in Germany, China and other major economies, demand for surge protectors is expected to gain strength. Substitution of conventional coil and core street lamps with light emitting diodes for outdoor lighting is also opening up new growth avenues for SPD manufacturers. Miniaturization and clock speeds of microprocessors as dictated by Moore’s Law comes at a price, namely higher sensitivity of the chips to power transients, electromagnetic interference, radio frequency interference and electrical field transients. The increasing sensitivity of modern electronic devices to even split-second electricity fluctuations bodes well for sales of SPDs. The global market for SPDs is extremely competitive characterized by a high degree of fragmentation, and pricing pressures. The relatively commoditized SPD technology leaves very little scope for differentiation. Pure-play SPD manufacturers face stiff competition from large diversified electrical equipment makers.


As stated by the new market research report on Surge Protection Devices (SPDs), the United States represents the largest market worldwide. Developing countries are forecast to spearhead future growth in the market led by mounting issues related to stable power supply. Escalating demand for energy as a result of robust pace of economic development and industrialization, inefficient energy infrastructure and power shortages, are key reasons responsible for poor power quality in these countries. Asia-Pacific, led by China and India, is forecast to witness the strongest growth over the analysis period. Key factors driving growth in the region include the growing consumer appetite for expensive electronic devices, and migration of industries towards digitization and automation of production and business processes.


Major players covered in the report include Advanced Protection Technologies Inc., Belkin international Inc., DEHN + SONS GmbH + Co. KG, Eaton Corporation PLC, Emerson Electric Co., GE Industrial Solutions, Hubbell Incorporated, Koninklijke Philips N.V., Legrand SA, Leviton Manufacturing Co. Inc., Nexus Industries Ltd., Novaris Pty Ltd., OBO BETTER MANN GmbH & Co. KG, Panamax LLC, Phoenix Contact GmbH & Co. KG, REV Ritter GmbH, Schneider Electric SA, Smiths Interconnect, Shenzhen Dowin Lightning Technologies Co. Ltd., Thomas & Betts Power Solutions LLC, Tripp Lite, and Weidmüller GmbH & Co. KG, among others.


The research report titled “Surge Protection Devices (SPDs): A Global Strategic Business Report“, provides a comprehensive review of market trends, growth drivers, challenges, issues, and strategic industry activities of major companies worldwide . The report provides revenue estimates and projections for all major geographic markets, including the US, Canada, Japan, Europe (France, Germany, Italy, UK, Spain, Russia and Rest of Europe), Asia-Pacific (China, India, and Rest of Asia-Pacific), Latin America (Brazil, and Rest of Latin America) and Rest of World. The global and regional markets for SPDs are analyzed in US dollars by the following product types: Plug-In, Hard-Wired, Line Cord, and Power Control Center. The global SPDs market is further analyzed by end-use sectors comprising Communication, Consumer, and Others (includes Industrial, and Healthcare Applications, among others).



Market Demand for Surge Protection Devices

Monday, July 20, 2015

North American Electronics Sales Growth Flat but Outlook is Positive

As of November 2014, sales growth was flat in the bare printed circuit board (PCB) and electronics manufacturing services (EMS) segments of the electronics industry, in sharp contrast to semiconductor sales that continued to skyrocket. U.S. new orders for electronics products, which tend to lead sales by about one month, continued to sag.


IPC’s PCB book-to-bill ratio, which normally leads PCB sales by three to six months, climbed further to 1.06 in November after hovering around 1.00 during most of 2014. Ratios above parity (1.00) indicate greater demand than supply, which may be a precursor of strengthening sales growth in the PCB industry in 2015.


All data cited in this report are based on rolling averages of the past three months, which smooths out some of the volatility in monthly data to show clearer trends.


Electronics Sales Growth


Electronics Sales Growth


Note on the graph:  All indices are based on the same baseline of the average month in 2000=100, and reflect a three-month rolling average.


Sources: IPC statistical programs for the EMS and PCB industries; SIA for semiconductor data; U.S. Census Bureau for U.S. new orders for computer and electronic products.


Learn more about Electronic Contract Manufacturing Services market and publications that provide informed perspective and relevant analysis of emergent technologies.


Electronic Contract Manufacturing Services – Global Strategic Business Report” analyzes the worldwide markets for Electronic Contract Manufacturing Services in US$ Million by the following Product Segments: Consumer Electronics, Computers & Peripherals, Telecommunications, Industrial Electronics, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2013 through 2020. Also, a seven-year historic analysis is provided for these markets. Market data and analytics are derived from primary and secondary research. The report profiles 308 companies including many key and niche players such as –


Altadox, Inc.

Benchmark Electronics, Inc.

Celestica, Inc.

Compal Electronics, Inc.

Creation Technologies LP


 



North American Electronics Sales Growth Flat but Outlook is Positive

Global Silicon on Insulator Market

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Silicon on Insulator Market Technology – Global Forecast to 2020″. The global silicon-on-insulator market is expected to grow at a CAGR of 18.9% from 2014 to 2020. This growth is attributed to the growing smartphone and consumer electronics and the increasing trend of the Internet of Things. The geographic expansion in emerging markets and increasing applications of SOI devices are expected to offer lucrative opportunities for the SOI players in the next six years.



Silicon on Insulator Market

Silicon On Insulator (SOI) Market Size, 2013-2020 ($Million)


Silicon on Insulator has already revolutionized the consumer application industry. Various other SOI applications such as connected cars, consumer electronic products are also evolving and will further drive opportunities for many industry players across the large, complex Silicon on Insulator ecosystem. Huge R&D Investments and government funding in SOI research projects worldwide are driving the growth of the SOI market, especially in the U.S. (Americas), France (Europe), and China (Asia).


This report, based on the extensive research study on the Silicon on Insulator market, is aimed at identifying the major application verticals, where Silicon on Insulator is expected to bring about a game changing revolution in the years to come. The report covers several applications, namely- automotive, computing, entertainment & gaming, photonics, and telecom instruments. The major products that are made out of the SOI wafers are optical devices, RF devices, transistors, MEMS, image sensors, memory devices and others.


Projections with regards to the market size in terms of value have been provided till 2020 for the Silicon on Insulator and its sub-segment markets by application (Automotive, Computing & Mobile, Entertainment & Gaming, Photonics, and Telecom Instruments) and geography (Americas, Europe, APAC and RoW).


This report covers the overall dynamics of the entire Silicon on Insulator market, which includes drivers, restraints, and opportunities along with their impact in the current as well as the future scenario. A detailed analysis of the global SOI market, key current application trends, and emerging trends of Silicon on Insulator are presented in the report.


This report profiles all the major companies involved in the field of Silicon on Insulator such as Applied Material Inc. (U.S.), ARM Holding (U.K.), IBM Corp. (U.S.), Freescale Semiconductors (U.S.), Globalfoundries (U.S.), Shin-Etsu Chemical Co. Ltd. (Japan), Soitec SA (France), STMicroelectronics (Switzerland), SunEdison (U.S.) Synopsis Inc.(U.S.) Taiwan Semiconductor Manufacturing Corp. (Taiwan), and United Microchip Corp. (Taiwan).


Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the reportSilicon on Insulator Market Technology – Global Forecast to 2020.


 


 



Global Silicon on Insulator Market

Friday, July 17, 2015

Global Market for Active Optical Cables is Projected to Surpass US$2 Billion by 2020

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report on the global Active Optical Cables market, covering the industry segments, trends, growth drivers, market share, market size and demand forecasts.  Global market for Active Optical Cables (AOC) is projected to surpass US$2 billion by 2020, driven by bandwidth explosion, expansion of internet infrastructure, and advancements in fiber optics technology.


Need For Bandwidth Drives Demand for Active Optical Cables


Active Optical Cables present an integral part of contemporary data communication platforms. Defined as a cabling solution that provides electrical to optical conversion on cable ends for improved speed and distance efficiency, active optical cables are witnessing tremendous growth. Ever growing need for bandwidth and advancements in cabling technology represent fundamental factors driving growth in the region. Inherent advantages of active optical cables such as lower signal processing, enhanced signal integrity, greater airflow through smaller conduits, and superior flexibility routability and wider reach than conventional copper cables are driving their adoption.


Data Centers represents the largest end-use sector. Growth however, is forecast to come from emerging applications in personal computing, digital signage and Home Theater. Explosive growth in consumer Internet traffic worldwide driven by the surge in demand for mobile data and video services is yielding significant growth in demand for high speed and efficient transmission technologies. The scenario is driving expansion of existing capacity using Active Optical Cables to ensure efficient transmission of data. Traditionally, growth in the AOC market was driven by InfiniBand interface in commercial applications such as supercomputers and server applications. Over the years, the InfiniBand segment moved from the traditional 10G QSFP+ format to 14G FDR QSFP+ fiber optic cables, making it the strongest AOC application till date. Significant opportunities also lie ahead for QSFP and CXP active optical cables with 100 Gbps rate.


As stated by the new market research report on Active Optical Cables, the United States represents the largest market worldwide. Emerging markets are expected to spearhead growth driven by strong economic development and growing adoption of new communication technologies. Asia-Pacific is projected to emerge as the fastest growing regional market with a CAGR of 58.6% over the analysis period.


Major players covered in the report include 3M Company, Avago Technologies, Chromis Fiberoptics Inc., Emcore Corporation, FCI SA, Fujikura Ltd., Hitachi Metals Ltd., Siemon Company, Sumitomo Electric Industries Ltd., and TE Connectivity Ltd., among others.


The research report titled “Active Optical Cables: A Global Strategic Business Report”, provides a comprehensive review of trends, drivers, issues, and strategic industry activities of major companies worldwide. The report provides market estimates and projections for geographic markets such as the US, Canada, Japan, Europe (France, Germany, Italy, UK, Spain, Russia and Rest of Europe), Asia-Pacific (China and Rest of Asia-Pacific), and Rest of World. End-use segments analyzed for the global market include Data Centers, Digital Signage and Others.


Active Optical Cables IndustryDetails of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: “Active Optical Cables: A Global Strategic Business Report“.


 



Global Market for Active Optical Cables is Projected to Surpass US$2 Billion by 2020

Robotics Market Shares And Market Forecasts

Robots — Markets Reach $171.7 Billion By 2020. — ELECTRONICS.CA PUBLICATIONS announces the availability of a new study “Robotics Market Shares, Strategy, and Forecasts, Worldwide, 2014 to 2020″. The 2014 study has 1191 pages, 607 tables and figures. Worldwide robotics markets are increasingly diversified, poised to achieve significant growth as every industry segment adopts mobile automated process new companies get more businesses test for substance abuse. The robots are taking over, they have remote control to control a device to make it do what you want.



Robots in general are poised to change every aspect of modern life. Robots are poised to change everything, what we eat, how we eat it, what we drive, how we drive it, what we manufacture, how we manufacture it, and the military, how we defend ourselves.


Robot technology is based on platforms that leverage sensors, controllers, software modules, cameras, visualization, and locomotors deploying machines for control of all repeatable process. Industrialization is after all the repetition of some task to create process. Robots take this a step further to create automation of process with the ability to move the units.


Robots are promising to improve yields in every industry. Robots make crops safer by eliminating or virtually eliminating herbicides. Downstream processing system solutions and robots achieve automation of process. Robots meet stringent hygiene and safety regulations, work tirelessly 24 hours a day, and relieve human workers of physically arduous tasks. Robots contribute to the freshness, variety and quality of food. Projects are ongoing. Projects are ongoing.


What could be tastier than a fresh picked strawberry, fully ripe, full of juicy appetence, exquisite in every way? Plant factories, grow lights, vertical farming appliances, and robots that make them possible are poised to change the economics of food growing. Robots in general are poised to change every aspect of modern life. Robots are poised to change everything, what we eat, how we eat it, what we drive, how we drive it, what we manufacture, how we manufacture it, and the military, how we defend ourselves.


Robots are set to bring a new industrial revolution more important than anything seen before. Industrial robots perform repetitive tasks efficiently, they do not eat, they do not make mistakes, they do not get tired, they do what they are told, they work 24 hours per day 7 days a week. Manufacturing plants are frequently long aisles of nothing but robots, no human in sight.


Beyond industrial robots that repeat actions, more intelligent robots loaded with sensors are able to automate process using processors and cameras to control action. Use of microprocessors provides a measure of intelligent control over the activity of the robot based on input from the sensors and the cameras.


Tablet apps are congruent technology for all robots, adding platform functionality and providing basic platform controls. There is the potential for standardization so the robotic platforms are congruent, but that has not happened yet. Companies with a presence in tablet markets are poised to benefit enormously from the growth of robot markets. The app software provides a universal mechanism that will permit flexible response to changing market conditions.


According to Susan Eustis, lead author of the WinterGreen Research team that prepared the study, “The opportunity to participate in robotic markets is compelling. This new market is evolving as new automated process based on breakthroughs and innovation in technology is expressed in robotic platforms. Microprocessor technology, optics, cameras, nanotechnology, new materials, thin film batteries, and sensors are among the technologies being put to use in innovative ways in robots. The ability to apply any technology from any company is phenomenal..”


Consideration of Robot Market Forecasts indicates that markets at $53 billion will reach $171.7 billion by 2020. Growth comes as every industry achieves efficiency by automating process robotically. Robots are unique because they can perform multiple steps without human intervention and they can adapt to different conditions and different types of devices to be manipulated. The sensors and the cameras in the robots make them flexible.


Robotics Market Share And Market ForecastsDetails of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report:  “Robots: Market Shares, Strategy, and Forecasts, Worldwide, 2014 to 2020“.


 


 



Robotics Market Shares And Market Forecasts

Wednesday, July 15, 2015

IPC/WHMA-A-620B PDF Download - Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC/WHMA-A-620 is a collection of visual Quality Acceptability Requirements for Cable, Wire and Harness Assemblies.  IPC/WHMA-A-620 can be used as a stand-alone document for purchasing products, however it does not specify frequency of in-process inspection or frequency of end product inspection. No limit is placed on the number of process indicators or the number of allowable repair/rework of defects. Such information should be developed with a statistical process control plan (see IPC-9191).


This publication describes acceptability criteria for producing crimped, mechanically secured, or soldered interconnections and the associated lacing/restraining criteria associated with cable and harness assemblies. It is not the intent of this document to exclude any acceptable procedure used to make the electrical connection; however, the methods used must produce completed assemblies that conform to the acceptability requirements described in this document.


Significant technical updates, greater ease-of-use and compatibility with other key assembly standards are among the many changes users will find in the newly released B revision of IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies. This important industry standard is a joint effort of IPC and the Wire Harness Manufacturers’ Association (WHMA).


The revision addresses more than 500 documented comments and recommendations from users throughout the industry and features 125 new or changed illustrations.


Some of the most extensive changes appear in the molding and potting section, which has been expanded for increased coverage of Class 2 and 3 requirements, including 31 new illustrations. The document also provides new criteria for wires as small as 32 AWG, and has a section on requirements flow down, which requires companies to have their subcontractors use the standard to ensure all hardware is manufactured to the same guidelines.


IPC WHMA A-620B PDF Download

IPC WHMA A-620B PDF Download


IPC/WHMA-A-620B is 400 pages long and features 682 full-color illustrations.  IPC/WHMA-A-620 B is the latest revision of IPC A620,


Purchase and download IPC/WHMA-A-620B standard from Electronics.ca Publications. IPC standards are also available on CD-ROM.


Also Avaliable in Spanish, Chinese, German, Danish, Polish, and French Versions.


 



IPC/WHMA-A-620B PDF Download - Requirements and Acceptance for Cable and Wire Harness Assemblies

Flexible, Organic and Printed Electronics Market Forecast

New market research report, entitled Printed, Organic & Flexible Electronics: Forecasts, Players & Opportunities, provides the most comprehensive view of the topic, giving detailed ten year forecasts by device type. The market is analyzed by territory, printed vs non printed, rigid vs flexible, inorganic vs organic, cost of materials vs process cost and much more, with over 160 tables and figures. Activities of over 1,000 leading companies are given, as is assessment of the winners and losers to come.


The total market for Flexible, Organic and printed electronics will be worth over $70 billion by 2024. The majority of that is OLEDs (organic but not printed) and conductive ink used for a wide range of applications. On the other hand, stretchable electronics, logic and memory, thin film sensors are much smaller segments but with huge growth potential as they emerge from R&D.


Flexible, organic and printed electronics market forecast by component type in US$ billions*


Source: IDTechEx * For the full forecast data please purchase this report


The following components are assessed, and for each one ten year forecasts are given, along with companies and their activities, case studies, impediments to commercialization and timescales:


  • Logic and memory

  • OLED displays

  • OLED lighting

  • Electrophoretic and other bistable displays

  • Electrochromic displays

  • Electroluminescent displays

  • Other displays

  • Thin film batteries

  • Photovoltaics

  • Sensors

  • Conductors

  • Other



If you are looking to understand the big picture, the opportunity, the problems you can address, or how you can start to use these technologies and the implications involved, this report is a must.  Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site: Printed, Organic & Flexible Electronics: Forecasts, Players & Opportunities





Partial list of tables:


 1. Description and analysis of the main technology components of printed and potentially printed electronics

1.2. Current opportunity, market size and profitability

1.3. Market forecast by component type for 2015-2025 in US $ billions, for printed and potentially printed electronics including organic, inorganic and composites

1.4. The different states of readiness of organic and inorganic electronic technologies (semiconductors and conductors)

1.5. Spend on organic versus inorganic materials 2015-2025 US$ billion

1.6. Split of material types by component

1.7. Market value $ billions of only printed electronics 2015-2025

1.8. Total market value of printed versus non-printed electronics 2015-2025 US$ billion

1.9. Market value $ billions of only flexible/conformal electronics 2015-2025

1.10. Total market value of flexible/conformal versus rigid electronics 2015-2025 in US$ billion

1.11. The market for printed and potentially printed electronics by territory in $ billion 2015-2025

1.12. Possible breakdown of the market for printed and potentially printed electronics in 2035 by numbers and value

1.13. Success and failures

2.1. Market forecasts for 2035 in US$ billion

2.2. End user markets relevant to printed electronics

2.3. Leading market drivers 2025

2.4. Some potential benefits of printed and partly printed organic and inorganic electronics and electrics over conventional devices and non-electronic printing in various applications

2.5. Types of printed/thin film photovoltaics beyond silicon compared, with examples of suppliers

2.6. Primary assumptions of organic electronics in full production 2013-2035

3.1. Global market for printed electronics logic and memory 2015-2025 in billions of dollars, with % printed and % flexible



Flexible, Organic and Printed Electronics Market Forecast

Monday, July 13, 2015

The U.S. UAV Market Will Grow to $15 Billion in 2020

“UAV Market Research Study” will assess the size and growth of the total Unmanned Aerial Vehicle market from large DOD UAVs to Do-it-Yourself (DIY) UAVs for amateurs. The study covers the following major market sectors: DOD, Civil, Commercial, Small Unmanned Aircraft Systems (SUAS) , DIY Amateur, and Radio Control. According to this report, the U.S. market will grow from $5 billion in 2013 to $15 billion in 2020. This market will be driven by growth in the commercial and Do-it-Yourself markets.



UAV Market Research Report


Major commercial UAV applications are agriculture, real estate, film-making, oil and pipeline, electric utility, and specialized package delivery. There will be a significant growth in 2015 after the FAA decision on UAV Access to the National Airspace.


This UAV market research report is also a marketing guide for subsystem, components, and other companies unfamiliar with the UAV market. It has been written for the companies in the field and those thinking of entering the field.


UAV Market Research Study – 2014 Edition


UAV Market Report

Unmanned Aerial Vehicle – UAV Market Research Study


Order the “UAV Market Research Study” by the end of July 31st, 2014 to receive 20% discount.  Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report:  UAV Market Research Study – 2014 Edition.


 


 


 


 


 


Table of Contents:


  • Introduction

  • Historical Developments of UAVs

  • Market Description
    • Defense

    • Civil (NASA, Agriculture, NOAA, Homeland Security, Border Control, etc.)

    • Commercial

    • SUAS

    • Do-it-Yourself (DIY) Amateur

    • Radio Control


  • Market Data

  • Market Forecasts

  • Regulations
    • FAA UAS Roadmap

    • FAA Test Facilities

    • Centers of Excellence

    • Foreign Civil Air Authorities


  • Technology
    • Sense and Avoid (SAA)

    • ISR

    • Structural Sensing

    • Propulsion

    • Autonomy

    • Ground Stations

    • Radio Spectrum


  • Standards

  • Applications
    • Agriculture

    • Law Enforcement

    • Real Estate

    • Filmmaking

    • Oil and Pipeline

    • Electric Utilities

    • Package Delivery

    • Search and Rescue

    • Fire Detection and Monitoring

    • Environmental Monitoring


  • Associations
    • AUVSI

    • AMA

    • HMA


  • Test Facilities

  • Systems Supplier Profiles

  • Major Unmanned Vehicle Road Maps

  • Acronyms


The U.S. UAV Market Will Grow to $15 Billion in 2020

Wearable Electronics and Technology Market worth $11.61 Billion by 2020

According to the new market research report “Wearable Electronics and Technology Market by Applications (Consumer, Healthcare, Enterprise), Products (eye wear, wrist wear, footwear), Form Factors and Geography – Analysis & Forecast to 2014 – 2020″ the overall markets estimated to grow at a CAGR of 24.56% from 2014 to 2020, which includes an in-depth analysis of the market by application, product and component, technology, form factor,and geography.


The term ‘Wearable Electronics’ refers to any electronic device or product which can be worn by a person to integrate computing in his daily activity or work and use technology to avail advanced features and characteristics. In simple terms, wearable electronics is used to make routine things easier to perform as well as make life sophisticated by offering several computing features in various day-to-day applications, mainly due to the integration of computing and communication devices. Currently, several types of wearable electronics exist with the development of various types of technologies and advancements in wearable computing.


This report provides a complete quantitative and qualitative information of the global wearable electronics market and all its segments (both – shipments and market revenue wise), and also forecasts the same till 2020. The report analyzes the global market and presents detailed insights on the market when segmented by technology, product,component, application, form factor, and geography. Besides this, detailed analysis on the drivers, restraints, and opportunities of the market are also presented along with an insightful quantitative analysis of Porter’s five forces and their impact on the market.


The global wearable electronics products market revenue is expected to grow roughly at a CAGR of 24.56% and cross $11.61 billion by the end of 2020, with steady sales of wristwear and footwear category, along with the emergence of the small market size for eyewear and bodywear category.


Major players in the market are Samsung Group (South Korea), Sony Corporation (Japan), Adidas AG (Germany), and Nike, Inc. (U.S.), among others.


WearableElectronics

Wearable Electronics and Technology Market 2014 – 202


Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report:  Wearable Electronics and Technology Market by Applications (Consumer, Healthcare, Enterprise), Products (eye wear, wrist wear, footwear), Form Factors and Geography – Analysis & Forecast to 2014 – 2020″



Wearable Electronics and Technology Market worth $11.61 Billion by 2020

Friday, July 10, 2015

Mobile Sensing Wearables Market to Reach $47 Billion in 2018

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Mobile Sensing Wearables – Market Dynamics Report”.  Annual revenues for mobile sensing wearables – fashionable devices that perform sensing and location functions—will be $47 billion in 2018 driven by widespread adoption of advanced mobile sensing smart watches. Wearable sensors enabled by low power wireless components, mobile apps, cloud computing and a receptive fashion industry has created a technology tsunami for developers and investors.


“Over the past two years, wearables have gone from a niche market to a revolutionary force,” says Mareca Hatler, ON World’s research director. “Developers from all major industries are seeing opportunities for sensor enabled wearables, integrated cloud applications and services as well as the next fashion trend.”


Over the next five years, 700 million wearable tech devices will be shipped for a global annual market worth $47.4 billion at this time. Hardware will make up the majority of the revenues during this period but mobile apps and subscriptions will grow faster. The wearables industry will rapidly create new fashion lines and this is where manufacturers will break new ground.


With over 400 unique products, the mobile sensing wearables market tripled in 2013 over the previous year and continues to accelerate with the emergence of new product categories such as smart watches, smart glasses, consumer wearable sensors as well as growing industrial and enterprise solutions. Out of the 70,000 product reviews that ON World evaluated, 60% were completed in 2013 and the first quarter of 2014. Some categories such as smart watches have increased by a factor of ten and personal sensors increased by over 500 percent.


ON World has identified over 50 smart watch vendors including sports watches, luxury watches and offerings for children such as the HereO GPS watch. By contrast, there are only about a dozen smart glasses developers but they are on track to become a $5 billion market by 2017. A few other emerging mobile sensing wearable product categories include bracelets (e.g., Cuff and Netatmo), baby vital sign monitors (e.g., Rest Devices, Owlet and Enmovere) and pet activity/location trackers (e.g., Tagg, Voyce and Whistle). Investment in wearables hardware companies is accelerating with almost $500 million invested in 2013 alone.


Sensor fusion and cloud based software and services has become the next “killer” platform. Nest’s recently launched developer program is already showing the potential for integrating wearables with smart home systems such as Jawbone’s UP fitness tracker with Nest’s smart thermostats.


Mobile Sensing Wearables MarkeDetails of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report:  Mobile Sensing Wearables – Market Dynamics Report.



Mobile Sensing Wearables Market to Reach $47 Billion in 2018

HDD & SSD Industry Market Analysis And Processing Trends

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “The Hard Disk Drive (HDD) and Solid State Drive (SSD) Industry: Market Analysis And Processing Trends“.


Hard-disk drives have been the default storage component in desktop and laptop PCs for decades. As a result, the term “hard drive” is now the common descriptor for all storage hardware. Although modern hard-disk drives are far more advanced and higher-performing than their counterparts from yesteryear, on many levels their basic underlying technology remains unchanged. All hard-disk drives consist of quickly rotating magnetic platters paired with read/write heads that travel over the platters’ surfaces to retrieve or record data.


On many levels, solid-state drives are similar to hard drives. They usually connect to a system by way of the SATA interface (though PCI Express-based drives are also available for ultrahigh-performance applications), and they store files just as any other drive does. SSDs, however, eschew the magnetic platters and read/write heads of hard-disk drives in favor of nonvolatile NAND flash memory, so no mechanical parts or magnetic bits are involved.


Key criteria that differentiate HDDs and SSDs are:


Form factor


Without any moving parts, SSD products are the thinnest of the available storage options. They’re especially good for thin and light PCs and complex, industrial designs. For standard notebooks, SSDs are available in 5mm and 7mm heights. By comparison, HDDs are available in standard 7mm and 9.5mm designs. SSHDs debuted at 9mm, will ship at 7mm soon, and 5mm designs have been announced for shipment in 2013.


Capacity


HDDs are the workhorses when it comes to sheer capacity and how much data can be stored. SSHD technology also offers maximum capacity points at affordable price points while SSDs are only affordable at lower capacities. High-capacity SSDs are extremely expensive.


Speed


SSDs provide peak performance for booting and high read/write performance to supporting computing that requires enhanced multitasking capabilities. On the other hand, an SSHD can provide near SSD performance for booting, launching, and loading data. HDDs usually provide ample performance for the majority of PC platforms shipping today.


Price


At a system level, low-capacity SSDs can be affordable in the 32GB to 64GB range. But high-capacity SSDs are very expensive, especially when measured by cost per gigabyte. HDDs provide the lowest cost per gigabyte. SSHDs provide a cost per gigabyte that’s just slightly higher than HDDs.


Battery life


In general, storage will not impact battery life in a laptop computer by more than about 10%. Processor power and LCD really run down the battery. However, SSD is the most power-efficient, and SSHD is a close second because it can spin down more frequently than an HDD.


Reliability


Failure rates on SSD, HDD, and SSHD technologies have very similar ratings. SSHD has benefits because it uses both the SSD and HDD portions more efficiently than if they were separate.


Durability


SSDs are viewed as more durable simply because of their solid state design. Without moving parts, they can withstand higher extremes of shock, drop, and temperature.


Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: The Hard Disk Drive (HDD) and Solid State Drive (SSD) Industry: Market Analysis And Processing Trends.


SSD Industry Market Analysis  


TABLE OF CONTENTS


Chapter 1 The Disk Drive Market Infrastructure


Chapter 2 The Hard Disk Drive Industry


2.1 Hard Disk Drive Trends 2-1

2.2 Hard Disk Form Factors 2-10

2.3 Hard Disk Drive Market Analysis 2-14

2.3.1 Desktop PCs 2-23

2.3.2 Portable PCs 2-23

2.3.3 Enterprise 2-26

2.3.4 Consumer Electronics 2-26

2.4 Competitive Structure 2-34

2.4.1 HDD Market Share 2-34


Chapter 3 The Solid State Drive Industry


3.1 Solid-State Drives (SSD) Trends 3-1

3.2 Solid-State Drives Market Analysis 3-2

3.2.1 Client SSD Trends and Forecast 3-8

3.2.2 Enterprise SSD Trends and Forecast 3-15

3.2.3 Hybrid Hard Drives (HHD) Forecast 3-20

3.3 3D NAND Forecast 3-23

3.3.1 Comparison of 3D-NAND Structures 3-25

3.4 SSD Capacity Forecast 3-29


Chapter 4 Recording Heads


4.1 Thin Film Read/Write Heads 4-1

4.1.1 Thin Film (TF) Heads 4-2

4.1.2 Magnetoresistive (MR/AMR) Heads 4-2

4.1.3 Giant Magnetoresistive (GMR) Heads 4-4

4.1.4 Colossal Magnetoresistive (CMR) Heads 4-7

4.1.5 Current-Perpendicular-To-Place (CPP) Heads 4-8

4.1.6 Ballistic Magnetoresistance (BMR) Heads 4-8

4.2 Trends 4-10

4.3 Recording Head Market Forecast 4-18


Chapter 5 Processing Trends And Markets


5.1 Head Processing 5-1

5.1.1 Head Fabrication – CMP, Deposition, Lithography 5-6

5.1.1.1 CMP Challenges 5-11

–  Ceria Slurry For Glass Disk Market 5-17

– Oxide Slurry For Metal Disk Market 5-22

– Oxide Slurry For Thin Film Head Market 5-25

5.1.1.2 Lithography Challenges 5-28

5.2 Patterned Magnetic Media 5-31

5.2.1 Conventional Media 5-32

5.2.2 Patterned Media 5-34

5.3 Market Analysis Of Discrete Track Media 5-44

5.3.1 The Perpendicular Recording Movement 5-44

5.3.2 Cost of Ownership (CoO) Analysis 5-59

5.4 NAND Processing 5-65

5.4.1 2D NAND Processing 5-67

5.4.2 3D NAND Processing 5-73

5.4.2.1 Etch Challenges and Market Forecast 5-80

5.4.2.2 Deposition Challenges and Market Forecast 5-81

5.5 3D ReRAM Challenges 5-82


Chapter 3 The Media Market


3.1 Industry Trends 3-1

3.2 Media Profiles 3-5

3.3 Media Market Supplier Shares 3-7


Chapter 4 The Substrate Market


4.1 Platter Substrate Materials 4-1

4.1.1 Aluminum Disks 4-4

4.1.2 Glass Disks 4-6

4.2 Substrate Market 4-11

4.3 Substrate Suppliers 4-16

4.4 Glass Substrate Supplier Shares 4-21


 



HDD & SSD Industry Market Analysis And Processing Trends

Wednesday, July 8, 2015

Connector Industry Report

2014 Connector Industry Forecast provides an in-depth, and detailed forecast of the worldwide connector industry. In addition to the detailed forecasts for each region of the world (North America, Europe, Japan, China, Asia Pacific, and ROW), an industry overview is included which provides current market trends, industry book-to-bill ratios, and outlook narrative. 


Since 1980 the connector industry has experienced four growth business cycles, meaning consecutive years of increases in year-over-year sales. The average growth business cycle in the connector industry is five years. The longest (years without a decline in sales) is eight years (1993-2000).


The downturn of 2011/2012 has somewhat broken the industry mold. The period of growth lasted only 23 months before sales began declining in 4Q11. The downturn, which was over in October 2012, lasted only 12 months. The decline was only -2.7% which is the smallest measured since 1992.


Since 1980, we have achieved twenty-eight years of sales increases and six years of sales declines. The average growth cycle lasts five years, with two years being the shortest growth cycle, and eight years the longest. The industry’s thirty-three year compound annual growth (CAGR) is +5.7%. Only once in thirty-three years has the industry had two consecutive years of sales declines (2001-2002).


In the three industry declines prior to 2001, the years of growth in between the downturns was four, six, and eight years. From the end of the 2001/2 downturn to the beginning of the 2008/9 downturn was 75 months (6.3 years). From the end of the 2008/9 downturn to the beginning of the 2011/12 downturn was 23 months (1.9 years). The decreasing cycle rate may be the result of the increasing inter-dependencies of the world’s economies and our 24/7 processing of news of all types.


Historically we are at the beginning of a fifth growth business cycle that will last another five years on average. Although nothing is certain, it is likely that the next downturn is three or more years down the road, given no unforeseen regional or worldwide calamities. The economies of the world and their governments have gone (and are going) through a major fiscal correction, which should lead to relatively stable times where the growth rates will, in all likelihood, be more modest than they have been after past industry downturns.


Year-over-year sales growth in the next five years is expected to hit a high in 2019, with growth forecast at +7.5%.


2014 Connector Industry Report


connector industry reportWe are forecasting 2014 sales to grow +8.3% to $52,929.7 million. This projected high single digit growth is in line with GDP growth projections by the IMF for the various regions of the world. World sales are up +9.5% through May. Bishop’s forecast +8.3% sales growth for full year 2014 indicates sales demand will soften modestly between now and year end. Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View Connector Industry Report.



Connector Industry Report

Semiconductor Industry and Equipment Markets in China

China is by far the largest consumer of semiconductors; it accounts for about 45 percent of the worldwide demand for chips, used both in China and for exports. But more than 90 percent of its consumption relies on imported integrated circuits. Integrated-circuit companies in China entered the semiconductor market late—some two decades after the rest of the world—and have been playing catch-up ever since in an industry in which success depends on scale and learning efficiencies. The Chinese government made several attempts to build a local semiconductor industry, but none really took hold. Now, however, things are changing on both the business and policy fronts.


Low-cost smartphones designed in China are flooding the market. For instance, Android phones designed in China now represent more than 50 percent of the global market, compared with their negligible presence five years ago. Lenovo’s significant deals early in 2014—first acquiring IBM’s low-end x86-based server business for $2.3 billion and then buying Motorola from Google for almost $3 billion—further suggest that the customer base for hardware is moving to China. Meanwhile, Beijing and Shenzhen have become innovation hotbeds for wearable devices and other connected consumer electronics. Technology companies in these regions are not trailing others in this area of innovation; they are running neck and neck with other early entrants.


Multinational corporations in every industry—from automotive to industrial controls to enterprise equipment—increasingly are establishing design centers on the mainland to be closer to customers and benefit from local Chinese talent. McKinsey’s proprietary research indicates that more than 50 percent of PCs, and between 30 and 40 percent of embedded systems (commonly found in automotive, commercial, consumer, industrial, and medical applications), contain content designed in China, either directly by mainland companies or emerging from the Chinese labs of global players. As the migration of design continues, China could soon influence up to 50 percent of hardware designs globally (including phones, wireless devices, and other consumer electronics).


Fabless semiconductor companies are also emerging in China to serve local customers. For instance, Shanghai-based Spreadtrum Communications, which designs chips for mobile phones, and Shenzhen-based HiSilicon Technologies, a captive supplier to Huawei and one of the largest domestic designers of semiconductors in China, are among the local designers that have shown rapid growth over the past few years.


There has been slower but steady progress among local foundries. For reasons including costs and scale—and, in some cases, export controls—these players traditionally have been reluctant to invest in cutting-edge technologies, always lagging three or four years behind the industry leaders. But the performance gap is shrinking. As global players such as Samsung, Taiwan Semiconductor Manufacturing Company, and Texas Instruments set up shop in China, leading local foundries such as Shanghai Huali Microelectronics Corporation, SMIC, and XMC are poised to benefit from the development of a true technology cluster. At the same time, fewer and fewer chip designs will be moving to technologies that are 20 nanometers and below; following Moore’s law is becoming too expensive and is of limited benefit to all but a small set of global semiconductor companies. As a result, low-cost, lagging-edge Chinese technology companies will soon be able to address a larger part of the global market.


China released the high-level framework for its new national semiconductor policy in June 2014; the details and the long-term effects of its new approach to developing the semiconductor industry in China remain to be seen. Will it lead to a world-class semiconductor industry, or will Chinese semiconductor companies continue to lag behind global players? Three medium-term effects seem likely.


China’s strong desire for national champions may further tilt the system in favor of local players. According to industry estimates, Chinese original-equipment manufacturers will design more than half of the world’s phones in 2015.1 Under the national-champions model, they may be encouraged to take advantage of domestic suppliers’ low-cost strategies and strong local technical support. Additionally, in the wake of global data-privacy and security concerns, there has been even more of a push from the Chinese government for state-owned and private enterprises to purchase from local system suppliers (that, in turn, are more likely to source from local semiconductor vendors).


Mainland China represents a huge opportunity for semiconductor manufacturers and equipment and materials suppliers. More information is available in our updated market research report: Mainland China’s Semiconductor and Equipment Markets: A Complete Analysis of the Technical, Economic, and Political Issues.


 


 


 


 



Semiconductor Industry and Equipment Markets in China