Global Battery Chargers Market Report

ELECTRONICS.CA PUBLICATIONS announces the availability of a comprehensive global report on Battery Chargers markets. Global market for Battery Chargers is projected to reach US$16 billion by 2020, driven by the growing demand for battery-powered electronic devices and equipment.

As an indispensable accessory for all types of electronic devices and equipment, battery chargers are expected to witness steady demand in line with the trends in the electronics industry. Rising energy storage needs of a wide range of electronic devices used in major end-use markets including automotive, industrial, information technology, telecommunications, and consumer electronics is driving growth in the battery chargers market. Telecommunications represents the largest end-use market for battery chargers. Explosive growth in digital technology and the need to share and acquire information swiftly is boosting demand for compact, computing devices, thereby spurring demand for battery chargers. Increasing sales of smartphones, tablets, laptops, and notebooks which require batteries to function smoothly is expected to boost growth in the market.

The emergence of new classes of batteries with different materials is giving rise to increased demand for sophisticated charging mechanisms, to improve charging speed and ensure safety. With technology advancements infusing a broader range of functional characteristics into smaller and lighter formats, battery chargers market is witnessing continuous flow of new designs with efficient charge circuitry and safe charging techniques that prevent overvoltage, and protect battery and system during charging. Advanced products such as smart chargers and wireless chargers are expected to witness rapid growth driven by the growing mobility needs of modern-day consumers. Growing environmental awareness and voluntary stewardship is helping spur demand for green battery chargers powered by wind and solar energy.

As stated by the new market research report on the United States represents the largest market worldwide. Asia-Pacific ranks as the fastest growing market with a CAGR of 7.5% over the analysis period. Rising standards of living, huge population base, and adoption of mobile phones and electric vehicles represent key growth drivers in the region. In addition to India and China, demand for battery chargers in the region is high in countries such as Australia, Singapore, the Philippines, Malaysia, and Thailand, among others.

Major players covered in the report include Accutronics Limited, Analytic Systems Ware Ltd., Anoma Corp., Best Wisdom Electronics Co. Ltd., Energizer Holdings Inc., Exide Technologies, Ferro Magnetics Corporation, Flextronics, FRIWO AG, HindlePower Inc., Minwa Electronics Co. Ltd., Motor Appliance Corporation, Panasonic Corporation of North America, Phihong USA Corporation, Powerbase Industrial (HK) Ltd., Saft S.A., Salcomp Plc, Schumacher Electric Corporation, Scud (Fujian) Electronics Co. Ltd., Uniross Batteries S.A.S, and Yuasa Battery Inc.

The research report titled “Battery Chargers – Global Strategic Business Report” provides a comprehensive review of market trends, issues, drivers, mergers, acquisitions and other strategic industry activities of major companies worldwide. The report provides market estimates and projections for all major geographic markets including the US, Canada, Japan, Europe (France, Germany, Italy, UK, Spain, Russia, and Rest of Europe), Asia-Pacific (China, India, and Rest of Asia-Pacific), Latin America (Brazil and Rest of Latin America) and Rest of World. End-use sectors analyzed include Automotive, Industrial, Information Technology, Telecommunications and Consumer Products.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: Battery Chargers – Global Strategic Business Report.

Global Battery Chargers Market Report

Global Market for Fingerprint Sensors in Mobile Devices

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Fingerprint Sensors in Smart Mobile Devices”.  Research Capsule group expects fingerprint sensors to join the cast of now ubiquitous smartphone sensors though market penetration will vary by device. With more than 10 billion smartphones and tablets expected to be shipped during the coming five years, related component volumes are expected to soar.

2014 was a watershed year for fingerprint sensors in smartphones. Apple’s iPhone 6 coupled with the company’s new mobile payment service with a touch-type fingerprint sensor is creating a wow effect among consumers. The use of biometrics for authorizing financial transactions has a futuristic appeal and an allure of improved security and convenience.

Apple’s competitors have reacted quickly to match Apple’s sudden mobile payment lead. Samsung, for example, recently unveiled its own payment service coupled with a touch fingerprint sensor for authentication. It was an expected move, and the company’s use of a magnetic-stripe compatible technology could give Samsung the volume lead. Now other smart device vendors are expected to introduce a similar set of features in their next iteration of flagship phones.

This new report examines current and planned usage of fingerprint sensors in smartphones and tablets and forecasts implementations to 2019. The report coverage includes the market breakdown by touch and swipe sensors, and sales volumes and revenues by region: North America, Western Europe, Eastern Europe, Asia Pacific, Middle East & Africa, and Latin America.

The global market for fingerprint sensors in mobile devices is expected to become a multi-billion dollar market by 2019. While North America has been the key driver of fingerprint sensor adoption during the early years, adoption in the APAC region is expected to take the lead in 2015. Globally, the inclusion of fingerprint sensors in smartphones is reaching a critical mass driving it to become a mainstream smartphone feature in many markets. Research Capsule forecasts that 50% of smartphones sold in 2019 will have a fingerprint sensor.

Research Capsule believes that mobile payment will continue to be the primary driver for fingerprint sensors with the number of use cases expanding during the coming years. The volumes will be significant and though there are currently only a limited number of component vendors supplying the sensors, the flurry of activity is attracting both startups and established telecomm players to cater to this hot market.

Qualcomm’s recent introduction of its Snapdragon Sense ID ultrasonic-based fingerprint sensor could be a substantial disruptor to current component suppliers. The company’s wide industry footprint and relationship with most major smartphone vendors could propel it to a leadership position just as the market is reaching mainstream. Qualcomm’s entry into the fingerprint market was expected after it acquired Ultra-Scan several years back, but the demonstrations recently given at Mobile World Congress were impressive and shipments could happen sooner than expected. Other key competitors discussed in the report include AuthenTec, CrucialTec, Fingerprint Cards, IDEX, Next Biometrics Group, Validity Sensors, and Vkansee Technology.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: “Fingerprint Sensors in Smart Mobile Devices“.

Global Market for Fingerprint Sensors in Mobile Devices

Image Sensor Market is Expected to Grow at a CAGR of 8.06% from 2014 to 2020

Image sensor is a vital part of any imaging device that converts the optical information into electrical signals. In 1960s, image sensors have gone through several technological advancements due to the continuous demand in the market for higher resolution, smaller form factor and lower power consumption.

Image sensors are being widely used in consumer sector like for digital cameras, mobile phones, tablet PC camcorders and so on. Other application area for image sensor is medical diagnosis, fault detection, visual feedback to controller, surveillance, infotainment, and entertainment since decades. Technology is never constant. Earlier, analog film based sensors and phosphor plates were used. The digitization of imaging technologies resulted in emergence of technologies such as, CCD and CMOS.

Currently, automotive and security are few sector where implementation of cameras has recently increased when compared with the earlier days. Implementation of ADAS (Advanced Driver Assistance Systems) is expected to boost the demand for cameras which leads to the higher demand for image sensor. According to estimation, more than 10 cameras may be implemented in a vehicle under ADAS. Growing awareness of security has also fueled the growth of cameras with special features such as; infrared enabled camera, ability to take picture even in low light. This has helped in the growth of image sensor market.

The figure below shows the estimated growth of the image sensor market from 2013 to 2020.

The image sensor market is expected to grow at a CAGR of 8.06% from 2014 to 2020. In the report, the driver, restraints, and opportunities for the market are covered. The major driving factors are increased demand for camera enabled mobile phones, digital cameras, tablets PC, implementation of machine vision, increased adoption of ADAS (Advanced Driver Assistance Systems) systems in vehicles, increased awareness about security. High power consumption by CCD image sensor is considered as the major restraining factor in the development of market.

The players involved in the development of image sensor include Aptina Imaging Corporation (U.S.), Canon Inc. (Japan), CMOSIS (Belgium), OmniVision Technologies, Inc. (U.S.), ON Semiconductor (U.S.), Samsung Group (South Korea), Sony Corporation (Japan), STMicroelectronics N.V. (Switzerland), Teledyne DALSA (Canada), and Toshiba Corporation (Japan).

Geographically, the image sensor market is segmented into North America (the U.S., Canada, & Mexico), Europe (Germany, UK, Sweden, the Netherland, & France), APAC (China, India, & Japan), and Rest of the World (the Middle East, South America, & Africa). The APAC market accounts for the highest market size of 38.30% and is estimated to grow at a CAGR of 10.15% from 2014 to 2020. RoW (Rest of the World) is also expected to grow at a significant CAGR of 9.75% from 2014 to 2020; this is mainly due to the fact that telecommunication infrastructure is improving in these region which is then translated to higher demand for camera enabled mobile phone and thus, will boost the demand for image sensor.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: Image Sensor Market by Technology (CMOS, CCD), Spectrum, Array, Scanning Method, Application and by Geography – Analysis and Forecast 2013 – 2020.

 

Image Sensor Market is Expected to Grow at a CAGR of 8.06% from 2014 to 2020

Magnetic Field Sensors Market Analysis

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Magnetic Field Sensors Market by Type, Technology, Applications and Geography – Forecasts & Analysis to 2013 – 2020″. The market size of the magnetic field sensors market is expected to grow from the $1.6 Billion that it accounted for in 2013 to $2.9 Billion by 2020, at an estimated CAGR of 8.04% from 2014 to 2020. The volume of the magnetic sensors is currently estimated to be 5.9 billion units and is expected to rise up to 9.6 billion units at an estimated CAGR of 6.75% from 2014 to 2020.

A magnetic field sensor identifies the position of an object on the basis of a magnetic field. This is built up either by an external permanent magnet or by a magnet integrated in the sensor. For example, movements of gear wheels or approximation of objects result in alterations inthe magnetic field. These changes are detected by the sensor and evaluated by the integrated electronics. Depending on the sensor type, the output signal may be digital or analog.Magnetic sensors are non-contact electronic sensors. They detect magnetic fields or their alteration by ferromagnetic objects.

There are many approaches towards magnetic sensing, which include Hall effect sensors, AMR magnetic sensors, GMR magnetic sensors, tunnel magnetoresistance sensors, nuclear precession magnetic field sensors, optically pumped magnetic field sensors, fluxgate magnetometer, search coil magnetic field sensors, and SQUID magnetic field sensors. MEMS-based magnetic field sensors can offer small-size solution for magnetic field sensing. Smaller device can be placed closer to the measurement spots, thereby achieving higher spatial resolution. Additionally, MEMS magnetic field sensor does not involve the micro fabrication of magnetic material. Therefore, the cost of the sensor can be largely reduced. Integration of MEMS magnetic field sensor can further reduce the size of the entire magnetic field sensing system.

New developments in the automobile infotainment systems will also increase the demand of the magnetic field sensors.The largestapplications of the magnetic field sensors in the automobile sectorare found in theAnti-Lock BrakingSystems (ABS) and engine control management systems, which are gaining popularity in the emerging markets.

This report covers the vital driving and restraining factors for this market. Encouraging government legislations and policies foreco friendly vehicles, increase in the need of efficient products, and rise in the applications of magnetic sensors in the automobiles and consumer electronics are acting as the driving factors for this industry. However, there are few factors, which are acting as obstacles in the growth of the magnetic sensor market. These factors are inconsistency of a magnetic body, distortional variation, temperature fluctuations, and low resistance in magnetic field detection. Unavailability of aftermarket is a strong restraint for the magnetic field sensor market.

The worldwide market of the magnetic field sensors is segmented into North America, Europe, APAC, and RoW. APAC is the leading geography in this market due to the supporting factors present in the APAC region; such assupportive government policies, increasing demand for automobiles and smart phones in this region,and presence of key industry players. However, North America which is another vital market is expected to show a significant growth in the coming years due to revised government policies and expansion of the magnetic sensorsbusiness in this region, by players such as Honeywell International (U.S.) and Allegro MicroSystems Inc. (U.S.).

This report profiles the major companies which have beencontributing significantlyin this market; these include Allegro MicroSystems Inc. (U.S.), Infineon (Germany), Asahi Kasei Microdevices Corporation (Japan), Austria microsystems AG (Germany), Honeywell International (U.S.), Robert Bosch GmbH (Germany), MEMSIC Inc. (U.S.), Melexis Microelectronic Systems (Belgium), Micronas Semiconductor (Switzerland), and NXP Semiconductors (The Netherlands).

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: Magnetic Field Sensors Market by Type, Technology, Applications and Geography – Forecasts & Analysis to 2013 – 2020.

Magnetic Field Sensors Market Analysis

Electronics Assembly IPC Standards Collection

It takes a lot to be successful in electronics assembly. Get the reference documents you need on all aspects of the job from solder materials, component characteristics, manufacturing and quality requirements, and acceptability of the final assembly. Includes 41 key documents for SMT and through-hole assembly, including the widely used IPC-A-610, J-STD-001 and IPC-A-620.  Get the complete IPC standards collection and save 55% on individual document prices. Users can also purchase and download IPC standards from Electronics.ca Publications by following IPC specs below.

Electronics Assembly IPC Standards Collection Includes

IPC 2611 Generic Requirements for Electronic Product Documentation
IPC 2612-2 Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descript
IPC 2612-1 Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC 3406 Guidelines for Electrically Conductive Surface Mount Adhesives
IPC 3408 General Requirements for Anisotropically Conductive Adhesives Films
IPC 7095C Design and Assembly Process Implementation for BGAs
IPC 7351B Generic Requirements for Surface Mount Design and Land Pattern Standard
IPC 9202 Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemic
IPC 9203 Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC 9701A Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
IPC 9702 IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects
IPC 9703 IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
IPC 9704A Printed Circuit Assembly Strain Gage Test Guideline
IPC 9706 Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder
IPC 9707 Spherical Bend Test Method for Characterization of Board Level Interconnects
IPC 9708 Test Methods for Characterization of Printed Board Assembly Pad Cratering
IPC 9709 Test Guidelines for Acoustic Emission Measurement during Mechanical Testing
IPC A-610F Acceptability of Electronics Assembly
IPC A-620B IPC/WHMA-A-620B Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC C-406 Design & Application Guidelines for Surface Mount Connectors
IPC CA-821 General Requirements for Thermally Conductive Adhesives
IPC CC-830B Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
IPC CM-770E Component Mounting Guidelines for Printed Boards
IPC D-326A Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies
IPC FC-234A Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards
IPC HDBK-001E Handbook and Guide to Supplement J-STD-001
IPC HDBK-005 Guide to Solder Paste Assessment
IPC JP002 JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies
IPC J-STD-002D EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
IPC J-STD-003C-WAM1 Solderability Tests for Printed Boards
IPC J-STD-004B Requirements for Soldering Fluxes
IPC J-STD-005A Requirements for Soldering Pastes
IPC J-STD-006C Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders
IPC J-STD-020D-1 IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surf
IPC J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size Configurations
IPC J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps
IPC J-STD-030A Selection and Application of Board Level Underfill Materials
IPC J-STD-033C-1 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Device
IPC J-STD-075 Classification of Non-IC Electronic Components for Assembly Processes
IPC MC-790 Guidelines for Multichip Module Technology Utilization
IPC S-816 SMT Process Guideline & Checklist
IPC SM-780 Component Packaging & Interconnecting with Emphasis on Surface Mounting
IPC SM-784 Guidelines for Chip-on-Board Technology Implementation
IPC SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Attachments
IPC SM-817 General Requirements for Dielectric Surface Mounting Adhesives
IPC SM-817A General Requirements for Dielectric Surface Mount Adhesives
IPC T-50K Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC TR-001 An Introduction to Tape Automated Bonding Fine Pitch Technology

Electronics Assembly IPC Standards Collection

IPC Working Group Focuses on Nuances of Conformal Coating

As products get smaller and denser, factors that used to be fairly easy to deal with can become areas of concern. Conformal coatings are getting increased interest now as usage grows and the quality of coatings comes under more scrutiny.

These coatings have typically been applied and examined using a range of related standards. For example, IPC-CC-830 addresses some basic testing of materials properties, while IPC J-STD-001 and IPC-A-610 define how a cured film should look.

A new IPC working group, 5-33awg, Conformal Coating Requirements Working Group, was formed to leverage the considerable amount of coating experience of the 5-33c IPC Conformal Coating Handbook Task Group, and focus on areas not covered by existing specifications. Among their areas of interest are the differences in the ways that an aerospace OEM might test coatings for NASA for outer space, or for the FAA’s tests on humidity condensation. Testing automotive OEM coatings in a damp heat environment is another area being examined.

5-33awg is working to develop criteria for conformal coating application and evaluation. Its goal is to come up with methods that allow a user of conformal coating to determine how conformal coating performs in particular end-use environments.

Learn more about conformal coatings market and  IPC Standards that provide informed perspective and relevant analysis of emergent technologies.

 

 

IPC Working Group Focuses on Nuances of Conformal Coating

Global Sale of Hybrid and Pure Electric Cars Will Triple to $178.9 Billion in 2024

E-cars are oversupplied and changing in all respects but in this frenzy of birth and death the future is being created with hybrid cars rapidly gaining market share now and sale of pure electric cars likely to take off in the second half of the coming decade as certain technical and cost challenges are resolved. Toyota and Tesla have hugely benefited from correct market positioning but now Toyota is betting strongly on fuel cell hybrids and Tesla on mainstream pure electric cars – both graveyards for many companies in the past. A vicious shakeout of car and battery manufacturers has commenced with the winners expecting riches beyond the dreams of avarice.

New models of hybrid car from 2010-2014, one of the leading indicators of future hybrid car sales

 

New research finds that the global sale of hybrid and pure electric cars will triple to $178.9 billion in 2024 as they are transformed in most respects. For example, components are becoming integrated, the range extender as an optional extra breaks down the difference between pure electric and hybrid and car manufacturers vertically integrate and collaborate, competing with their suppliers.

Contents include homologated cars and car-like vehicles and their very different technology and global appeal. Many interviews are woven into the text as appropriate, with the outcome being forecasts 2014-2024 for number, cost and market value of the different types of car and technology roadmaps.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: Hybrid and Pure Electric Cars 2014-2024: Technologies, Markets, Forecasts.

 Hybrid and Pure Electric Cars Market Information includes:

1.1. The top electric vehicles manufacturers by ex factory gross sales value taken from the IDTechEx Electric Vehicle Market Portal (figures in US$ billion 2014)

1.2. Global sales of electric, homologated, on-road cars number thousands 2014-2025, rounded

1.3. Global sales of electric cars ex factory unit price in thousands of dollars, 2014-2025, rounded

1.4. Value of the hybrid, pure electric and total electric car market in billions of dollars 2014-2025, rounded

1.5. Global sales of electric cars total value in billions of dollars 2014-2025, rounded

1.6. IDTechEx projection for global hybrid car sales (percentage) by territory 2015-2025

1.7. MicroEV quadricycle numbers (thousand) 2014-2025

1.8. MicroEV quadricycle unit price (US$ thousand) 2014-2025

1.9. MicroEV quadricycle market value (US$ billion) 2014-2025

1.10. Global sales of electric golf cars in number thousands, ex factory unit price in thousands of dollars and total value in billions of dollars 2014-2025, rounded

1.11. Battery collaborations of selected companies

1.12. Examples of traditional limitations and market trends by type of basic design of traction motor Those used mainly on large vehicles but are also seen in cars shown in green. Those on smaller vehicles and high performance vehicles

2.1. European Green Car Initiative approximate R&D budget 2010 to 2013 in millions of Euros

2.2. Over 80 examples of manufacturers and intending manufacturers of electric cars and car-like MicroEVs

3.1. Tesla sales since its launch by country.

3.2. Current performance of EVs

3.3. Performance of Selected Electric Vehicles

3.4. 15 examples of golf EV manufacturers

4.1. Objectives of the Ricardo QinetiQ diesel hybrid vs the Prius gasoline hybrid

4.2. Toyota Prius Sales by region 1997-2008 in thousands of units

4.3. Hybrid electric vehicles and associated events 1876-2015

4.4. Examples of 2015 hybrid car launches

5.1. Fuel Cell partnerships

5.2. Planned Deployment of Electric 3 wheelers in India Bajaj/USAID

6.1. 143 manufacturers and putative manufacturers of lithium-based rechargeable batteries with country, cathode and anode chemistry, electrolyte morphology, case type, applicational priorities and customer relationships, if any, in sel

8.1. Three generations of range extender with examples of construction, manufacturer and power output

9.1. Overview of sales (unit/a) by regions

9.2. List of manufacturer and fuel cell cars

10.1. Global sales of electric, homologated, on-road cars number thousands 2014-2025, rounded

10.2. Global sales of electric cars ex factory unit price in thousands of dollars, 2014-2025, rounded

10.3. Value of the hybrid, pure electric and total electric car market in billions of dollars 2014-2025, rounded

10.4. Global sales of electric cars total value in billions of dollars 2014-2025, rounded

10.5. IDTechEx projection for global hybrid car sales (percentage) by territory 2015-2025

10.6. MicroEV quadricycle numbers (thousand) 2014-2025

10.7. MicroEV quadricycle unit price (US$ thousand) 2014-2025

10.8. MicroEV quadricycle market value (US$ billion) 2014-2025

10.9. Global sales of electric golf cars in number thousands, ex factory unit price in thousands of dollars and total value in billions of dollars 2014-2025, rounded

 

Global Sale of Hybrid and Pure Electric Cars Will Triple to $178.9 Billion in 2024

CMP Consumables Market Resumes Sustainable Growth

The global CMP consumables market has resumed its growth trajectory prior to the 2008-2009 recession. At over $2.0B, 2013 CMP slurry and pad revenues are up 6.0% over 2012, and 2014 is projected to be up an additional 2.2%, according to a new report  “CMP Consumables 2014 – A Critical Materials Report“.  By 2019, the combined CMP pad and slurry market is expected to grow to $2.5B for a CAGR of 3.9% over this period.

The overall slurry market share of Cabot Microelectronics, the historical market leader, is estimated to be stable at just over 36% globally. Aside from Cabot, market ranking can be identified only in the context of a specific process application, as each segment functions as an independent market. This results in a highly fragmented slurry market with over a dozen suppliers, each with a significant market share in at least one process area. The pad market is still led by Dow Chemical with about two-thirds share globally. Cabot Microelectronics remains the only supplier clearly in the Tier 2 pad group with an estimated 9-10% share compared to 1-5% each for six others.

New product development continues to dominate the R&D budgets of slurry manufacturers as new device structures and material set combinations move into high volume chip manufacturing, including CMP processes related to FinFET and high-κ metal gate technologies. Defect reduction requirements and tighter specs on removal uniformity continue their relentless march to planarization perfection in order to satisfy the demands of device manufacturing below 20nm.

The 2014 CMP Consumables Report includes supply chain segments on Slurries and Abrasives; Pads; Slurry Filters; Pad Conditioners; Post-CMP Cleaning Chemicals; PVA Brushes; Equipment; Retaining Rings; and Support Services. Reports on Process Flows, University Research and a CMP retrospective comprise the remaining three segments. Each section, including the popular Slurry and Pad reports, can be purchased separately, with a discount for purchase of the entire set:

 

 

 

CMP Consumables Market Resumes Sustainable Growth

Flexible, Organic and Printed Electronics Market Forecast

New market research report, entitled Printed, Organic & Flexible Electronics: Forecasts, Players & Opportunities, provides the most comprehensive view of the topic, giving detailed ten year forecasts by device type. The market is analyzed by territory, printed vs non printed, rigid vs flexible, inorganic vs organic, cost of materials vs process cost and much more, with over 160 tables and figures. Activities of over 1,000 leading companies are given, as is assessment of the winners and losers to come.

The total market for Flexible, Organic and printed electronics will be worth over $70 billion by 2024. The majority of that is OLEDs (organic but not printed) and conductive ink used for a wide range of applications. On the other hand, stretchable electronics, logic and memory, thin film sensors are much smaller segments but with huge growth potential as they emerge from R&D.

Flexible, organic and printed electronics market forecast by component type in US$ billions*

Source: IDTechEx * For the full forecast data please purchase this report

The following components are assessed, and for each one ten year forecasts are given, along with companies and their activities, case studies, impediments to commercialization and timescales:

• Logic and memory


• OLED displays


• OLED lighting


• Electrophoretic and other bistable displays


• Electrochromic displays


• Electroluminescent displays


• Other displays


• Thin film batteries


• Photovoltaics


• Sensors


• Conductors


• Other

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If you are looking to understand the big picture, the opportunity, the problems you can address, or how you can start to use these technologies and the implications involved, this report is a must.  Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site: Printed, Organic & Flexible Electronics: Forecasts, Players & Opportunities

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Partial list of tables:

 1. Description and analysis of the main technology components of printed and potentially printed electronics

1.2. Current opportunity, market size and profitability

1.3. Market forecast by component type for 2015-2025 in US $ billions, for printed and potentially printed electronics including organic, inorganic and composites

1.4. The different states of readiness of organic and inorganic electronic technologies (semiconductors and conductors)

1.5. Spend on organic versus inorganic materials 2015-2025 US$ billion

1.6. Split of material types by component

1.7. Market value $ billions of only printed electronics 2015-2025

1.8. Total market value of printed versus non-printed electronics 2015-2025 US$ billion

1.9. Market value $ billions of only flexible/conformal electronics 2015-2025

1.10. Total market value of flexible/conformal versus rigid electronics 2015-2025 in US$ billion

1.11. The market for printed and potentially printed electronics by territory in $ billion 2015-2025

1.12. Possible breakdown of the market for printed and potentially printed electronics in 2035 by numbers and value

1.13. Success and failures

2.1. Market forecasts for 2035 in US$ billion

2.2. End user markets relevant to printed electronics

2.3. Leading market drivers 2025

2.4. Some potential benefits of printed and partly printed organic and inorganic electronics and electrics over conventional devices and non-electronic printing in various applications

2.5. Types of printed/thin film photovoltaics beyond silicon compared, with examples of suppliers

2.6. Primary assumptions of organic electronics in full production 2013-2035

3.1. Global market for printed electronics logic and memory 2015-2025 in billions of dollars, with % printed and % flexible

Flexible, Organic and Printed Electronics Market Forecast

Global Sale of Hybrid and Pure Electric Cars Will Triple to $178.9 Billion in 2024

E-cars are oversupplied and changing in all respects but in this frenzy of birth and death the future is being created with hybrid cars rapidly gaining market share now and sale of pure electric cars likely to take off in the second half of the coming decade as certain technical and cost challenges are resolved. Toyota and Tesla have hugely benefited from correct market positioning but now Toyota is betting strongly on fuel cell hybrids and Tesla on mainstream pure electric cars – both graveyards for many companies in the past. A vicious shakeout of car and battery manufacturers has commenced with the winners expecting riches beyond the dreams of avarice.

New models of hybrid car from 2010-2014, one of the leading indicators of future hybrid car sales

 

New research finds that the global sale of hybrid and pure electric cars will triple to $178.9 billion in 2024 as they are transformed in most respects. For example, components are becoming integrated, the range extender as an optional extra breaks down the difference between pure electric and hybrid and car manufacturers vertically integrate and collaborate, competing with their suppliers.

Contents include homologated cars and car-like vehicles and their very different technology and global appeal. Many interviews are woven into the text as appropriate, with the outcome being forecasts 2014-2024 for number, cost and market value of the different types of car and technology roadmaps.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: Hybrid and Pure Electric Cars 2014-2024: Technologies, Markets, Forecasts.

 Hybrid and Pure Electric Cars Market Information includes:

1.1. The top electric vehicles manufacturers by ex factory gross sales value taken from the IDTechEx Electric Vehicle Market Portal (figures in US$ billion 2014)

1.2. Global sales of electric, homologated, on-road cars number thousands 2014-2025, rounded

1.3. Global sales of electric cars ex factory unit price in thousands of dollars, 2014-2025, rounded

1.4. Value of the hybrid, pure electric and total electric car market in billions of dollars 2014-2025, rounded

1.5. Global sales of electric cars total value in billions of dollars 2014-2025, rounded

1.6. IDTechEx projection for global hybrid car sales (percentage) by territory 2015-2025

1.7. MicroEV quadricycle numbers (thousand) 2014-2025

1.8. MicroEV quadricycle unit price (US$ thousand) 2014-2025

1.9. MicroEV quadricycle market value (US$ billion) 2014-2025

1.10. Global sales of electric golf cars in number thousands, ex factory unit price in thousands of dollars and total value in billions of dollars 2014-2025, rounded

1.11. Battery collaborations of selected companies

1.12. Examples of traditional limitations and market trends by type of basic design of traction motor Those used mainly on large vehicles but are also seen in cars shown in green. Those on smaller vehicles and high performance vehicles

2.1. European Green Car Initiative approximate R&D budget 2010 to 2013 in millions of Euros

2.2. Over 80 examples of manufacturers and intending manufacturers of electric cars and car-like MicroEVs

3.1. Tesla sales since its launch by country.

3.2. Current performance of EVs

3.3. Performance of Selected Electric Vehicles

3.4. 15 examples of golf EV manufacturers

4.1. Objectives of the Ricardo QinetiQ diesel hybrid vs the Prius gasoline hybrid

4.2. Toyota Prius Sales by region 1997-2008 in thousands of units

4.3. Hybrid electric vehicles and associated events 1876-2015

4.4. Examples of 2015 hybrid car launches

5.1. Fuel Cell partnerships

5.2. Planned Deployment of Electric 3 wheelers in India Bajaj/USAID

6.1. 143 manufacturers and putative manufacturers of lithium-based rechargeable batteries with country, cathode and anode chemistry, electrolyte morphology, case type, applicational priorities and customer relationships, if any, in sel

8.1. Three generations of range extender with examples of construction, manufacturer and power output

9.1. Overview of sales (unit/a) by regions

9.2. List of manufacturer and fuel cell cars

10.1. Global sales of electric, homologated, on-road cars number thousands 2014-2025, rounded

10.2. Global sales of electric cars ex factory unit price in thousands of dollars, 2014-2025, rounded

10.3. Value of the hybrid, pure electric and total electric car market in billions of dollars 2014-2025, rounded

10.4. Global sales of electric cars total value in billions of dollars 2014-2025, rounded

10.5. IDTechEx projection for global hybrid car sales (percentage) by territory 2015-2025

10.6. MicroEV quadricycle numbers (thousand) 2014-2025

10.7. MicroEV quadricycle unit price (US$ thousand) 2014-2025

10.8. MicroEV quadricycle market value (US$ billion) 2014-2025

10.9. Global sales of electric golf cars in number thousands, ex factory unit price in thousands of dollars and total value in billions of dollars 2014-2025, rounded

 

Global Sale of Hybrid and Pure Electric Cars Will Triple to $178.9 Billion in 2024

5G Wireless Ecosystem Research and Trial Investments to Reach $5 Billion by 2020

While LTE and LTE-Advanced deployments are still underway, wireless carriers and vendors have already embarked on R&D initiatives to develop so-called “5G” technology, with a vision of commercialization by 2020.

5G is essentially a revolutionary paradigm shift in wireless networking to support the throughput, latency, and scalability requirements of future use cases such as extreme bandwidth augmented reality applications and connectivity management for billions of M2M (Machine to Machine) devices.

Although 5G is yet to be standardized, some of the collectively accepted attributes of the technology include new air interface transmission schemes, new spectrum bands, spectrum aggregation, Massive MIMO, beamforming, D2D (Device to Device) communications and self-backhauling, among others.

Key findings:

• Driven by regional, national government, wireless carrier and vendor initiatives, we expect 5G Wireless Ecosystem R&D and trial investments will account for nearly $5 Billion by 2020, following a CAGR of nearly 40% over the next 5 years


• Nearly 70% of these investments will target large scale commercial trial networks in Japan, South Korea and other early pioneering countries


• Despite a lack of standardization, vendors are aggressively investing in 5G development efforts with a principal focus on new transmission schemes, antenna technologies, and higher frequency bands


• 5G networks are expected to utilize a variety of spectrum bands, ranging from established cellular bands to millimeter wave frequencies


• 5G standardization activities are expected to commence between 2015 and 2016

5G Wireless ecosystem research report covers the following topics:

• 5G requirements, use cases & vertical market applications


• 5G market drivers and barriers


• Air interface & antenna technologies: Massive MIMO, waveforms, phased array antennas & beamforming


• Spectrum technologies: Cognitive radio, spectrum sensing, aggregation & LSA (Licensed Shared Access)


• D2D communications & self-backhauling networks


• Complimentary technologies for 5G: NFV (Network Functions Virtualization), SDN (Software Defined Networking), HetNet (Heterogeneous Networking), C-RAN (Cloud RAN), drones & satellites


• Spectrum options for 5G


• Standardization & research initiatives


• Competitive assessment of vendor strategies & commitments to 5G


• 5G investment and subscription forecasts from 2015 till 2025

The “5G Wireless Ecosystem: 2015 – 2025 – Technologies, Applications, Verticals, Strategies & Forecasts” report presents an in-depth assessment of the emerging 5G ecosystem including key market drivers, challenges, enabling technologies, use cases, vertical market applications, spectrum bands, wireless carrier deployment commitments and vendor strategies. The report also presents forecasts for both 5G investments and subscriptions.

The report comes with an associated Excel datasheet suite covering quantitative data from all numeric forecasts presented in the report. Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: “5G Wireless Ecosystem: 2015 – 2025 – Technologies, Applications, Verticals, Strategies & Forecasts”.

 

 

5G Wireless Ecosystem Research and Trial Investments to Reach $5 Billion by 2020

Carbon Nanotube Transparent Conductor Market to Surpass $500 million in 2022

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Markets for Carbon Nanotubes as Transparent Conductors”.  According to this report, conductive coatings (TCs) based on carbon nanotubes (CNTs) will generate almost $300 million in revenues by 2020, rising to more than $0.5 billion by 2022.  However, while suppliers of CNT TCs are currently focusing on the opportunities in touch panels, a bigger opportunity for these materials will be found in thin-film photovoltaics (TFPV) and anti-static coatings.

This report provides an in-depth analysis of the prospects for CNTs in the transparent conductor market.  It shows how these materials currently compare with the main TC alternatives and how this is likely to change in the future.  It also examines how CNT-based materials fit into requirements for TCs in the LCD, OLED display and lighting, e-paper, TFPV, OPV/DSC anti-statics and EMI shielding sectors.

In addition, Carbon Nanotube Transparent Conductor Market Report includes a detailed eight-year forecasts of CNT-based materials in the TC space, with breakouts by application and performance type.  These forecasts are presented both in square meters of coating and by market value.  Finally, the report assesses the changing CNT TC supply chain, profiling both the primary suppliers of the TC material and CNT firms who have targeted the TC space.

Some of the companies discussed in this report include: Brewer Science, CNTouch, Corning, Dow, Foxconn, Huawei, Intel, iTouchWorks, LG, Linde, Mitsui, Nagase America, Samsung, Sang Bo, Sony, TECO, Top Nanosys, Toray, Unidym and Vitsumo.

Carbon Nanotube Transparent Conductor Market

NanoMarkets research group expects CNT TCs to continue their penetration of the touch-screen sensor market.  CNT TCs have considerably lower patterning and deposition costs than ITO, so even if using CNT TCs lead to no substantial reduction in materials costs, touch screen firms may still switch to CNT TCs from ITO.  The business case for CNTs has been enhanced further by the shift to ProCap touch technology since ProCap sensors require a high degree of patterning.  Meanwhile, the new generation of low-performance CNT TCs may find their way into analog resistive touch panels, because of their high resiliency.  Currently, a major drawback of analog-resistive touch screens that currently use ITO is that they tend to wear out after a certain number of touches.

Despite today’s focus of CNT TC makers on the touch market, we believe this market is limited and that gesture recognition will gradually take the place of touch.  The report claims that as the touch market becomes saturated, the best prospects for CNT TC sales will be for TFPV electrodes and for anti-statics. With regard to the former, CIGS makers are seen as being the most receptive to using CNT TCs.  The report also speculates that CNT TCs may find a role in opaque touch surfaces in automobiles and appliances.

Finally, we believe that China is becoming the dominant consumer of TCs as the solar, OLED, touch-screen sensors and display industries increasingly shift to Mainland China.  Given the recent success of several Chinese makers of non-ITO TCs, it is also quite likely that China will play a key role in the alternative TC business – including the supply of CNT TCs.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: “Markets for Carbon Nanotubes as Transparent Conductors“.

 

Carbon Nanotube Transparent Conductor Market to Surpass $500 million in 2022

Trending Terms Covering the Newest Emerging Technologies

What’s relevant for today’s OEM, EMS or ODM Company?

Each year, a new slew of terms and definitions become common place in the manufacturing process. To meet these needs, T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.

PURCHASE IPC T-50M NOW

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

 

IPC T-50M brings over 150 new terms, while eliminating out-of-date terminology in order to provide a streamlined standard that focuses on the trending language of the electronics industry. This revision includes terms often cited in other standards, such as:

• Conformal coating


• Statistical Process Control


• Stencil Design

Stay up to date with the trending terms covering the newest emerging technologies. Prepare for tomorrow’s discussions by purchasing T-50M today.

 

 

Trending Terms Covering the Newest Emerging Technologies

Wireless M2M & IoT Market Opportunities Report

Global spending on wireless M2M technology is expected to reach nearly $200 Billion by the end of 2014. Despite its low ARPU, the wireless M2M market has become a key focus of many mobile network operators as their traditional voice and data markets become saturated. Likewise, government and regulatory initiatives such as the EU initiatives to have a smart meter penetration level of 80% by 2020 and the mandatory inclusion of automotive safety systems such as eCall in all new car models, have also helped to drive overall wireless M2M connections and revenue.

By enabling network connectivity among physical objects, M2M has initiated the vision of the Internet of Things (IoT) – a global network of sensors, equipment, appliances, computing devices, and other objects that can communicate in real time. This gives rise of a multitude of application possibilities including but not limited to location tracking, diagnostics, process automation, remote monitoring/control and even entertainment. Given the vast array of M2M and IoT applications, the industry has attracted attention from a multitude of vertical market segments.

Consequently we expect the wireless M2M market to account for $196 Billion in revenue by the end of 2020, following a CAGR of 21% during the six year period between 2014 and 2020. Eyeing this lucrative opportunity, vendors and service providers across the highly fragmented M2M value chain have become increasing innovative in their strategies and technology offerings which have given rise to a number of submarkets such as M2M network security, Connected Device Platforms (CDP) and M2M application platforms.

The “The Wireless M2M & IoT Bible: 2014 – 2020″ report presents an in-depth assessment of the global wireless M2M market.  In addition to covering the business case, the challenges, the industry’€™s roadmap, value chain analysis, deployment case studies, and the vertical market ecosystem, vendor service/product strategies and strategic recommendations, the report also presents comprehensive forecasts for the wireless M2M market from 2014 till 2020, including an individual assessment of the following submarkets: Network Connectivity, Application Services, Embedded Cellular M2M Modules, Network Security, Connected Device Platforms (CDP), Application Platforms (Application Enablement Platforms, AEP and Application Development Platforms, ADP), Integration Services and Enabling Technologies. The forecasts and historical revenue figures are individually segmented for eight vertical markets, Eight air interface technologies, six geographical regions and 53 countries.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: The Wireless M2M & IoT Bible: 2014-2020 – Opportunities, Challenges, Strategies, Industry Verticals and Forecasts.

 

Wireless M2M & IoT Market Opportunities Report

Image Sensor Market is Expected to Grow at a CAGR of 8.06% from 2014 to 2020

Image sensor is a vital part of any imaging device that converts the optical information into electrical signals. In 1960s, image sensors have gone through several technological advancements due to the continuous demand in the market for higher resolution, smaller form factor and lower power consumption.

Image sensors are being widely used in consumer sector like for digital cameras, mobile phones, tablet PC camcorders and so on. Other application area for image sensor is medical diagnosis, fault detection, visual feedback to controller, surveillance, infotainment, and entertainment since decades. Technology is never constant. Earlier, analog film based sensors and phosphor plates were used. The digitization of imaging technologies resulted in emergence of technologies such as, CCD and CMOS.

Currently, automotive and security are few sector where implementation of cameras has recently increased when compared with the earlier days. Implementation of ADAS (Advanced Driver Assistance Systems) is expected to boost the demand for cameras which leads to the higher demand for image sensor. According to estimation, more than 10 cameras may be implemented in a vehicle under ADAS. Growing awareness of security has also fueled the growth of cameras with special features such as; infrared enabled camera, ability to take picture even in low light. This has helped in the growth of image sensor market.

The figure below shows the estimated growth of the image sensor market from 2013 to 2020.

The image sensor market is expected to grow at a CAGR of 8.06% from 2014 to 2020. In the report, the driver, restraints, and opportunities for the market are covered. The major driving factors are increased demand for camera enabled mobile phones, digital cameras, tablets PC, implementation of machine vision, increased adoption of ADAS (Advanced Driver Assistance Systems) systems in vehicles, increased awareness about security. High power consumption by CCD image sensor is considered as the major restraining factor in the development of market.

The players involved in the development of image sensor include Aptina Imaging Corporation (U.S.), Canon Inc. (Japan), CMOSIS (Belgium), OmniVision Technologies, Inc. (U.S.), ON Semiconductor (U.S.), Samsung Group (South Korea), Sony Corporation (Japan), STMicroelectronics N.V. (Switzerland), Teledyne DALSA (Canada), and Toshiba Corporation (Japan).

Geographically, the image sensor market is segmented into North America (the U.S., Canada, & Mexico), Europe (Germany, UK, Sweden, the Netherland, & France), APAC (China, India, & Japan), and Rest of the World (the Middle East, South America, & Africa). The APAC market accounts for the highest market size of 38.30% and is estimated to grow at a CAGR of 10.15% from 2014 to 2020. RoW (Rest of the World) is also expected to grow at a significant CAGR of 9.75% from 2014 to 2020; this is mainly due to the fact that telecommunication infrastructure is improving in these region which is then translated to higher demand for camera enabled mobile phone and thus, will boost the demand for image sensor.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: Image Sensor Market by Technology (CMOS, CCD), Spectrum, Array, Scanning Method, Application and by Geography – Analysis and Forecast 2013 – 2020.

 

Image Sensor Market is Expected to Grow at a CAGR of 8.06% from 2014 to 2020

IPC Working Group Focuses on Nuances of Conformal Coating

As products get smaller and denser, factors that used to be fairly easy to deal with can become areas of concern. Conformal coatings are getting increased interest now as usage grows and the quality of coatings comes under more scrutiny.

These coatings have typically been applied and examined using a range of related standards. For example, IPC-CC-830 addresses some basic testing of materials properties, while IPC J-STD-001 and IPC-A-610 define how a cured film should look.

A new IPC working group, 5-33awg, Conformal Coating Requirements Working Group, was formed to leverage the considerable amount of coating experience of the 5-33c IPC Conformal Coating Handbook Task Group, and focus on areas not covered by existing specifications. Among their areas of interest are the differences in the ways that an aerospace OEM might test coatings for NASA for outer space, or for the FAA’s tests on humidity condensation. Testing automotive OEM coatings in a damp heat environment is another area being examined.

5-33awg is working to develop criteria for conformal coating application and evaluation. Its goal is to come up with methods that allow a user of conformal coating to determine how conformal coating performs in particular end-use environments.

Learn more about conformal coatings market and  IPC Standards that provide informed perspective and relevant analysis of emergent technologies.

 

 

IPC Working Group Focuses on Nuances of Conformal Coating

Magnetic Field Sensors Market Analysis

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Magnetic Field Sensors Market by Type, Technology, Applications and Geography – Forecasts & Analysis to 2013 – 2020″. The market size of the magnetic field sensors market is expected to grow from the $1.6 Billion that it accounted for in 2013 to $2.9 Billion by 2020, at an estimated CAGR of 8.04% from 2014 to 2020. The volume of the magnetic sensors is currently estimated to be 5.9 billion units and is expected to rise up to 9.6 billion units at an estimated CAGR of 6.75% from 2014 to 2020.

A magnetic field sensor identifies the position of an object on the basis of a magnetic field. This is built up either by an external permanent magnet or by a magnet integrated in the sensor. For example, movements of gear wheels or approximation of objects result in alterations inthe magnetic field. These changes are detected by the sensor and evaluated by the integrated electronics. Depending on the sensor type, the output signal may be digital or analog.Magnetic sensors are non-contact electronic sensors. They detect magnetic fields or their alteration by ferromagnetic objects.

There are many approaches towards magnetic sensing, which include Hall effect sensors, AMR magnetic sensors, GMR magnetic sensors, tunnel magnetoresistance sensors, nuclear precession magnetic field sensors, optically pumped magnetic field sensors, fluxgate magnetometer, search coil magnetic field sensors, and SQUID magnetic field sensors. MEMS-based magnetic field sensors can offer small-size solution for magnetic field sensing. Smaller device can be placed closer to the measurement spots, thereby achieving higher spatial resolution. Additionally, MEMS magnetic field sensor does not involve the micro fabrication of magnetic material. Therefore, the cost of the sensor can be largely reduced. Integration of MEMS magnetic field sensor can further reduce the size of the entire magnetic field sensing system.

New developments in the automobile infotainment systems will also increase the demand of the magnetic field sensors.The largestapplications of the magnetic field sensors in the automobile sectorare found in theAnti-Lock BrakingSystems (ABS) and engine control management systems, which are gaining popularity in the emerging markets.

This report covers the vital driving and restraining factors for this market. Encouraging government legislations and policies foreco friendly vehicles, increase in the need of efficient products, and rise in the applications of magnetic sensors in the automobiles and consumer electronics are acting as the driving factors for this industry. However, there are few factors, which are acting as obstacles in the growth of the magnetic sensor market. These factors are inconsistency of a magnetic body, distortional variation, temperature fluctuations, and low resistance in magnetic field detection. Unavailability of aftermarket is a strong restraint for the magnetic field sensor market.

The worldwide market of the magnetic field sensors is segmented into North America, Europe, APAC, and RoW. APAC is the leading geography in this market due to the supporting factors present in the APAC region; such assupportive government policies, increasing demand for automobiles and smart phones in this region,and presence of key industry players. However, North America which is another vital market is expected to show a significant growth in the coming years due to revised government policies and expansion of the magnetic sensorsbusiness in this region, by players such as Honeywell International (U.S.) and Allegro MicroSystems Inc. (U.S.).

This report profiles the major companies which have beencontributing significantlyin this market; these include Allegro MicroSystems Inc. (U.S.), Infineon (Germany), Asahi Kasei Microdevices Corporation (Japan), Austria microsystems AG (Germany), Honeywell International (U.S.), Robert Bosch GmbH (Germany), MEMSIC Inc. (U.S.), Melexis Microelectronic Systems (Belgium), Micronas Semiconductor (Switzerland), and NXP Semiconductors (The Netherlands).

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: Magnetic Field Sensors Market by Type, Technology, Applications and Geography – Forecasts & Analysis to 2013 – 2020.

Magnetic Field Sensors Market Analysis

IPC Standards For PCB Design and CAD

IPC-7351B Requirements for Surface Mount Design and Land Pattern Standard

IPC-7351B includes both the standard and an IPC-7351B land pattern calculator on CD-ROM for accessing component and land pattern dimensional data. The calculator includes the document’s mathematical algorithms so users can build a land pattern for a corresponding surface mount part quickly and accurately.The tool also allows for modification of dimensional attributes of IPC approved land patterns.

This popular document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs, TSSOPs, QFPs, BGAs, QFNs and SONs. The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select a land pattern based on desired component density.

Revision B now includes land pattern design guidance and rules for component families such as resistor array packages, aluminum electrolytic capacitors, column and land grid arrays, flat lead devices (SOFL and SOTFL) and dual flat no-lead (DFN) devices. The revision also discusses the usage of thermal tabs and provides a new padstack naming convention that addresses the shape and dimensions of lands on different layers of printed boards.Purchasers also receive a 10-day trial of the IPC-7351 Land Pattern Wizard developed by Mentor Graphics, which is an advanced version of the IPC-7351B Land Pattern Calculator. The IPC-7351B Land Pattern Wizard tool enables users to not only save their land patterns within new land pattern library files, but also to instantly export land patterns to their preferred CAD format, such as Allegro, Board Station, Expedition, PADS, CADSTAR, OrCAD, Pantheon and P-CAD. 102 pages. Order and Download IPC Standard 7351B.

IPC-2221B Generic Standard on Printed Board Design

IPC-2221B is the foundation design standard for all documents in the IPC-2220 series and is included i the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer. Among the many updates to Revision B are new criteria for conductor characteristics, surface finishes, via protection, board electrical test, dielectric properties, board housings, thermal stress, compliant pins, panelization and internal and external foil thicknesses. Appendix A provides new test coupon designs used for lot acceptance and quality conformance testing. Order and Download IPC Standard 2221B.

IPC-2220 Set of IPC Standards for PCB Design and CAD

The series is built around the IPC-2221B, Generic Standard on Printed Board Design, the base document that covers all generic requirements for printed board design, regardless of materials. From there, the designer chooses the appropriate sectional standard for a specific technology. IPC-2221B and all five sectional standards are included with the series: IPC-2222A, Sectional Design Standard for Rigid Organic Printed Boards; IPC-2223C, Sectional Design Standard for Flexible Printed Boards; IPC-2224, Sectional Standard for Design of PWBs for PC Cards; IPC-2225, Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies; and IPC-2226, Sectional Design Standard for High Density Interconnect (HDI) Printed Boards. This series provides coverage on material and final finish selection, current carrying capacity and minimum electrical clearances, test specimen design, guidelines for V-groove scoring, dimensioning requirements and conductor thickness requirements. Order and Download IPC 2220 Family of Design Documents.

 

All IPC Standards are available from Electronics.ca Publications

 

IPC Standards For PCB Design and CAD

5G Wireless Ecosystem Research and Trial Investments to Reach $5 Billion by 2020

While LTE and LTE-Advanced deployments are still underway, wireless carriers and vendors have already embarked on R&D initiatives to develop so-called “5G” technology, with a vision of commercialization by 2020.

5G is essentially a revolutionary paradigm shift in wireless networking to support the throughput, latency, and scalability requirements of future use cases such as extreme bandwidth augmented reality applications and connectivity management for billions of M2M (Machine to Machine) devices.

Although 5G is yet to be standardized, some of the collectively accepted attributes of the technology include new air interface transmission schemes, new spectrum bands, spectrum aggregation, Massive MIMO, beamforming, D2D (Device to Device) communications and self-backhauling, among others.

Key findings:

• Driven by regional, national government, wireless carrier and vendor initiatives, we expect 5G Wireless Ecosystem R&D and trial investments will account for nearly $5 Billion by 2020, following a CAGR of nearly 40% over the next 5 years


• Nearly 70% of these investments will target large scale commercial trial networks in Japan, South Korea and other early pioneering countries


• Despite a lack of standardization, vendors are aggressively investing in 5G development efforts with a principal focus on new transmission schemes, antenna technologies, and higher frequency bands


• 5G networks are expected to utilize a variety of spectrum bands, ranging from established cellular bands to millimeter wave frequencies


• 5G standardization activities are expected to commence between 2015 and 2016

5G Wireless ecosystem research report covers the following topics:

• 5G requirements, use cases & vertical market applications


• 5G market drivers and barriers


• Air interface & antenna technologies: Massive MIMO, waveforms, phased array antennas & beamforming


• Spectrum technologies: Cognitive radio, spectrum sensing, aggregation & LSA (Licensed Shared Access)


• D2D communications & self-backhauling networks


• Complimentary technologies for 5G: NFV (Network Functions Virtualization), SDN (Software Defined Networking), HetNet (Heterogeneous Networking), C-RAN (Cloud RAN), drones & satellites


• Spectrum options for 5G


• Standardization & research initiatives


• Competitive assessment of vendor strategies & commitments to 5G


• 5G investment and subscription forecasts from 2015 till 2025

The “5G Wireless Ecosystem: 2015 – 2025 – Technologies, Applications, Verticals, Strategies & Forecasts” report presents an in-depth assessment of the emerging 5G ecosystem including key market drivers, challenges, enabling technologies, use cases, vertical market applications, spectrum bands, wireless carrier deployment commitments and vendor strategies. The report also presents forecasts for both 5G investments and subscriptions.

The report comes with an associated Excel datasheet suite covering quantitative data from all numeric forecasts presented in the report. Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site.  View the report: “5G Wireless Ecosystem: 2015 – 2025 – Technologies, Applications, Verticals, Strategies & Forecasts”.

 

 

5G Wireless Ecosystem Research and Trial Investments to Reach $5 Billion by 2020

Worldwide ROADM Market Will Grow From $5.4 billion in 2015 to $8.8 Billion in 2020

Network Transmission Market Report and Analysis of Proposed Nokia / Alcatel-Lucent Merger

Nokia has recently announced that it is buying French telecom equipment maker Alcatel-Lucent for $16.6 billion. The merger of Nokia and Alcatel-Lucent will no doubt change the competitive landscape of the optical networking industry. A new report provides a quantitative forecast of a major part of the optical networking market that Nokia is buying into from its proposed purchase of Alcatel-Lucent.

According to a new market report “Network Transmission Market Analysis and Equipment Forecast: ROADMS, DWDM, Routers and Switches and the Impact of Net Neutrality”, the worldwide ROADM market will grow from $5.4 billion in 2015 to $8.8 billion in 2020. In addition to the ROADMs market, the report provides detailed analysis and forecasts for DWDM, Routers, and switches in North America and Worldwide.

This report is focused on forecasting demand for specific types of carrier-class network transmission equipment: ROADMS, DWDM, Routers and Switches.

To make that forecast it will investigate the demand parameters of this situation, which are primarily traffic forecasts. After reviewing the regulatory climate (Net Neutrality), and the market demand, the Report will look at capital expenditure forecasts as a surrogate for Supply. Then it will provide forecasts for various classes (ROADMs, DWDM, Routers and Switches) of optical network equipment in this environment.

Network Transmission Market Analysis Provides:

• Equipment descriptions and sales forecasts for ROADMS, DWDM, Routers, and Switches through 2020.


• A discussion of Net Neutrality, the players, the issues, and its impact on equipment sales.


• Traffic forecasts for the North American Internet through 2020


• N.A. and World forecasts for Mobile Traffic, Advanced Access Architecture lines(FiOS, U-Verse, Google), High-Speed lines (XDSL and cable modems) and International Traffic (North America only) through 2020.


• Capital Expenditure forecasts for the major telecom companies through 2020.


• Listing of Major Vendors in the Transmission Equipment space.

This report covers the very current topic of Network Neutrality, which is much in the headlines as this is being written, and its forecasted impact on network equipment sales.

The study also examines the network traffic and, through analysis, shows that traffic from four major sources (AAA lines, H-H lines, Mobile lines and International) is responsible for the vast preponderance of traffic and traffic growth. Forecasts are provided (through 2020) for these classes of traffic and for the Internet as a whole. Based on the information from the traffic forecasts, the uncertainty from regulation (Net Neutrality) and the capital investment plans and forecasts, the Report will then provide equipment sales forecasts (units and dollars) for ROADMs, DWDM, Routers, and Switches (all carrier class) through 2020 for North America and for the World. Detailed descriptions of each type of equipment being forecast is also provided.

 

 

 

Worldwide ROADM Market Will Grow From $5.4 billion in 2015 to $8.8 Billion in 2020

Worldwide Market for Thermal Management Products to Reach $15.56 Billion by 2018

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Electronic Thermal Management – Technologies, Materials, Devices, New Developments, Industry Structure and Global Markets”. According to this study, the worldwide market for thermal management products is predicted to grow from about $8.8 billion in 2013 to $15.56 billion by 2018, at an average annual growth rate (CAGR) of 12.1%.

“Thermal management” denotes the array of problem-solving design tools and material technologies that systems manufacturers apply to regulate the unwanted heat caused by the normal functioning of an electronic system. Increasing power densities and decreasing transistor dimensions are hallmarks of modern computer chips. Both trends are increasing the thermal management challenge within the chip and surrounding packaging, as well as accelerating research progress on high conductivity materials.

Dramatic changes are underway in the computer, telecommunications and consumer electronics industries. There is a trend toward systems “convergence,” combining computer, telecommunications and consumer system functions all into one system. There is also a trend toward micro-miniaturization and microsystem technologies integrating digital, optical, radio frequency and microelectromechanical systems (MEMS) devices. Microsystem packaging is at the heart of all of these products, since it is this technology that provides the system integration in addition to controlling the size, performance, reliability and cost of the final microsystem.

High-density packaging has been the trend in electronic circuits during the last decade, and that will continue for at least the next five years. In 2013, a typical megaprocessor could pack a staggering 41 million transistors onto a single chip. Running flat out, that chip would dissipate 130 watts of heat – more than a bright household light bulb – from an area the size of a postage stamp.

The trend line of the thermal management industry aligns with the developments of technology in the semiconductor, microprocessor and computer industries. For every advance in performance of these systems, there is a corresponding increase in the operating heat generated by the system. To simply say, however, that demands for thermal management products have increased as the requirements of applications have increased, does not do justice to the unique character of this industry. It is probably more accurate to state that the development of thermal management as an industry is the result of a synergy of solutions constantly engineered to manage excess heat in today’s electronic systems.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: Electronic Thermal Management – Technologies, Materials, Devices, New Developments, Industry Structure and Global Markets.

Worldwide Market for Thermal Management Products to Reach $15.56 Billion by 2018

S. Korean and Taiwanese Companies Control 56% of Global 300mm Fab Capacity

Vast majority of that wafer capacity is local to those two countries.

Information in this Research Bulletin comes from the Global Wafer Capacity 2015-2019 Report, which was released this month.  The new report provides great detail regarding the current status and forecast of global wafer fab capacity.  More information found at the end of this bulletin.

South Korean and Taiwanese chip companies are well known for manufacturing prowess when it comes to efficiently fabricating huge amounts of IC wafers.  Most of the IC industry’s biggest fab facilities are located in these two countries.  Because of their fab operation and wafer fabricating expertise, IC companies headquartered in South Korea and Taiwan lead the way in capital-intensive segments of the IC industry such as high-unit-volume products like DRAM and flash memory or foundry services making ICs for companies without fabs and a growing number of companies with fabs.

Figure 1 shows that South Korea-based companies Samsung and SK Hynix currently account for 35% of global 300mm wafer capacity.  Samsung alone controls about 24% of all the world’s 300mm capacity.  When looking at 300mm wafer capacity according to fab location instead of headquarters location, 28% of worldwide capacity is in South Korea.  Samsung and SK Hynix both own big 300mm fabs outside of South Korea.  In fact, SK Hynix’s largest fab is in China.  Samsung also has a 300mm fab in China as well as two in the U.S.

Global 300mm Fab Capacity Report

Figure 1

Taiwanese companies currently manage 21% of the world’s 300mm capacity, with about 85% of that capacity being committed to foundry services.  The remaining 15% of Taiwan-controlled 300mm capacity is mostly used to produce memory devices.  The vast majority of the 300mm wafer capacity in Taiwan is owned by Taiwanese companies, with the only exception being the 300mm capacity that U.S.-based Micron gets from its Inotera joint-venture with Nanya and its wholly owned fab in Taichung acquired in 2013.  There is only one Taiwanese-controlled 300mm fab located outside of Taiwan and that is UMC’s fab in Singapore.

Figure 1 also shows that even though 15% of the world’s 300mm wafer capacity is located in the North America, 28% of global 300mm capacity is controlled by companies with North American headquarters.  Two other noticeable share differences in the comparison are in China and the ROW region, which in this case is essentially just Singapore and Israel.  The vast majority of 300mm wafer capacity in China and ROW is controlled by foreign companies.

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: Global Wafer Capacity 2015-2019.

 

S. Korean and Taiwanese Companies Control 56% of Global 300mm Fab Capacity

Flexible, Organic and Printed Electronics Market Forecast

New market research report, entitled Printed, Organic & Flexible Electronics: Forecasts, Players & Opportunities, provides the most comprehensive view of the topic, giving detailed ten year forecasts by device type. The market is analyzed by territory, printed vs non printed, rigid vs flexible, inorganic vs organic, cost of materials vs process cost and much more, with over 160 tables and figures. Activities of over 1,000 leading companies are given, as is assessment of the winners and losers to come.

The total market for Flexible, Organic and printed electronics will be worth over $70 billion by 2024. The majority of that is OLEDs (organic but not printed) and conductive ink used for a wide range of applications. On the other hand, stretchable electronics, logic and memory, thin film sensors are much smaller segments but with huge growth potential as they emerge from R&D.

Flexible, organic and printed electronics market forecast by component type in US$ billions*

Source: IDTechEx * For the full forecast data please purchase this report

The following components are assessed, and for each one ten year forecasts are given, along with companies and their activities, case studies, impediments to commercialization and timescales:

• Logic and memory


• OLED displays


• OLED lighting


• Electrophoretic and other bistable displays


• Electrochromic displays


• Electroluminescent displays


• Other displays


• Thin film batteries


• Photovoltaics


• Sensors


• Conductors


• Other

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If you are looking to understand the big picture, the opportunity, the problems you can address, or how you can start to use these technologies and the implications involved, this report is a must.  Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site: Printed, Organic & Flexible Electronics: Forecasts, Players & Opportunities

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Partial list of tables:

 1. Description and analysis of the main technology components of printed and potentially printed electronics

1.2. Current opportunity, market size and profitability

1.3. Market forecast by component type for 2015-2025 in US $ billions, for printed and potentially printed electronics including organic, inorganic and composites

1.4. The different states of readiness of organic and inorganic electronic technologies (semiconductors and conductors)

1.5. Spend on organic versus inorganic materials 2015-2025 US$ billion

1.6. Split of material types by component

1.7. Market value $ billions of only printed electronics 2015-2025

1.8. Total market value of printed versus non-printed electronics 2015-2025 US$ billion

1.9. Market value $ billions of only flexible/conformal electronics 2015-2025

1.10. Total market value of flexible/conformal versus rigid electronics 2015-2025 in US$ billion

1.11. The market for printed and potentially printed electronics by territory in $ billion 2015-2025

1.12. Possible breakdown of the market for printed and potentially printed electronics in 2035 by numbers and value

1.13. Success and failures

2.1. Market forecasts for 2035 in US$ billion

2.2. End user markets relevant to printed electronics

2.3. Leading market drivers 2025

2.4. Some potential benefits of printed and partly printed organic and inorganic electronics and electrics over conventional devices and non-electronic printing in various applications

2.5. Types of printed/thin film photovoltaics beyond silicon compared, with examples of suppliers

2.6. Primary assumptions of organic electronics in full production 2013-2035

3.1. Global market for printed electronics logic and memory 2015-2025 in billions of dollars, with % printed and % flexible

Flexible, Organic and Printed Electronics Market Forecast